JPH0426571A - Method for joining ceramics to metal - Google Patents
Method for joining ceramics to metalInfo
- Publication number
- JPH0426571A JPH0426571A JP12765690A JP12765690A JPH0426571A JP H0426571 A JPH0426571 A JP H0426571A JP 12765690 A JP12765690 A JP 12765690A JP 12765690 A JP12765690 A JP 12765690A JP H0426571 A JPH0426571 A JP H0426571A
- Authority
- JP
- Japan
- Prior art keywords
- ceramics
- metal
- thickness
- foil
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 18
- 239000002184 metal Substances 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 25
- 239000011572 manganese Substances 0.000 claims description 11
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 10
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 10
- 229910052748 manganese Inorganic materials 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 239000011888 foil Substances 0.000 abstract description 6
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 5
- 239000010935 stainless steel Substances 0.000 abstract description 5
- 229910052581 Si3N4 Inorganic materials 0.000 abstract description 3
- 239000011651 chromium Substances 0.000 description 6
- 238000001465 metallisation Methods 0.000 description 6
- 229910052804 chromium Inorganic materials 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910005091 Si3N Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- PEUPIGGLJVUNEU-UHFFFAOYSA-N nickel silicon Chemical compound [Si].[Ni] PEUPIGGLJVUNEU-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、セラミックスと金属との接合方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for joining ceramics and metal.
従来、セラミックス等の粉末成形体と金属とを接合する
には、先ず、セラミックスの表面をＭ。Conventionally, in order to join a powder compact such as a ceramic to a metal, first, the surface of the ceramic is M-shaped.
−ｕｎ法（テレフケン法）で金属化（メタライズ）ｌ八
その後にニッケル（Ｎｉ ）鍍金を施し、必要に応じて
応力！ｌｌ衝のための中間材を用い、銀（Ａｇ ）ろう
等で金属にろう接している。-Metallize using the un method (Telefuken method), then apply nickel (Ni) plating and apply stress as necessary. An intermediate material for contact is used, and the metal is soldered with silver (Ag) solder.
特開昭６０−１４５９７２号公報には、セラミックスと
熱膨張係数が近似している銅、モリブテン板を緩衝材と
して使用したセラミックスと金属の接合体か提案されて
いる。JP-A-60-145972 proposes a ceramic-metal bonded body using a copper or molybdenum plate, which has a coefficient of thermal expansion similar to that of ceramics, as a buffer material.
これら従来のセラミックスと金属の接合方法ては、セラ
ミックスと金属をろう接する前に、セラミ・ンクス表面
の金属化及び、鍍金工程か必要となるので作業能率が悪
く、また 銀ろうを使用した場合には、銀の融点か低い
ため、接合体の耐熱性が低くなる。These conventional methods of joining ceramics and metals require metallization of the surface of the ceramic and plating process before soldering the ceramics and metals, resulting in poor work efficiency and poor work efficiency when using silver solder. Since the melting point of silver is low, the heat resistance of the bonded body is low.
この点を改善するため１本出願人は、片面のみにクロー
ム鍍金を施した二・ンケル箔を用いてメタライズと同時
に接合する発明について、先に特許出願（特願平１−３
１３２２３号）している。In order to improve this point, the applicant has previously filed a patent application (Patent Application No. 1-3-3) for the invention of bonding at the same time as metallization using Ni-Nkel foil with chrome plating on only one side.
No. 13223).
（発明か解決しようとする。ｉ！題）
前記先願の発明では、接合のため高温で６０分程度の長
時間保持する必要かあるため、接合サイクル時間か長く
なり、生産性に問題かある。(Invention or attempt to solve. i! Problem) In the invention of the earlier application, it is necessary to hold the product at a high temperature for a long time of about 60 minutes for bonding, which increases the bonding cycle time and causes problems in productivity. .
本発明は前記の１１題を解決し、セラミックスと金属を
高能率て接合でき、しかも耐熱性か高く、接合品質の向
上を図ることを目的とするものである。The object of the present invention is to solve the above-mentioned 11 problems, to be able to bond ceramics and metals with high efficiency, to have high heat resistance, and to improve bonding quality.
