JPH04275356A - Antistatic thermoplastic resin composition - Google Patents
Antistatic thermoplastic resin compositionInfo
- Publication number
- JPH04275356A JPH04275356A JP6134291A JP6134291A JPH04275356A JP H04275356 A JPH04275356 A JP H04275356A JP 6134291 A JP6134291 A JP 6134291A JP 6134291 A JP6134291 A JP 6134291A JP H04275356 A JPH04275356 A JP H04275356A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- resin
- weight
- rubber
- pts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 7
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 6
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims abstract description 16
- 229910052783 alkali metal Inorganic materials 0.000 claims abstract description 14
- 229920001971 elastomer Polymers 0.000 claims abstract description 12
- 239000005060 rubber Substances 0.000 claims abstract description 11
- 229920001890 Novodur Polymers 0.000 claims abstract description 8
- -1 alkali metal salt Chemical class 0.000 claims description 23
- 239000000113 methacrylic resin Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 abstract description 21
- 229920005989 resin Polymers 0.000 abstract description 21
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 abstract description 4
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 abstract description 4
- 241001611765 Gamelia abas Species 0.000 abstract 1
- 101100366942 Mus musculus Ston1 gene Proteins 0.000 abstract 1
- 150000001340 alkali metals Chemical class 0.000 abstract 1
- 125000000007 metacrylic acid group Chemical group 0.000 abstract 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 37
- 239000000203 mixture Substances 0.000 description 21
- 229920001577 copolymer Polymers 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 15
- 230000000704 physical effect Effects 0.000 description 14
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 9
- 229920000578 graft copolymer Polymers 0.000 description 8
- 230000000379 polymerizing effect Effects 0.000 description 8
- 239000000047 product Substances 0.000 description 7
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 6
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 6
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 150000008360 acrylonitriles Chemical class 0.000 description 3
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 3
- 239000002216 antistatic agent Substances 0.000 description 3
- ZNNZYHKDIALBAK-UHFFFAOYSA-M potassium thiocyanate Chemical compound [K+].[S-]C#N ZNNZYHKDIALBAK-UHFFFAOYSA-M 0.000 description 3
- 229940116357 potassium thiocyanate Drugs 0.000 description 3
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 229920003244 diene elastomer Polymers 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 229920005669 high impact polystyrene Polymers 0.000 description 2
- 239000004797 high-impact polystyrene Substances 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- HSZCZNFXUDYRKD-UHFFFAOYSA-M lithium iodide Chemical compound [Li+].[I-] HSZCZNFXUDYRKD-UHFFFAOYSA-M 0.000 description 2
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 1
- HGRZLIGHKHRTRE-UHFFFAOYSA-N 1,2,3,4-tetrabromobutane Chemical compound BrCC(Br)C(Br)CBr HGRZLIGHKHRTRE-UHFFFAOYSA-N 0.000 description 1
- YAOMHRRYSRRRKP-UHFFFAOYSA-N 1,2-dichloropropyl 2,3-dichloropropyl 3,3-dichloropropyl phosphate Chemical compound ClC(Cl)CCOP(=O)(OC(Cl)C(Cl)C)OCC(Cl)CCl YAOMHRRYSRRRKP-UHFFFAOYSA-N 0.000 description 1
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- ULQISTXYYBZJSJ-UHFFFAOYSA-N 12-hydroxyoctadecanoic acid Chemical compound CCCCCCC(O)CCCCCCCCCCC(O)=O ULQISTXYYBZJSJ-UHFFFAOYSA-N 0.000 description 1
- MEZZCSHVIGVWFI-UHFFFAOYSA-N 2,2'-Dihydroxy-4-methoxybenzophenone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1O MEZZCSHVIGVWFI-UHFFFAOYSA-N 0.000 description 1
- MXSKJYLPNPYQHH-UHFFFAOYSA-N 2,4-dimethyl-6-(1-methylcyclohexyl)phenol Chemical compound CC1=CC(C)=C(O)C(C2(C)CCCCC2)=C1 MXSKJYLPNPYQHH-UHFFFAOYSA-N 0.000 description 1
- KIHBGTRZFAVZRV-UHFFFAOYSA-N 2-Hydroxyoctadecanoic acid Natural products CCCCCCCCCCCCCCCCC(O)C(O)=O KIHBGTRZFAVZRV-UHFFFAOYSA-N 0.000 description 1
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 description 1
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- JZVUAOCDNFNSGQ-UHFFFAOYSA-N 7-methoxy-2-phenyl-1h-quinolin-4-one Chemical compound N=1C2=CC(OC)=CC=C2C(O)=CC=1C1=CC=CC=C1 JZVUAOCDNFNSGQ-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- 239000003508 Dilauryl thiodipropionate Substances 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 150000008107 benzenesulfonic acids Chemical class 0.000 description 1
- BJFLSHMHTPAZHO-UHFFFAOYSA-N benzotriazole Chemical compound [CH]1C=CC=C2N=NN=C21 BJFLSHMHTPAZHO-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- KLIYQWXIWMRMGR-UHFFFAOYSA-N buta-1,3-diene;methyl 2-methylprop-2-enoate Chemical compound C=CC=C.COC(=O)C(C)=C KLIYQWXIWMRMGR-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- ULBTUVJTXULMLP-UHFFFAOYSA-N butyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCCC ULBTUVJTXULMLP-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 235000019304 dilauryl thiodipropionate Nutrition 0.000 description 1
