JPH0426172B2 - - Google Patents
Info
- Publication number
- JPH0426172B2 JPH0426172B2 JP24154087A JP24154087A JPH0426172B2 JP H0426172 B2 JPH0426172 B2 JP H0426172B2 JP 24154087 A JP24154087 A JP 24154087A JP 24154087 A JP24154087 A JP 24154087A JP H0426172 B2 JPH0426172 B2 JP H0426172B2
- Authority
- JP
- Japan
- Prior art keywords
- armature
- spring
- contact
- fixed
- movable electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007789 gas Substances 0.000 claims description 11
- 239000001257 hydrogen Substances 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 210000003437 trachea Anatomy 0.000 description 10
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- OPXJEFFTWKGCMW-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Ni].[Cu] OPXJEFFTWKGCMW-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24154087A JPS6484533A (en) | 1987-09-26 | 1987-09-26 | Sealing contact device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24154087A JPS6484533A (en) | 1987-09-26 | 1987-09-26 | Sealing contact device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6484533A JPS6484533A (en) | 1989-03-29 |
| JPH0426172B2 true JPH0426172B2 (es) | 1992-05-06 |
Family
ID=17075873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24154087A Granted JPS6484533A (en) | 1987-09-26 | 1987-09-26 | Sealing contact device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6484533A (es) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6136598B2 (ja) * | 2013-06-06 | 2017-05-31 | 株式会社明電舎 | 封止形リレー |
| JP6136597B2 (ja) | 2013-06-06 | 2017-05-31 | 株式会社明電舎 | 封止形リレー |
| CN105609377A (zh) * | 2016-01-29 | 2016-05-25 | 四川蓝讯宝迩电子科技有限公司 | 改进型接触器 |
| CN105609379A (zh) * | 2016-01-29 | 2016-05-25 | 四川蓝讯宝迩电子科技有限公司 | 能够调节分闸速度的接触器 |
-
1987
- 1987-09-26 JP JP24154087A patent/JPS6484533A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6484533A (en) | 1989-03-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment |
Free format text: PAYMENT UNTIL: 20080506 Year of fee payment: 16 |