JPH04276640A - Ic package - Google Patents

Abstract

PURPOSE:To eliminate a pad for test use or a through hole for test use which is formed at a mounting board for a test operation executed when a surface- mounting IC has been mounted and to test the contact property of a terminal at the surface-mounting IC with a connecting pad on the side of the mounting board. CONSTITUTION:Pads 13 for test use are formed on the surface of an IC package 1; terminals at semiconductors inside the IC package are connected to the pads 13 for test use by using conductors 12. When the IC package 1 is mounted on a mounting board and an electronic circuit constituted of the IC package and other IC's is tested, a testing jig is brought into contact with the pads 13 for test use. Thereby, a test operation can be performed through two routes by the conductors 12 and by input/output terminals 11.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention relates to an IC package.
In particular, it relates to a surface mount IC package.

0002

2. Description of the Related Art An example of a conventional surface-mount IC package is shown in FIG. The terminals of the semiconductor inside the IC package 2 are
Input/output terminals 21 are exposed only on the surface to be mounted on the mounting board 3. The input/output terminals 21 are soldered to mounting board connection pads 31 made on the mounting board 3, and connected to other ICs through wiring 32 to form an electronic circuit.

When testing this electronic circuit, since it is not possible to directly contact the input/output terminals 21 of the surface mount IC, test pads 33 or test through holes 34 are provided in the wiring 32 of the mounting board 3. There is.

0004

[Problems to be Solved by the Invention] In this conventional surface mount IC package, a test pad or a test through hole is provided on the wiring of the mounting board to conduct a test. It requires a large area on the mounting board, and there is no advantage of miniaturization using surface-mounted ICs.

[0005] Furthermore, since testing of electronic circuits is carried out on pads or through holes on the wiring of the mounting board, there is a drawback that it is not possible to test continuity between the input/output terminals of the surface mount IC and the connection pads of the mounting board. .

[0006]

[Means for Solving the Problems] The IC package of the present invention is a surface mount IC package, and includes a conductor drawn out from a terminal of a semiconductor substrate inside the IC package to an upper surface outside the package sealing, and a conductor provided at the tip of the conductor. It is equipped with a test pad.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a perspective view of one embodiment of the present invention. A test pad 13 is provided on the top surface of the IC package 1,
Conductor 12 connects the terminal of the semiconductor inside the IC package (not shown)
and the test pad 13 are connected.

When the IC package 1 of the present invention is mounted on a mounting board and an electronic circuit composed of other ICs is tested,
By bringing a test jig into contact with the test pad 13 provided on the top surface of the IC package 1, a test can be performed through each of the two paths of the conductor 12 and the input/output terminal 11 of the IC package 1.

0010

[Effects of the Invention] As explained above, the present invention provides a test pad on the top surface of an IC package, thereby eliminating the need to create a test pad or a test through hole on the mounting board side, thereby reducing the size of surface-mounted ICs. You can take advantage of the benefits of

[0011] Furthermore, after mounting the IC on the mounting board, it is possible to perform a connectivity test between the connection pad and the input/output terminal of the IC.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an embodiment of the invention.

FIG. 2 is a perspective view showing an example of a conventional IC package.

[Explanation of symbols]

1, 2 IC package 3,2-2 Mounting board 11, 21 Input/output terminal 12 Conductor 13,33 Test pad 31 Mounting board connection pad 32 Wiring 34 Test through hole

Claims (1)

[Claims] [Claim 1] In a surface mount IC package,
An IC package characterized by comprising a conductor drawn out from a terminal of a semiconductor substrate within the IC package to an upper surface outside the package sealing, and a test pad provided at the tip of the conductor.