- AXZAYXJCENRGIM-UHFFFAOYSA-J dipotassium;tetrabromoplatinum(2-) Chemical compound [K+].[K+].[Br-].[Br-].[Br-].[Br-].[Pt+2] AXZAYXJCENRGIM-UHFFFAOYSA-J 0.000 description 1
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 1
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- GOAJGXULHASQGJ-UHFFFAOYSA-N ethene;prop-2-enenitrile Chemical group C=C.C=CC#N GOAJGXULHASQGJ-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 229920006229 ethylene acrylic elastomer Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- XIXADJRWDQXREU-UHFFFAOYSA-M lithium acetate Chemical compound [Li+].CC([O-])=O XIXADJRWDQXREU-UHFFFAOYSA-M 0.000 description 1
- MHCFAGZWMAWTNR-UHFFFAOYSA-M lithium perchlorate Chemical compound [Li+].[O-]Cl(=O)(=O)=O MHCFAGZWMAWTNR-UHFFFAOYSA-M 0.000 description 1
- 229910001486 lithium perchlorate Inorganic materials 0.000 description 1
- IRDCEJVOXCGYAV-UHFFFAOYSA-M lithium;2-dodecylbenzenesulfonate Chemical compound [Li+].CCCCCCCCCCCCC1=CC=CC=C1S([O-])(=O)=O IRDCEJVOXCGYAV-UHFFFAOYSA-M 0.000 description 1
- DNXKVOCRSQBZHO-UHFFFAOYSA-M lithium;dodecane-1-sulfonate Chemical compound [Li+].CCCCCCCCCCCCS([O-])(=O)=O DNXKVOCRSQBZHO-UHFFFAOYSA-M 0.000 description 1
- ZJZXSOKJEJFHCP-UHFFFAOYSA-M lithium;thiocyanate Chemical compound [Li+].[S-]C#N ZJZXSOKJEJFHCP-UHFFFAOYSA-M 0.000 description 1
- WDGKXRCNMKPDSD-UHFFFAOYSA-N lithium;trifluoromethanesulfonic acid Chemical compound [Li].OS(=O)(=O)C(F)(F)F WDGKXRCNMKPDSD-UHFFFAOYSA-N 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- FTQWRYSLUYAIRQ-UHFFFAOYSA-N n-[(octadecanoylamino)methyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCNC(=O)CCCCCCCCCCCCCCCCC FTQWRYSLUYAIRQ-UHFFFAOYSA-N 0.000 description 1
- RKISUIUJZGSLEV-UHFFFAOYSA-N n-[2-(octadecanoylamino)ethyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCCNC(=O)CCCCCCCCCCCCCCCCC RKISUIUJZGSLEV-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000005453 pelletization Methods 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- DOIRQSBPFJWKBE-UHFFFAOYSA-N phthalic acid di-n-butyl ester Natural products CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- 229910001487 potassium perchlorate Inorganic materials 0.000 description 1
- CUNPJFGIODEJLQ-UHFFFAOYSA-M potassium;2,2,2-trifluoroacetate Chemical compound [K+].[O-]C(=O)C(F)(F)F CUNPJFGIODEJLQ-UHFFFAOYSA-M 0.000 description 1
- HSJXWMZKBLUOLQ-UHFFFAOYSA-M potassium;2-dodecylbenzenesulfonate Chemical compound [K+].CCCCCCCCCCCCC1=CC=CC=C1S([O-])(=O)=O HSJXWMZKBLUOLQ-UHFFFAOYSA-M 0.000 description 1
- LQAZPMXASFNKCD-UHFFFAOYSA-M potassium;dodecane-1-sulfonate Chemical compound [K+].CCCCCCCCCCCCS([O-])(=O)=O LQAZPMXASFNKCD-UHFFFAOYSA-M 0.000 description 1
- GLGXXYFYZWQGEL-UHFFFAOYSA-M potassium;trifluoromethanesulfonate Chemical compound [K+].[O-]S(=O)(=O)C(F)(F)F GLGXXYFYZWQGEL-UHFFFAOYSA-M 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 235000009518 sodium iodide Nutrition 0.000 description 1
- BAZAXWOYCMUHIX-UHFFFAOYSA-M sodium perchlorate Chemical compound [Na+].[O-]Cl(=O)(=O)=O BAZAXWOYCMUHIX-UHFFFAOYSA-M 0.000 description 1
- 229910001488 sodium perchlorate Inorganic materials 0.000 description 1
- VGTPCRGMBIAPIM-UHFFFAOYSA-M sodium thiocyanate Chemical compound [Na+].[S-]C#N VGTPCRGMBIAPIM-UHFFFAOYSA-M 0.000 description 1
- UYCAUPASBSROMS-AWQJXPNKSA-M sodium;2,2,2-trifluoroacetate Chemical compound [Na+].[O-][13C](=O)[13C](F)(F)F UYCAUPASBSROMS-AWQJXPNKSA-M 0.000 description 1
- DAJSVUQLFFJUSX-UHFFFAOYSA-M sodium;dodecane-1-sulfonate Chemical compound [Na+].CCCCCCCCCCCCS([O-])(=O)=O DAJSVUQLFFJUSX-UHFFFAOYSA-M 0.000 description 1
- XGPOMXSYOKFBHS-UHFFFAOYSA-M sodium;trifluoromethanesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C(F)(F)F XGPOMXSYOKFBHS-UHFFFAOYSA-M 0.000 description 1
- 229940037312 stearamide Drugs 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- UFTFJSFQGQCHQW-UHFFFAOYSA-N triformin Chemical compound O=COCC(OC=O)COC=O UFTFJSFQGQCHQW-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、ウェルド強度が良好で
かつ、永久的な帯電防止性能を有する熱可塑性ゴム強化
スチレン系樹脂組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoplastic rubber-reinforced styrenic resin composition having good weld strength and permanent antistatic properties.
【0002】0002
【従来の技術および問題点】ABS樹脂およびHIPS
(ハイインパクトポリスチレン)等のゴム強化スチレン
系樹脂は、成形性、衝撃強度と剛性のバランス、成形品
外観に優れ、自動車部品、電気製品、事務機器等の材料
として広く利用されている。[Prior art and problems] ABS resin and HIPS
Rubber-reinforced styrene resins such as (high-impact polystyrene) have excellent moldability, a balance between impact strength and rigidity, and the appearance of molded products, and are widely used as materials for automobile parts, electrical products, office equipment, etc.
【0003】しかしながら、ゴム強化スチレン系樹脂は
他のプラスチックと同様に帯電しやすく、成形品表面に
ごみやほこりが吸着して成形品外観を損ない、また電子
機器の場合は帯電した電気が障害を与えるという問題が
あった。However, like other plastics, rubber-reinforced styrene-based resins are easily charged with electricity, and dirt and dust are attracted to the surface of the molded product, damaging the appearance of the molded product.In addition, in the case of electronic equipment, the charged electricity can cause damage. There was a problem of giving.
