JPH04271160A - Microwave integrated circuit module - Google Patents

Abstract

PURPOSE:To shorten an assembly time of a semiconductor chip and to improve microwave characteristics by coupling a chip carrier having input, output lead electrodes to a lead frame. CONSTITUTION:A chip carrier 10 has an input lead electrode 11 and an output lead electrode 12 formed with input matching circuit and output matching circuit patterns. Many carriers 10 are coupled to a lead frame 15. After a GaAsFET chip 4 is bonded, the electrodes 11, 12 and a ground lead electrode 13 are cut, and soldered to an MIC module. Accordingly, in an assembly of the chip 4, assembly is performed on the carrier 10 integral with the frame 15, and hence rapid and accurate automatic die bonding and wire bonding can be performed.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave integrated circuit module that operates in the microwave band.

0002

2. Description of the Related Art FIG. 3 is a plan view of a conventional microwave integrated circuit (hereinafter referred to as MIC) module that operates in the microwave band, with the top removed. In this figure, 1 is a module case body made of metal, 2 is a metal or ceramic module frame, and 3 is a ceramic terminal board that electrically connects the inside and outside of the module. 4
is a gallium arsenide field effect transistor (hereinafter referred to as GaAs
5 is a metal block for die-bonding the GaAsFET chip 4, 6 and 7 are an input matching circuit board and an output matching circuit board each having a conductor pattern formed on a ceramic substrate, and 8 is a metal block. The electrode lead terminal 9 is a bonding wire.

In the MIC module shown in FIG. 3, a GaAsFET chip 4, an input matching circuit board 6, an output matching circuit board 7, and a ceramic terminal board 3 are connected to each other by bonding wires 9 on a module case body 1. has been done. Therefore, the microwave signal inputted from the electrode lead terminal 8 is input/output matched by the input and output matching circuit boards 6, 7, so that Ga
It is amplified by the AsFET chip 4.

0004

[Problem to be solved by the invention] Conventional MIC module
Since the module is configured as described above, the MIC module
When assembling the module, first the input and output matching circuit boards 6, 7, the metal block 5 and the GaAsFET chip 4 are assembled.
After die bonding, it was necessary to wire bond each board with bonding wire 9. In other words, a relatively large input/output matching circuit board (5 mm x 10 mm)
)6,7 and a small GaAsFET chip (0.5mm x
Since the 0.5 mm) 4 is die-bonded and wire-bonded onto a small module, the assembly process is complicated and the assembly time is long. In addition, since the input and output matching circuit boards 6 and 7 are made of a ceramic substrate with a matching circuit printed on a conductor, the MIC module's microwave There was a problem that the characteristics also deteriorated.

The present invention was made to solve the above-mentioned problems, and an object of the present invention is to obtain a MIC module that is easy to assemble and has good microwave characteristics.

[0006]

[Means for Solving the Problems] The MIC module according to the present invention configures the input and output lead electrodes themselves into an input matching circuit and an output matching circuit, and connects these input and output lead electrodes to a chip. It is connected to a carrier, and a semiconductor chip is attached to this chip carrier.

[0007]

[Operation] In the MIC module of the present invention,
By connecting a chip carrier with input and output lead electrodes to a lead frame, assemblies such as die bonding and wire bonding of semiconductor chips can be performed on the lead frame rather than inside the module case. - Since it can be done while connected to the system, assembly time is shortened and
Dielectric loss and conductor loss are reduced, and microwave characteristics are improved.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows one embodiment of the present invention, and is a plan view of a MIC module with the top cover removed. In this figure, the same reference numerals as in FIG. 3 indicate the same parts, 10 is a ceramic chip carrier, and the input matching circuit and output matching circuit pattern are
It has an input lead electrode 11 and an output lead electrode 12, which are metal lead electrodes on which a ring is formed. Reference numeral 13 denotes a ground lead to which the source of the GaAsFET chip 4 is bonded with the bonding wire 9.
A lead electrode 14 is a metal block for grounding the ground lead electrode 13 to the module case body 1.

As shown in FIG. 2, the chip carrier 10 is connected to a number of lead frames 15, and after bonding the GaAsFET chips 4, input and output lead electrodes 11, 12 and the ground lead electrode 13 are cut, for example, at the positions shown by the dashed lines, and the M
Solder the IC module.

In the MIC module of the present invention, a GaAsFET chip 4 is bonded onto a chip carrier 10, and the GaAsFET chip 4 has an input lead that is an input matching circuit pattern and an output matching circuit pattern. A lead electrode 11 and an output lead electrode 12 are connected. Therefore, as in the conventional case, the microwave signal input from the electrode lead terminal 8 is transmitted to the GaAsFET chip 4.
is efficiently amplified.

[0011] Since the MIC module of the present invention uses a chip carrier with an input/output matching circuit, the drawbacks related to assembly and microwave characteristics that were problems of conventional modules are improved. . In other words, when assembling the GaAsFET chip 4, which requires the longest assembly time, it is not assembled within the module case, but rather on the chip carrier 10 that is integrated with the lead frame 15 as shown in FIG. The assembly process allows for fast and accurate automatic die and wire bonding. Furthermore, the input and output matching circuit of the present invention is not one in which conductors are printed on a ceramic substrate;
Since it is composed of metal input and output leads placed in a space, it is said that the MIC module has low ceramic dielectric loss and conductor loss, and has good microwave characteristics. effective. Furthermore, since no expensive ceramic matching circuit is used, there is the advantage that an inexpensive module can be constructed.

In the above embodiment, a GaAsFET chip is used as the microwave semiconductor device, and an amplifier circuit is used as the microwave integrated circuit. However, even if the microwave semiconductor device is a silicon bipolar transistor, the microwave integrated circuit The circuit may be an oscillation circuit, a mixer circuit, or the like, and the same effects as in the above embodiments can be achieved.

[0013]

[Effects of the Invention] As explained above, the present invention provides input,
The output lead electrodes serve as input and output matching circuits, and a microwave integrated circuit module is constructed using a chip carrier to which these input and output lead electrodes are connected.
The advantage is that a module with good microwave characteristics and low cost can be obtained with a simple assembly.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a microwave integrated circuit module according to an embodiment of the present invention, with the top cover removed.

FIG. 2 is a plan view of a chip carrier in a frame state used in the module of the present invention.

FIG. 3 is a plan view of a conventional microwave integrated circuit module with the top cover removed.

[Explanation of symbols]

1 Module case body 2 Module frame 3 Ceramic terminal board 4 GaAsFET chip 8 Electrode lead terminal 9 Bonding wire 10 Chip carrier 11 Input lead electrode 12 Output lead electrode 13 Ground lead electrode 14 Metal block 15 Lead frame

Claims (1)

[Claims] [Claim 1] Electrode lead terminals for inputting and outputting microwave signals, and input and output leads connected to the electrode lead terminals and formed with patterns of input and output matching circuits, respectively. 1. A microwave integrated circuit module comprising: a chip carrier provided with electrodes; and a semiconductor chip die-bonded to the chip carrier and subjected to necessary wire bonding to the input and output lead electrodes.