JPH0427168Y2 - - Google Patents
Info
- Publication number
- JPH0427168Y2 JPH0427168Y2 JP1986198922U JP19892286U JPH0427168Y2 JP H0427168 Y2 JPH0427168 Y2 JP H0427168Y2 JP 1986198922 U JP1986198922 U JP 1986198922U JP 19892286 U JP19892286 U JP 19892286U JP H0427168 Y2 JPH0427168 Y2 JP H0427168Y2
- Authority
- JP
- Japan
- Prior art keywords
- holder
- motor
- nut member
- capillary
- shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 description 4
- 230000005484 gravity Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003909 pattern recognition Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986198922U JPH0427168Y2 (US20020051482A1-20020502-M00012.png) | 1986-12-27 | 1986-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986198922U JPH0427168Y2 (US20020051482A1-20020502-M00012.png) | 1986-12-27 | 1986-12-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63106136U JPS63106136U (US20020051482A1-20020502-M00012.png) | 1988-07-08 |
| JPH0427168Y2 true JPH0427168Y2 (US20020051482A1-20020502-M00012.png) | 1992-06-30 |
Family
ID=31160066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986198922U Expired JPH0427168Y2 (US20020051482A1-20020502-M00012.png) | 1986-12-27 | 1986-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0427168Y2 (US20020051482A1-20020502-M00012.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2509365Y2 (ja) * | 1990-11-30 | 1996-09-04 | 関西日本電気株式会社 | ワイヤボンディング装置 |
-
1986
- 1986-12-27 JP JP1986198922U patent/JPH0427168Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63106136U (US20020051482A1-20020502-M00012.png) | 1988-07-08 |