【0004】従来の帯電防止方法としては、帯電防止剤
をゴム強化スチレン系樹脂に添加する方法が一般的であ
るが、この方法は帯電防止効果の持続性が不充分という
問題がある。[0004] As a conventional antistatic method, it is common to add an antistatic agent to a rubber-reinforced styrene resin, but this method has a problem in that the antistatic effect is insufficiently durable.
【0005】一方、最近では、親水性樹脂(例えば、ポ
リアミドエラストマー)とのポリマーアロイによる方法
にて持続性のある帯電防止効果を持たせる方法が数多く
みられるが(例.特開昭60−23435)、これらア
ロイタイプのものは、射出成形品のウェルド部の強度が
弱いという欠点があり、実用上問題がある。On the other hand, recently, there have been many methods to provide a long-lasting antistatic effect by polymer alloying with hydrophilic resins (for example, polyamide elastomers) (for example, Japanese Patent Laid-Open No. 60-23435). ), these alloy types have the disadvantage that the strength of the weld part of the injection molded product is weak, which poses a practical problem.
【0006】[0006]
【問題点を解決するための手段】本発明者らは、ゴム強
化スチレン系樹脂に、永久的な帯電防止性能を付与する
と共に、ウェルド部に強度をもたせる方法について検討
した結果、ゴム強化スチレン系樹脂にポリエチレンオキ
サイド、メタクリル系樹脂および必要に応じてアルカリ
金属塩を特定の割合で配合することにより、上記の目的
が達成されることを見出し、本発明を達成した。[Means for Solving the Problems] The present inventors have investigated a method of imparting permanent antistatic properties to rubber-reinforced styrene-based resins, as well as providing strength to the weld parts. The present invention has been achieved by discovering that the above object can be achieved by blending polyethylene oxide, methacrylic resin, and, if necessary, alkali metal salt into the resin in specific proportions.
【0007】即ち、本発明は、ゴム強化スチレン系樹脂
(A)92〜50重量部、平均分子量が150万以上の
ポリエチレンオキサイド(B)3〜30重量部およびメ
タクリル系樹脂(C)5〜45重量部の合計量100重
量部に対し、アルカリ金属塩(D)0〜5重量部を配合
してなるウェルド部の強度の良好な制電性熱可塑性樹脂
組成物を提供するものである。That is, the present invention comprises 92 to 50 parts by weight of a rubber-reinforced styrene resin (A), 3 to 30 parts by weight of polyethylene oxide (B) having an average molecular weight of 1.5 million or more, and 5 to 45 parts by weight of a methacrylic resin (C). The object of the present invention is to provide an antistatic thermoplastic resin composition having good strength in the weld portion, which is made by blending 0 to 5 parts by weight of an alkali metal salt (D) with respect to the total amount of 100 parts by weight.
【0008】本発明に用いるゴム強化スチレン系樹脂(
A)とは、ゴム成分とスチレン系樹脂成分とから構成さ
れるものであり、一般にゴム成分の存在下にスチレン系
単量体と他の共重合可能な単量体を重合してなるグラフ
ト重合体(i)、グラフト重合体(i)とスチレン系単
量体またはスチレン系単量体と他の共重合可能な単量体
を重合してなる(共)重合体との混合物(ii) また
はゴム成分と上述の(共)重合体との混合物(iii)
からなる。Rubber-reinforced styrenic resin used in the present invention (
A) is composed of a rubber component and a styrene resin component, and is generally a graft polymer formed by polymerizing a styrene monomer and other copolymerizable monomers in the presence of a rubber component. mixture (i), a mixture (ii) of a graft polymer (i) and a (co)polymer obtained by polymerizing a styrenic monomer or a styrene monomer and another copolymerizable monomer; or Mixture (iii) of a rubber component and the above-mentioned (co)polymer
Consisting of
【0009】ABS樹脂(アクリロニトリル−ブタジエ
ン系ゴム−スチレン共重合体)、MBS樹脂(メチルメ
タクリレート−ブタジエン系ゴム−スチレン共重合体)
、AES樹脂(アクリロニトリル−エチレン・プロピレ
ン系ゴム−スチレン共重合体)、AAS樹脂(アクリロ
ニトリル−アクリル系ゴム−スチレン共重合体)、HI
PS(ブタジエン系ゴム−スチレン共重合体)等の名称
にて取引されているものがゴム強化スチレン系樹脂(A
)として例示され、特にABS樹脂、AES樹脂、AA
S樹脂が好ましい。ABS resin (acrylonitrile-butadiene rubber-styrene copolymer), MBS resin (methyl methacrylate-butadiene rubber-styrene copolymer)
, AES resin (acrylonitrile-ethylene/propylene rubber-styrene copolymer), AAS resin (acrylonitrile-acrylic rubber-styrene copolymer), HI
Products traded under names such as PS (butadiene rubber-styrene copolymer) are rubber-reinforced styrene resins (A
), especially ABS resin, AES resin, AA resin
S resin is preferred.
【0010】ゴム成分としては、ポリブタジエン、ポリ
イソプレン、ブタジエン−スチレン共重合体、イソプレ
ン−スチレン共重合体、ブタジエン−アクリロニトリル
共重合体、ブタジエン−イソプレン−スチレン共重合体
、ポリクロロプレンなどのジエン系ゴム、エチレン−プ
ロピレン共重合体、エチレン−プロピレン−ジエン共重
合体などのエチレン−プロピレン系ゴム、ポリブチルア
クリレートなどのアクリル系ゴムなどが挙げられる。As the rubber component, diene rubbers such as polybutadiene, polyisoprene, butadiene-styrene copolymer, isoprene-styrene copolymer, butadiene-acrylonitrile copolymer, butadiene-isoprene-styrene copolymer, and polychloroprene are used. , ethylene-propylene rubber such as ethylene-propylene copolymer, ethylene-propylene-diene copolymer, and acrylic rubber such as polybutyl acrylate.
