JPH0427184Y2 - - Google Patents
Info
- Publication number
- JPH0427184Y2 JPH0427184Y2 JP4992386U JP4992386U JPH0427184Y2 JP H0427184 Y2 JPH0427184 Y2 JP H0427184Y2 JP 4992386 U JP4992386 U JP 4992386U JP 4992386 U JP4992386 U JP 4992386U JP H0427184 Y2 JPH0427184 Y2 JP H0427184Y2
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- via hole
- via holes
- lower electrode
- printing direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007639 printing Methods 0.000 claims description 11
- 230000000740 bleeding effect Effects 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4992386U JPH0427184Y2 (zh) | 1986-04-03 | 1986-04-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4992386U JPH0427184Y2 (zh) | 1986-04-03 | 1986-04-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62162875U JPS62162875U (zh) | 1987-10-16 |
JPH0427184Y2 true JPH0427184Y2 (zh) | 1992-06-30 |
Family
ID=30872821
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4992386U Expired JPH0427184Y2 (zh) | 1986-04-03 | 1986-04-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0427184Y2 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9269593B2 (en) * | 2012-05-29 | 2016-02-23 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Multilayer electronic structure with integral stepped stacked structures |
US9161461B2 (en) * | 2012-06-14 | 2015-10-13 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Multilayer electronic structure with stepped holes |
-
1986
- 1986-04-03 JP JP4992386U patent/JPH0427184Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS62162875U (zh) | 1987-10-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0427184Y2 (zh) | ||
JP2712295B2 (ja) | 混成集積回路 | |
JPH05175088A (ja) | 複合チップ素子及びその製造方法 | |
JPS6325717Y2 (zh) | ||
JP3656307B2 (ja) | 混成集積回路装置およびその製造方法 | |
JPH046224Y2 (zh) | ||
JPS6342536Y2 (zh) | ||
JP3423445B2 (ja) | 積層部品及びその製造方法 | |
JPS60194324U (ja) | 積層チツプコンデンサ | |
JPH0414289A (ja) | 多層基板 | |
JPS58158902A (ja) | 印刷抵抗装置 | |
JPH056687Y2 (zh) | ||
JPS59191764U (ja) | 湿式多層セラミツク基板 | |
JPH0160959B2 (zh) | ||
JPS6362398B2 (zh) | ||
JPS6218073Y2 (zh) | ||
JPH0533560U (ja) | ジヤンパー印刷回路装置 | |
JPS63157971U (zh) | ||
JPS60245296A (ja) | 厚膜印刷によるスル−ホ−ル形成方法 | |
JPS62245697A (ja) | 湿式多層セラミツク基板 | |
JPS5939962U (ja) | 両面印刷配線基板 | |
JPS61156793A (ja) | 両面多層厚膜回路 | |
JPH0377476U (zh) | ||
JPH11298126A (ja) | 実装用ランドを有する配線回路及びその形成方法 | |
JPS59132653U (ja) | 一次元イメ−ジセンサ |