〔Ｈ題を解決するための手段及び作用〕本発明は、セラ
ミックスと金属との間に両側を二”ｔケル板とした応力
緩衝材を介在させ、セラミックスと前記応力緩衝材との
間にクローム鍍金ヲ施しその上にマンガンを塗布したニ
ッケル箔を配設し、所定の真空状態て加熱、加圧するセ
ラミックスと金属との接合方法である。[Means and effects for solving problem H] The present invention provides a stress buffer material with 2" T Kel plates on both sides between the ceramic and the metal, and a chrome plate between the ceramic and the stress buffer material. This is a method of joining ceramics and metal by placing a plated nickel foil coated with manganese on top, heating and pressurizing it in a predetermined vacuum state.
ニッケル箔の表面層のマンガンかセラミックスと接触し
てその表面を迅速に金属化し、同時にニッケル板か金属
とセラミックスとをろう接する。The surface layer of the nickel foil is brought into contact with the manganese or ceramics to quickly metallize the surface, and at the same time the nickel plate or metal is soldered to the ceramics.
クローム鍍金は、ニッケルがセラミックス側に侵入して
ニッケルーシリコン化合物を生成するのを防止し、接合
部の接合強度と耐熱性か向上する。Chrome plating prevents nickel from entering the ceramic side and forming a nickel-silicon compound, improving the joint strength and heat resistance of the joint.
（実施ｆＮ） 本発明の実施例を図面について説明する。(Implementation fN) Embodiments of the present invention will be described with reference to the drawings.
第１図は１本発明の一実施例の説明図、第２図はセラミ
ックスに対するクローム及びマンカンの反応性を示すも
のである。FIG. 1 is an explanatory diagram of one embodiment of the present invention, and FIG. 2 shows the reactivity of chromium and mankan to ceramics.
先ず、本発明の着目点について説明する。第２図は、窒
化珪素（ＳｉｘＮｎ １セラミックス成形体に対するク
ローム（Ｃｒ ）及びマンガン（Ｍｎ）のメタライズ時
間と形成されるメタライズ層厚さの関係を示すもので、
図の（℃はマンガンを、（中はクロームを示すもので、
メタライズ温度を１０００℃とし、横軸のメタライズ時
間Ｔの単位は、Ｔ＋ｈ／ＫＳ沼としである。First, the focus of the present invention will be explained. Figure 2 shows the relationship between the metallization time of chromium (Cr) and manganese (Mn) and the thickness of the metallized layer formed on a silicon nitride (SixNn 1 ceramic molded body).
In the figure (℃ indicates manganese, (inside indicates chromium,
The metallization temperature is 1000° C., and the unit of the metallization time T on the horizontal axis is T+h/KS.
図から明らかなように、セラミックスとマンガンとの反
応性かクロームに比べて極めて良好であり、本発明は、
この点に着目してセラミックス成形体との接触面にマン
ガンを用いるようにしたものである。As is clear from the figure, the reactivity between ceramics and manganese is extremely good compared to chromium, and the present invention
Focusing on this point, manganese was used on the contact surface with the ceramic molded body.
１４１図に示すように、セラミックスとして窒化珪素（
Ｓｉ３Ｎ、）セラミックス成形体ｌと、金属としてステ
ンレス（ＳＵＳ３０４ ）２を接合対象材に選び、両者
の間に厚さ２．０−一のタンクステン（Ｗ）板３をはさ
んでその両側に厚さ０．３と（１，５ｍｍのニッケル板
４，５を配置し、また、セラミックス成形体１とニッケ
ル板５との間に、厚さＱ−２厘−のニッケル箔の片面に
４〜５ＪＬ−のクローム鍍金を施し、更にその玉にマン
ガンをスクリーン印刷等により塗布した箔６を、マンガ
ン層かセラミックス成形体ｌに当接するようにはさみ、
これらを５ Ｘ １０−’ｒｏ、、ｅのｌｔ″ｆｊ：中
で１１００℃に加熱し、０−５：１Ｋｇ／ａｓ”で加圧
して３０分間保持した。As shown in Figure 141, silicon nitride (
Si3N, ) ceramic molded body 1 and stainless steel (SUS304) 2 are selected as the materials to be joined, and a tank stainless steel (W) plate 3 with a thickness of 2.0-1 is sandwiched between the two, and thick Nickel plates 4 and 5 with a diameter of 0.3 and 1.5 mm are arranged, and between the ceramic molded body 1 and the nickel plate 5, a nickel foil of 4 to 5 mm thick is placed on one side of the nickel foil with a thickness of Q-2 mm. A foil 6 which is chromium-plated and further coated with manganese by screen printing or the like is held in contact with the manganese layer or the ceramic molded body l,
These were heated to 1100 DEG C. in a 5.times.10-'ro,.e lt"fj:, pressurized at 0-5:1 Kg/as" and held for 30 minutes.