【0011】又、前述のグラフト重合体および(共)重
合体に用いられるスチレン系単量体としては、スチレン
、α−メチルスチレン、パラメチルスチレン等が挙げら
れ、一種又は二種以上用いることが出来る。特にスチレ
ン、α−メチルスチレンが好ましい。[0011] Furthermore, examples of the styrene monomer used in the above-mentioned graft polymer and (co)polymer include styrene, α-methylstyrene, para-methylstyrene, etc., and one or more of them can be used. I can do it. Particularly preferred are styrene and α-methylstyrene.
【0012】スチレン系単量体と共に用いることのでき
る他の共重合可能な単量体としては、アクリロニトリル
、メタクリロニトリル等のシアン化ビニル化合物、メタ
クリル酸メチル、アクリル酸メチル等の(メタ)アクリ
ル酸エステル化合物、N−フェニルマレイミド、N−シ
クロヘキシルマレイミド等のマレイミド化合物等が挙げ
られ、それらはそれぞれ一種又は二種以上用いることが
できる。Other copolymerizable monomers that can be used with the styrene monomer include vinyl cyanide compounds such as acrylonitrile and methacrylonitrile, and (meth)acrylic compounds such as methyl methacrylate and methyl acrylate. Examples include acid ester compounds, maleimide compounds such as N-phenylmaleimide and N-cyclohexylmaleimide, and one or more types of each can be used.
【0013】最終組成物の物性バランス面より、ジエン
系ゴム、エチレン−プロピレン系ゴム、アクリル系ゴム
からなる群より選択された一種以上のゴム(1)の存在
下、スチレン系単量体(2)とシアン化ビニル化合物、
(メタ)アクリル酸エステル化合物、マレイミド化合物
からなる群より選択された一種以上の他の共重合可能な
単量体(3)を重合してなるグラフト重合体と上記単量
体(2)と(3)を重合してなる共重合体との混合物で
あるゴム強化スチレン系樹脂が好ましい。In view of the physical property balance of the final composition, the styrene monomer (2) is added in the presence of one or more rubbers (1) selected from the group consisting of diene rubber, ethylene-propylene rubber, and acrylic rubber. ) and vinyl cyanide compounds,
A graft polymer obtained by polymerizing one or more other copolymerizable monomers (3) selected from the group consisting of (meth)acrylic acid ester compounds and maleimide compounds, and the above monomer (2) and ( A rubber-reinforced styrenic resin which is a mixture with a copolymer obtained by polymerizing 3) is preferred.
【0014】本発明におけるポリエチレンオキサイド(
B)は平均分子量が150万以上のものであればよい。
平均分子量が150万未満ではウェルド強度が低下し好
ましくない。好ましくは、平均分子量が170万〜50
0万であり、更に好ましくは200万〜400万である
。尚、ここでの平均分子量は粘度平均分子量であり、詳
しくは、オストワルド粘度系(35℃)によって測定し
たものを、次式によって求めたものである。Polyethylene oxide (
B) may have an average molecular weight of 1.5 million or more. If the average molecular weight is less than 1,500,000, the weld strength decreases, which is not preferable. Preferably, the average molecular weight is 1.7 million to 50
00,000, more preferably 2,000,000 to 4,000,000. Incidentally, the average molecular weight here is a viscosity average molecular weight, and in detail, it is determined by the following formula, measured by the Ostwald viscosity system (35° C.).
【0015】[0015]
【数1】〔η〕=6.4 ×10−5M0.82[Equation 1] [η] = 6.4 × 10-5M0.82
【00
16】また、ここで〔η〕はポリエチレンオキサイドの
固有粘度であり、Mはその平均分子量である。00
16] Here, [η] is the intrinsic viscosity of polyethylene oxide, and M is its average molecular weight.
【0017】本発明におけるメタクリル系樹脂とは、メ
タクリル酸アルキルエステルのホモポリマー並びにメタ
クリル酸アルキルエステルを主体とする共重合体である
。メタクリル酸アルキルエステルとしてはメチルメタク
リレート、エチルメタクリレートなどC1〜4のアルキ
ル基を有するメタクリル酸アルキルエステルである。
また、メタクリル酸アルキルエステルと共重合される化
合物としては、エチルアクリレート、ブチルアクリレー
ト等のアクリル酸アルキルエステル、スチレン、α−メ
チルスチレン等の芳香族ビニル、アクリロニトリル、メ
タアクリロニトリル等のシアン化ビニル等が挙げられる
。好ましくは、メチルメタクリレートを50重量%以上
を有する共重合体であり更に好ましくはメチルメタクリ
レートを80重量%以上を有する共重合体もしくはメチ
ルメタクリレートのホモポリマーである。The methacrylic resin in the present invention is a homopolymer of an alkyl methacrylate ester or a copolymer mainly composed of an alkyl methacrylate ester. The methacrylic acid alkyl ester is a methacrylic acid alkyl ester having a C1-4 alkyl group, such as methyl methacrylate and ethyl methacrylate. Compounds copolymerized with methacrylic acid alkyl esters include acrylic acid alkyl esters such as ethyl acrylate and butyl acrylate, aromatic vinyls such as styrene and α-methylstyrene, and vinyl cyanides such as acrylonitrile and methacrylonitrile. Can be mentioned. Preferably, it is a copolymer containing 50% by weight or more of methyl methacrylate, and more preferably a copolymer containing 80% by weight or more of methyl methacrylate or a homopolymer of methyl methacrylate.
【0018】ゴム強化スチレン系樹脂(A)、ポリエチ
レンオキサイド(B)およびメタクリル系樹脂(C)の
配合組成は(A)92〜50重量部、(B)3〜30重
量部および(C)5〜45重量部である。但し、(A)
、(B)および(C)の合計量を100重量部とする。The composition of the rubber-reinforced styrene resin (A), polyethylene oxide (B), and methacrylic resin (C) is (A) 92 to 50 parts by weight, (B) 3 to 30 parts by weight, and (C) 5 parts by weight. ~45 parts by weight. However, (A)
, (B) and (C) is 100 parts by weight.
