JPH0426786B2 - - Google Patents

Info

Publication number
JPH0426786B2
JPH0426786B2 JP61157901A JP15790186A JPH0426786B2 JP H0426786 B2 JPH0426786 B2 JP H0426786B2 JP 61157901 A JP61157901 A JP 61157901A JP 15790186 A JP15790186 A JP 15790186A JP H0426786 B2 JPH0426786 B2 JP H0426786B2
Authority
JP
Japan
Prior art keywords
metal
heat dissipation
full
wave rectifier
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61157901A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6314464A (ja
Inventor
Masayuki Yanagisawa
Katsumi Ebara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP15790186A priority Critical patent/JPS6314464A/ja
Publication of JPS6314464A publication Critical patent/JPS6314464A/ja
Publication of JPH0426786B2 publication Critical patent/JPH0426786B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Rectifiers (AREA)
JP15790186A 1986-07-07 1986-07-07 車両搭載用全波整流装置の製造方法 Granted JPS6314464A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15790186A JPS6314464A (ja) 1986-07-07 1986-07-07 車両搭載用全波整流装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15790186A JPS6314464A (ja) 1986-07-07 1986-07-07 車両搭載用全波整流装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6314464A JPS6314464A (ja) 1988-01-21
JPH0426786B2 true JPH0426786B2 (enrdf_load_html_response) 1992-05-08

Family

ID=15659902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15790186A Granted JPS6314464A (ja) 1986-07-07 1986-07-07 車両搭載用全波整流装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6314464A (enrdf_load_html_response)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2373092T3 (es) * 1999-02-26 2012-01-31 Valeo Equipements Electriques Moteur Módulo eléctrico para alternador de vehículo, en particular automóvil, y conjunto que incluye tal alternador y tal módulo.

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4538169A (en) * 1982-11-04 1985-08-27 Motorola, Inc. Integrated alternator bridge heat sink

Also Published As

Publication number Publication date
JPS6314464A (ja) 1988-01-21

Similar Documents

Publication Publication Date Title
US5856913A (en) Multilayer semiconductor device having high packing density
US3979659A (en) Automotive alternator rectifier bridges
JPWO2019098368A1 (ja) 半導体装置
JP5126278B2 (ja) 半導体装置およびその製造方法
JP2000091499A (ja) パワー半導体モジュール並びにそれを用いた電動機駆動システム
JP2006134990A (ja) 半導体装置
JP7196047B2 (ja) 電気回路体、電力変換装置、および電気回路体の製造方法
JP7555257B2 (ja) 電気回路体、電力変換装置、および電気回路体の製造方法
US9437508B2 (en) Method for manufacturing semiconductor device and semiconductor device
US20110127888A1 (en) Alternator with synchronous rectification equipped with an improved electronic power module
JPH10149901A (ja) 電気抵抗器および電気抵抗器の製造方法
JP2001118961A (ja) 樹脂封止型電力用半導体装置及びその製造方法
US9698076B1 (en) Metal slugs for double-sided cooling of power module
JP7019024B2 (ja) 半導体装置及び電力変換装置
JPH0426786B2 (enrdf_load_html_response)
JP4085639B2 (ja) 半導体装置およびその製造方法
JPS622587A (ja) ハイパワ−用混成集積回路
JPH0447972Y2 (enrdf_load_html_response)
US20110127863A1 (en) Alternator with synchronous rectification equipped with an improved electronic power module
JP2023013642A (ja) 半導体装置
JPH09213877A (ja) マルチチップモジュール半導体装置
JPH0323828Y2 (enrdf_load_html_response)
JPH05129515A (ja) 半導体装置
JPH0831546B2 (ja) ハイパワ−用回路基板及びその混成集積回路
JP7314886B2 (ja) 素子パッケージおよび半導体装置