その結果、平均接合強度：ｌ０Ｋｇ／ｓａ” 、耐熱温
度４囲℃か得られた。As a result, an average bonding strength of 10 Kg/sa" and a heat resistance temperature of 4 degrees Celsius were obtained.
セラミックスｌとステンレス２との間にタングステン板
３及びニッケル板４．５を配設してＮｉＷ Ｎ＋ Ｍ
を設けたのは、接合による熱応力の緩和を図ったもので
あり、二・シケル箔６にクローム鍍金を施したのは、ろ
う材としてのニッケルかセラミックス側に侵入してＮｉ
−５ｉの化合物を生成するのを防１１−するためである
。A tungsten plate 3 and a nickel plate 4.5 are arranged between the ceramic l and the stainless steel 2 to form NiW N+ M.
The purpose of this is to alleviate the thermal stress caused by bonding, and the chrome plating applied to the Ni-Sikel foil 6 is either due to nickel as a brazing material or because Ni penetrates into the ceramic side.
This is to prevent the formation of -5i compounds.
ろう材として銀を用いずニッケルを使用したことにより
、接合部の耐熱性か向上し、マンガン層を設けたことに
よりセラミックスの金属化か迅速に行えるので、接合に
要する時間か大幅に短縮てきる。By using nickel instead of silver as a brazing material, the heat resistance of the joint is improved, and by providing a manganese layer, the metallization of ceramics can be quickly performed, which significantly shortens the time required for joining. .
上記の接合条件は、真空度を１０−４〜１０”ア。ｒｒ
、加圧力を５〜７にｇ／ｃ■２、加熱温度を１０００〜
１２００°Ｃ１保持時間を１〜３０分の範囲で変更する
ことかでき、また、ステンレス以外の金属とセラミック
スの接合にも適用できる。The above bonding conditions are such that the degree of vacuum is 10-4 to 10"A.rr
, pressurizing force to 5~7g/c■2, heating temperature to 1000~
The holding time at 1200°C can be changed within the range of 1 to 30 minutes, and it can also be applied to joining metals other than stainless steel and ceramics.
（発明の効果）
本発明は、セラミックスと金属を短時間で効率良く接合
でき、しかも耐熱性が高く、接合品質か向上する効果が
有る。(Effects of the Invention) The present invention has the effect of being able to efficiently join ceramics and metals in a short time, having high heat resistance, and improving joining quality.
第１図は本発明の一実施例の説明図、第２図はセラミッ
クスに対するクローム及びマンガンの反応性を示す図で
ある。FIG. 1 is an explanatory diagram of one embodiment of the present invention, and FIG. 2 is a diagram showing the reactivity of chromium and manganese to ceramics.
Claims (1)
力緩衝材を介在させ、セラミックスと前記応力緩衝材と
の間にクローム鍍金を施しその上にマンガンを塗布した
ニッケル箔を配設し、所定の真空状態で加熱、加圧する
ことを特徴とするセラミックスと金属との接合方法。A stress buffer material with nickel plates on both sides is interposed between the ceramic and the metal, and a nickel foil coated with chrome and manganese is placed between the ceramic and the stress buffer material, and a predetermined A method of joining ceramics and metal that involves heating and pressurizing in a vacuum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2127656A JP2940070B2 (en) | 1990-05-17 | 1990-05-17 | Joining method of ceramics and metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2127656A JP2940070B2 (en) | 1990-05-17 | 1990-05-17 | Joining method of ceramics and metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0426571A true JPH0426571A (en) | 1992-01-29 |
| JP2940070B2 JP2940070B2 (en) | 1999-08-25 |
Family
ID=14965486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2127656A Expired - Lifetime JP2940070B2 (en) | 1990-05-17 | 1990-05-17 | Joining method of ceramics and metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2940070B2 (en) |
-
1990
- 1990-05-17 JP JP2127656A patent/JP2940070B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2940070B2 (en) | 1999-08-25 |
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