【0019】ゴム強化スチレン系樹脂(A)が50重量
部未満では、ウェルド強度およびノッチ付きアイゾット
衝撃強度が低下し、また92重量部を越えると帯電防止
性に劣り好ましくない。ゴム強化スチレン系樹脂の使用
量は好ましくは89〜55重量部で好ましくは86〜6
0重量部である。If the rubber-reinforced styrenic resin (A) is less than 50 parts by weight, the weld strength and notched Izod impact strength will decrease, and if it exceeds 92 parts by weight, the antistatic properties will be poor, which is not preferable. The amount of rubber reinforced styrene resin used is preferably 89 to 55 parts by weight, preferably 86 to 6 parts by weight.
It is 0 parts by weight.
【0020】ポリエチレンオキサイドが3重量部未満で
は、組成物の帯電防止性が劣り、また30重量部を越え
ると組成物のウェルド強度が低下し好ましくない。ポリ
エチレンオキサイドの使用量は、好ましくは5〜20重
量部であり、さらに好ましくは7〜15重量部である。If the amount of polyethylene oxide is less than 3 parts by weight, the antistatic properties of the composition will be poor, and if it exceeds 30 parts by weight, the weld strength of the composition will decrease, which is not preferable. The amount of polyethylene oxide used is preferably 5 to 20 parts by weight, more preferably 7 to 15 parts by weight.
【0021】またメタクリル系樹脂が5重量部未満では
ウェルド強度改良効果が小さく、45重量部を越えると
ノッチ付きアイゾット衝撃強度が低下し好ましくない。
メタクリル系樹脂の使用量は好ましくは6〜40重量部
で更に好ましくは7〜35重量部である。If the methacrylic resin is less than 5 parts by weight, the effect of improving weld strength is small, and if it exceeds 45 parts by weight, the notched Izod impact strength is undesirably lowered. The amount of methacrylic resin used is preferably 6 to 40 parts by weight, more preferably 7 to 35 parts by weight.
【0022】本発明のアルカリ金属塩(D)としては、
塩化リチウム、臭化リチウム、ヨウ化リチウム、ヨウ化
ナトリウム、ホウ水素化ナトリウム、ホウフッ化リチウ
ム、ホウフッ化カリウム、テトラフェニルホウ酸リチウ
ム、テトラフェニルホウ酸カリウム、テトラフェニルホ
ウ酸ナトリウム、チオシアン酸リチウム、チオシアン酸
ナトリウム、チオシアン酸カリウム、過塩素酸リチウム
、過塩素酸ナトリウム、過塩素酸カリウム等の無機酸の
アルカリ金属塩、トリフルオロ酢酸リチウム、トリフル
オロ酢酸ナトリウム、トリフルオロ酢酸カリウム、トリ
フルオロメタンスルホン酸リチウム、トリフルオロメタ
ンスルホン酸ナトリウム、トリフルオロメタンスルホン
酸カリウム、酢酸リチウム、酢酸ナトリウム、酢酸カリ
ウム、ドデシルベンゼンスルホン酸リチウム、ドデシル
ベンゼンスルホン酸カリウム、ドデシルベンゼンスルホ
ン酸ナトリウム、ドデシルスルホン酸リチウム、ドデシ
ルスルホン酸カリウム、ドデシルスルホン酸ナトリウム
等の有機酸のアルカリ金属塩が挙げられ、一種または二
種以上を併用してもよい。これらアルカリ金属塩の中で
好ましくはドデシルベンゼンスルホン酸の様な核置換ベ
ンゼンスルホン酸のアルカリ金属塩およびチオシアン酸
カリウムである。The alkali metal salt (D) of the present invention includes:
Lithium chloride, lithium bromide, lithium iodide, sodium iodide, sodium borohydride, lithium borofluoride, potassium borofluoride, lithium tetraphenylborate, potassium tetraphenylborate, sodium tetraphenylborate, lithium thiocyanate, Alkali metal salts of inorganic acids such as sodium thiocyanate, potassium thiocyanate, lithium perchlorate, sodium perchlorate, potassium perchlorate, lithium trifluoroacetate, sodium trifluoroacetate, potassium trifluoroacetate, trifluoromethanesulfonic acid Lithium, sodium trifluoromethanesulfonate, potassium trifluoromethanesulfonate, lithium acetate, sodium acetate, potassium acetate, lithium dodecylbenzenesulfonate, potassium dodecylbenzenesulfonate, sodium dodecylbenzenesulfonate, lithium dodecylsulfonate, potassium dodecylsulfonate , alkali metal salts of organic acids such as sodium dodecyl sulfonate, and one kind or two or more kinds thereof may be used in combination. Among these alkali metal salts, preferred are alkali metal salts of nuclear-substituted benzenesulfonic acids such as dodecylbenzenesulfonic acid and potassium thiocyanate.
【0023】前記アルカリ金属塩(D)の使用量はゴム
強化スチレン系樹脂(A)、ポリエチレンオキサイド(
B)およびメタクリル系樹脂(C)の合計量100重量
部に対し、0〜5重量部である。アルカリ金属塩はなく
てもそれなりの制電性はあるが、それを用いることによ
り制電性は更に向上する。また、アルカリ金属塩が5重
量部を越えても組成物の帯電防止性はそれ以上は向上せ
ず、一方分散性が悪くなり、成形品の表面に析出して外
観を損なったり、また表面がべとついたりするため好ま
しくない。アルカリ金属塩の使用量は好ましくは 0.
1〜3重量部である。The amount of the alkali metal salt (D) used is determined by the amount of the rubber-reinforced styrenic resin (A), polyethylene oxide (
The amount is 0 to 5 parts by weight based on 100 parts by weight of the total amount of B) and methacrylic resin (C). Although there is a certain antistatic property even without an alkali metal salt, the antistatic property is further improved by using it. In addition, even if the alkali metal salt exceeds 5 parts by weight, the antistatic properties of the composition will not improve any further, and on the other hand, the dispersibility will worsen, and it may precipitate on the surface of the molded product, impairing its appearance, or causing the surface to deteriorate. It is undesirable because it becomes sticky. The amount of alkali metal salt used is preferably 0.
It is 1 to 3 parts by weight.
【0024】本発明の制電性熱可塑性樹脂組成物には、
酸化防止剤〔例えば2,6−ジ−t−ブチル−4−メチ
ルフェノール、2−(1−メチルシクロヘキシル)−4
,6−ジメチルフェノール、2,2−メチレン−ビス−
(4−エチル−6−t−メチルフェノール)、4,4’
−チオビス−(6−t−ブチル−3−メチルフェノール
)、ジラウリルチオジプロピオネート、トリス(ジ−ノ
ニルフェニル)ホスファイト、ワックス〕、紫外線吸収
剤〔例えばp−t−ブチルフェニルサリシレート、2,
2’−ジヒドロキシ−4−メトキシベンゾフェノン、2
−(2’−ヒドロキシ−4’−n−オクトキシフェニル
)ベンゾトリアゾール〕、滑剤〔例えばパラフィンワッ
クス、ステアリン酸、硬化油、ステアロアミド、メチレ
ンビスステアロアミド、エチレンビスステアロアミド、
n−ブチルステアレート、ケトンワックス、オクチルア
ルコール、ラウリルアルコール、ヒドロキシステアリン
酸トリグリセリド〕、難燃剤〔例えば、酸化アンチモン
、水酸化アルミニウム、ほう酸亜鉛、トリクレジルホス
フェート、トリス(ジクロロプロピル)ホスフェート、
塩素化パラフィン、テトラブロモブタン、ヘキサブロモ
ベンゼン、テトラブロモビスフェノールA〕、着色剤〔
例えば酸化チタン、カーボンブラック〕、充填剤〔例え
ば炭酸カルシウム、クレー、シリカ、ガラス繊維、ガラ
ス球、カーボン繊維〕、顔料等を必要に応じて添加する
事ができる。The antistatic thermoplastic resin composition of the present invention includes:
Antioxidants [e.g. 2,6-di-t-butyl-4-methylphenol, 2-(1-methylcyclohexyl)-4
, 6-dimethylphenol, 2,2-methylene-bis-
(4-ethyl-6-t-methylphenol), 4,4'
-thiobis-(6-t-butyl-3-methylphenol), dilaurylthiodipropionate, tris(di-nonylphenyl)phosphite, wax], UV absorbers [e.g. pt-butylphenyl salicylate, 2 ,
2'-dihydroxy-4-methoxybenzophenone, 2
-(2'-hydroxy-4'-n-octoxyphenyl)benzotriazole], lubricants [e.g. paraffin wax, stearic acid, hydrogenated oil, stearamide, methylene bis stearamide, ethylene bis stearamide,
n-butyl stearate, ketone wax, octyl alcohol, lauryl alcohol, hydroxystearic acid triglyceride], flame retardants [e.g., antimony oxide, aluminum hydroxide, zinc borate, tricresyl phosphate, tris(dichloropropyl) phosphate,
Chlorinated paraffin, tetrabromobutane, hexabromobenzene, tetrabromobisphenol A], colorant [
For example, titanium oxide, carbon black], fillers (for example, calcium carbonate, clay, silica, glass fiber, glass spheres, carbon fiber), pigments, etc. can be added as necessary.
【0025】また、本発明においては他の帯電防止剤の
併用を何ら妨げるものでない。Furthermore, in the present invention, there is no hindrance to the combined use of other antistatic agents.
【0026】本発明の組成物には、更に、ポリカーボネ
ート、ポリ塩化ビニル、ポリアミド、ポリブチレンテレ
フタレート、ポリエチレンテレフタレート、ポリフェニ
レンオキサイド、ポリオキシメチレン等の他の熱可塑性
樹脂を必要に応じて混合する事ができる。The composition of the present invention may further contain other thermoplastic resins such as polycarbonate, polyvinyl chloride, polyamide, polybutylene terephthalate, polyethylene terephthalate, polyphenylene oxide, and polyoxymethylene, if necessary. can.
【0027】次に本発明を実施例に基づいて説明するが
、本発明はかかる実施例のみに限定されるものではない
。Next, the present invention will be explained based on Examples, but the present invention is not limited to these Examples.
【0028】なお、配合組成における部数は全て重量に
よる部数を表す。また、組成物の物性測定は以下のよう
に行った。[0028] All parts in the compounding composition are by weight. In addition, the physical properties of the composition were measured as follows.
【0029】(1)物性測定用試験片の作成実施例及び
比較例で得られたペレットを 3.5オンス射出成形機
を用いシリンダー設定温度220℃で各物性用試験片を
成形した。(1) Preparation of test pieces for measuring physical properties The pellets obtained in the Examples and Comparative Examples were molded into test pieces for each physical property using a 3.5-ounce injection molding machine at a cylinder temperature of 220°C.
【0030】(2)物性測定 (i)ノッチ付アイゾット衝撃強度 ASTM D−256に準拠。 (1/4インチ厚) 23℃(2) Measurement of physical properties (i) Notched Izod impact strength Conforms to ASTM D-256. (1/4 inch thick) 23℃
【0031】(ii) ウェルド強度
ASTM 1号ダンベルの中央にウェルドができるよ
うに両端にゲートを有する金型を用いて成形した試験片
を用い、曲げ試験機にて、支点間距離50mmそしてク
ロスヘッドをウェルド部にくるようにしてASTM
D−790に準拠した曲げ試験を行い破断時の応力をウ
ェルド強度として評価した。(ii) Weld strength Using a test piece molded using a mold with gates at both ends to form a weld in the center of an ASTM No. 1 dumbbell, it was tested using a bending tester with a distance between supports of 50 mm and a crosshead. ASTM
A bending test was conducted in accordance with D-790, and the stress at break was evaluated as weld strength.
【0032】(iii)表面抵抗値
90×40×3mmの平板を用い次の各条件で測定した
。
(イ)試験片を23℃、55%相対湿度の条件で24時
間状態調節後測定する。
(ロ)試験片の表面を純水でよく洗浄した後、23℃、
55%相対湿度の条件で24時間状態調節後測定する。
表面抵抗値の測定は表面高抵抗計SM−10E(東亜電
波工業(株)製)を用い、測定電圧100V、サンプリ
ング時間10秒の条件で行った。(iii) Surface resistance value A flat plate of 90 x 40 x 3 mm was used for measurement under the following conditions. (a) Measure the test piece after conditioning it for 24 hours at 23°C and 55% relative humidity. (b) After thoroughly washing the surface of the test piece with pure water,
Measurements are taken after conditioning for 24 hours at 55% relative humidity. The surface resistance value was measured using a surface high resistance meter SM-10E (manufactured by Toa Denpa Kogyo Co., Ltd.) under conditions of a measurement voltage of 100 V and a sampling time of 10 seconds.
【0033】(iv)外観
インジェクションにて5分間滞留させた後成形し、外観
を評価した。(iv) Appearance After being left in the injection mold for 5 minutes, the molding was performed and the appearance was evaluated.
【0034】実施例1
ポリブタジエンの存在下にスチレンとアクリロニトリル
を重合してなるグラフト重合体とスチレンとアクリロニ
トリルを重合してなる共重合体からなるゴム含有量15
%のABS樹脂60部、平均分子量200万のポリエチ
レンオキサイド10部、メタクリル系樹脂としてスミペ
ックスB−MH(ポリメチルメタクリレート、住友化学
(株)製)を30部およびドデシルベンゼンスルホン酸
ナトリウム2部をベント付き40mm単軸押し出し機を
用い、シリンダー温度220℃にて混練後、ペレット化
した。得られた組成物の物性を前記の方法により測定し
た。結果を第一表に示す。Example 1 Rubber content: 15 consisting of a graft polymer obtained by polymerizing styrene and acrylonitrile in the presence of polybutadiene and a copolymer obtained by polymerizing styrene and acrylonitrile.
% ABS resin, 10 parts of polyethylene oxide with an average molecular weight of 2 million, 30 parts of Sumipex B-MH (polymethyl methacrylate, manufactured by Sumitomo Chemical Co., Ltd.) as a methacrylic resin, and 2 parts of sodium dodecylbenzenesulfonate were vented. After kneading at a cylinder temperature of 220° C. using a 40 mm single-screw extruder, the mixture was pelletized. The physical properties of the obtained composition were measured by the method described above. The results are shown in Table 1.
【0035】比較例1 実施例1に用いたABS樹脂の物性を同様に測定した。 結果を第一表に示す。Comparative example 1 The physical properties of the ABS resin used in Example 1 were measured in the same manner. The results are shown in Table 1.
【0036】比較例2
実施例1に用いたABS樹脂100部に、ドデシルベン
ゼンスルホン酸ナトリウム2部を混合後、実施例1と同
様にしてペレット化し、物性を測定した。結果を第一表
に示す。Comparative Example 2 100 parts of the ABS resin used in Example 1 was mixed with 2 parts of sodium dodecylbenzenesulfonate, then pelletized in the same manner as in Example 1, and the physical properties were measured. The results are shown in Table 1.
【0037】比較例3
実施例1に用いたABS樹脂とポリエチレンオキサイド
およびドデシルベンゼンスルホン酸ナトリウムを90部
/10部/2部の配合組成で混合後、実施例1と同様に
してペレット化し、物性を測定した。結果を第一表に示
す。Comparative Example 3 After mixing the ABS resin used in Example 1 with polyethylene oxide and sodium dodecylbenzenesulfonate in a composition of 90 parts/10 parts/2 parts, pelletization was performed in the same manner as in Example 1, and the physical properties were determined. was measured. The results are shown in Table 1.
【0038】実施例2,3,4,5,6,7および比較
例4,5,6,7
実施例1においてABS樹脂とポリエチレンオキサイド
およびメタクリル系樹脂の配合組成をそれぞれ70部/
10部/20部、80部/10部/10部、50部/1
0部/40部および65部/5部/30部、55部/1
5部/30部、50部/20部/30部、及び87部/
10部/3部、40部/10部/50部、69部/1部
/30部、30部/40部/10部にそれぞれ変えた。
他は実施例1と同様に配合し、各組成物の物性を測定し
た。結果を第一表に示す。Examples 2, 3, 4, 5, 6, 7 and Comparative Examples 4, 5, 6, 7 In Example 1, the blending composition of ABS resin, polyethylene oxide, and methacrylic resin was 70 parts/70 parts each.
10 copies/20 copies, 80 copies/10 copies/10 copies, 50 copies/1
0 copies/40 copies and 65 copies/5 copies/30 copies, 55 copies/1
5 copies/30 copies, 50 copies/20 copies/30 copies, and 87 copies/
The numbers were changed to 10 parts/3 parts, 40 parts/10 parts/50 parts, 69 parts/1 part/30 parts, and 30 parts/40 parts/10 parts. The other ingredients were blended in the same manner as in Example 1, and the physical properties of each composition were measured. The results are shown in Table 1.
【0039】実施例8,9,10および比較例8実施例
1において、ドデシルベンゼンスルホン酸ナトリウムの
添加量を、それぞれ0部、1部、5部、8部に変えた他
は実施例1と同様に配合した。各組成物の物性を測定し
、第一表に示す。Examples 8, 9, 10 and Comparative Example 8 Example 1 was repeated except that the amount of sodium dodecylbenzenesulfonate added was changed to 0 parts, 1 part, 5 parts, and 8 parts, respectively. It was mixed in the same way. The physical properties of each composition were measured and shown in Table 1.
【0040】実施例11
実施例1において、ドデシルベンゼンスルホン酸ナトリ
ウム2部をチオシアン酸カリウム 0.5部に変えた他
は、実施例1と同様に配合し、物性を測定した。その結
果を第一表に示す。Example 11 A mixture was prepared in the same manner as in Example 1, except that 0.5 parts of potassium thiocyanate was used instead of 2 parts of sodium dodecylbenzenesulfonate, and the physical properties were measured. The results are shown in Table 1.
【0041】実施例12および比較例9実施例1におい
て、ポリエチレンオキサイドの分子量を、それぞれ50
0万、30万に変えた他は、実施例1と同様に配合した
。各組成物の物性を測定し、第一表に示す。Example 12 and Comparative Example 9 In Example 1, the molecular weight of polyethylene oxide was 50
The blending was carried out in the same manner as in Example 1, except that the amounts were changed to 0,000,000 and 300,000. The physical properties of each composition were measured and shown in Table 1.
【0042】実施例13
実施例1において、ABS樹脂に代えてEPDM(エチ
レン・プロピレン・エチリデンノルボルネンゴム)の存
在下にスチレンとアクリロニトリルを重合してなるグラ
フト重合体とスチレンとアクリロニトリルを重合してな
る共重合体からなるゴム含有量17%のAES樹脂を用
いた他は、実施例1と同様にして配合し、物性を測定し
た。結果を第一表に示す。Example 13 In Example 1, a graft polymer obtained by polymerizing styrene and acrylonitrile in the presence of EPDM (ethylene propylene ethylidene norbornene rubber) in place of the ABS resin, and a graft polymer obtained by polymerizing styrene and acrylonitrile. Blending was performed in the same manner as in Example 1, except that an AES resin consisting of a copolymer and having a rubber content of 17% was used, and the physical properties were measured. The results are shown in Table 1.
【0043】[0043]
【表1】[Table 1]
【0044】[0044]
【発明の効果】本発明のゴム強化スチレン系樹脂組成物
は、通常の帯電防止剤を添加した組成物(比較例2)に
比べて、水洗後も良好な帯電防止性を示し、その持続性
が優れている。又、アイゾット衝撃強度も良好である。
一方、メタクリル系樹脂(C)を添加しない場合(比較
例3)または5部未満の場合は(比較例4)ウェルド強
度が不足し、また45部を越えると(比較例5)アイゾ
ット衝撃強度が不足し、好ましくない。また、ポリエチ
レンオキサイド(B)の量が3部未満だと洗浄後の帯電
防止性が不足し(比較例6)、また30部を越える場合
は(比較例7)ウェルド強度が低下し好ましくない。ま
た、アルカリ金属塩の添加量が5部を越える場合(比較
例8)は表面外観が大幅に低下し好ましくない。又、ポ
リエチレンオキサイド(B)の分子量が150万未満の
場合(比較例9)は、アイゾット衝撃強度やウェルド強
度が低下し好ましくない。Effects of the Invention The rubber-reinforced styrenic resin composition of the present invention exhibits better antistatic properties even after washing with water, compared to a composition containing an ordinary antistatic agent (Comparative Example 2), and its sustainability is is excellent. Moreover, the Izod impact strength is also good. On the other hand, if methacrylic resin (C) is not added (Comparative Example 3) or if it is less than 5 parts (Comparative Example 4), the weld strength will be insufficient, and if it exceeds 45 parts (Comparative Example 5), the Izod impact strength will be insufficient. Insufficient and undesirable. Furthermore, if the amount of polyethylene oxide (B) is less than 3 parts, the antistatic property after washing will be insufficient (Comparative Example 6), and if it exceeds 30 parts (Comparative Example 7), the weld strength will decrease, which is not preferable. Furthermore, when the amount of the alkali metal salt added exceeds 5 parts (Comparative Example 8), the surface appearance is significantly deteriorated, which is not preferable. Moreover, when the molecular weight of polyethylene oxide (B) is less than 1.5 million (Comparative Example 9), Izod impact strength and weld strength are undesirably lowered.
Claims (1)
50重量部、平均分子量が150万以上のポリエチレン
オキサイド(B)3〜30重量部およびメタクリル系樹
脂(C)5〜45重量部の合計量100重量部に対し、
アルカリ金属塩(D)0〜5重量部を配合してなる制電
性熱可塑性樹脂組成物。[Claim 1] Rubber reinforced styrenic resin (A) 92~
50 parts by weight, 3 to 30 parts by weight of polyethylene oxide (B) having an average molecular weight of 1.5 million or more, and 5 to 45 parts by weight of methacrylic resin (C) for a total of 100 parts by weight,
An antistatic thermoplastic resin composition containing 0 to 5 parts by weight of an alkali metal salt (D).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6134291A JP2784696B2 (en) | 1991-03-01 | 1991-03-01 | Antistatic thermoplastic resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6134291A JP2784696B2 (en) | 1991-03-01 | 1991-03-01 | Antistatic thermoplastic resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04275356A true JPH04275356A (en) | 1992-09-30 |
JP2784696B2 JP2784696B2 (en) | 1998-08-06 |
Family
ID=13168364
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JP6134291A Expired - Fee Related JP2784696B2 (en) | 1991-03-01 | 1991-03-01 | Antistatic thermoplastic resin composition |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004035685A1 (en) * | 2002-10-17 | 2004-04-29 | Ps Japan Corporation | Resin composition excellent in antistatic property, surface hardness, and strength |
CN109790346A (en) * | 2016-09-30 | 2019-05-21 | 乐天尖端材料株式会社 | The thermoplastic resin composition of ionizing radiation-resistant and mechanograph comprising it |
CN115260732A (en) * | 2022-05-17 | 2022-11-01 | 浙江三威防静电装备有限公司 | Antistatic master batch and preparation method thereof |
-
1991
- 1991-03-01 JP JP6134291A patent/JP2784696B2/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004035685A1 (en) * | 2002-10-17 | 2004-04-29 | Ps Japan Corporation | Resin composition excellent in antistatic property, surface hardness, and strength |
CN109790346A (en) * | 2016-09-30 | 2019-05-21 | 乐天尖端材料株式会社 | The thermoplastic resin composition of ionizing radiation-resistant and mechanograph comprising it |
EP3521361A4 (en) * | 2016-09-30 | 2020-04-29 | Lotte Advanced Materials Co., Ltd. | Ionizing radiation-resistant thermoplastic resin composition, and molded product comprising same |
CN109790346B (en) * | 2016-09-30 | 2021-03-12 | 乐天尖端材料株式会社 | Ionizing radiation resistant thermoplastic resin composition and molded article comprising the same |
US11274201B2 (en) | 2016-09-30 | 2022-03-15 | Lotte Advanced Materials Co., Ltd. | Ionizing radiation-resistant thermoplastic resin composition, and molded product comprising same |
CN115260732A (en) * | 2022-05-17 | 2022-11-01 | 浙江三威防静电装备有限公司 | Antistatic master batch and preparation method thereof |
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---|---|
JP2784696B2 (en) | 1998-08-06 |
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