JPH04260392A - Manufacture of multilayered printed wiring board - Google Patents

Abstract

PURPOSE:To easily remove a copper plated laminated board from a laminated metallic mold, metallic guide pin, and stainless steel plate used for a laminating process by putting a ring-like heat resistance resin member on the metallic guide pin of the laminated metallic mold. CONSTITUTION:A ring-like heat resistant resin member 3 made of a fluoroplastic is put on a metallic guide pin 1 having a diameter smaller than that of the positioning hole 8 of the printed wiring boards 7a and 7b for inner layer, prepregs 6a and 6b, and copper foil 5a and 5b of a laminated metallic mold 2. The boards 7a and 7b, prepregs 6a and 6b, and copper foil 5a and 5b are put on the metallic mold 2 by passing the member 3 through the hole 8 and the boards, prepregs, and foil are set to prescribed positions. Then the mold 2 is set on a hot press and the boards 7a and 7b, prepregs 6a and 6b, and foil 5a and 5b are welded to each other by hot pressing. After maintaining the temperature at a high level, the temperature and pressure are reduced to normal levels and the mold 2 is removed from the hot press.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing multilayer printed wiring boards used in computers, word processors, and the like.

0002

2. Description of the Related Art In the production of multilayer printed wiring boards, one of the important steps is to align and laminate a plurality of inner layer printed wiring boards.

A method of laminating inner layer printed wiring boards, prepregs and copper foils in the production of conventional multilayer printed wiring boards will be explained with reference to FIG. As shown in FIGS. 2(a) and 2(b), positioning holes are provided in the copper-clad laminate for the metal guide pins 1 of the laminated mold 2, and a conductor pattern is formed using a method such as etching. Inner layer printed wiring boards 7a, 7b whose pattern surfaces have been oxidized, prepregs 6a, 6b, 6c made of semi-hardened glass cloth impregnated with epoxy resin, and copper for forming the outermost layer conductor pattern. The foils 5a, 5b and the stainless steel plates 4a, 4b are overlapped at a predetermined position through their respective positioning holes 8. Next, set it in a heat press machine (not shown) and pressurize it.
By raising the temperature, inner layer materials 7a, 7b, prepregs 6a, 6b
, 6c, copper foils 5a and 5b are welded and laminated, and after cooling, a copper-clad laminate (hereinafter referred to as copper-clad laminate) having a conductive pattern on the welded and laminated inner layer is removed from the base 2.

[0004] In such a method of laminating copper-clad laminates, the inner layer materials 7a, 7b and the prepreg 6a are
, 6b, 6c adheres to the metal guide pin 1 and solidifies after cooling. Welding/
When separating the stacked copper-clad laminate from the lamination mold 2 and separating the copper-clad laminate from the stainless steel plates 4a and 4b,
A special jig with a spatula-shaped tip is inserted between the copper-clad laminate and the stainless steel plates 4a and 4b, or the metal guide pin 1 is hit with a hammer. This causes cohesive failure of the resin that is stuck to the surface. These separation operations significantly reduce productivity in the production of multilayer printed wiring boards, and also cause scratches and cracks in copper-clad laminates, which deteriorate yields in the lamination process and subsequent processes.

[0005] The present invention solves these problems, and facilitates the separation of the copper-clad laminate from the laminated mold, metal guide pin, and stainless steel plate in the lamination process, and at the same time improves the process yield. It is intended for this purpose.

[0006]

[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention fits a ring-shaped heat-resistant resin member around the outer periphery of a metal guide pin of a laminated mold, and from above the ring-shaped heat-resistant resin member. This method involves stacking multiple inner-layer printed wiring boards, prepregs, and copper foils through positioning holes, applying pressure and increasing temperature, and welding and laminating multiple inner-layer printed wiring boards, prepregs, and copper foils. be.

[0007]

[Function] By fitting a ring-shaped heat-resistant resin member around the outer periphery of the metal guide pin of the laminated mold, the inner layer printed wiring board and prepreg will soften and soften when heated and heated after being set in a heat press machine. The eluted resin does not come into direct contact with the metal guide pin, and after cooling, the eluted resin hardens, but the resin no longer adheres to the metal guide pin.

[0008]

[Example] An example of the present invention will be described below in Figs. 1(a) and (b).
) and (c). Note that in FIG. 1, the same parts as in FIG. 2 are given the same numbers.

First, a conductor pattern is formed on a copper-clad laminate with positioning holes by means such as etching, and the surface of the conductor pattern is oxidized to obtain inner layer printed wiring boards 7a and 7b. Printed wiring boards 7a, 7
Prepare prepregs 6a, 6b, 6c with positioning holes 8 of the same diameter at the same position as b and copper foils 5a, 5b,
As shown in (b), inner layer printed wiring boards 7a, 7b, prepregs 6a, 6b and copper foil 5a of the laminated mold 2 are shown.
, 5b, a ring-shaped heat-resistant resin member 3 made of fluororesin is fitted onto the outer periphery of a metal guide pin 1 having a diameter smaller than the diameter of the positioning hole 8 of the guide pin 1. , 5b. The thickness of the ring-shaped heat-resistant resin member 3 is 0.1 to 0.2 mm, and the inner layer printed wiring board 7a,
7b, the prepregs 6a, 6b, and the copper foils 5a, 5b are designed to be approximately 0.05 mm smaller than the positioning holes 8 of the foils 5a, 5b.

Next, as shown in FIG. 1(c), inner layer printed wiring boards 7a, 7b, prepregs 6a, 6b, 6c, and copper foil 5a are placed on top of the ring-shaped heat-resistant resin member 3.
, 5b and the stainless steel plates 4a, 4b at a predetermined position through the positioning holes 8. After that, it is set in a heat press machine, pressurized, heated, and maintained to weld the inner layer printed wiring boards 7a, 7b, prepregs 6a, 6b, 6c, and copper foils 5a, 5b, and after a predetermined period of time, After cooling and returning to normal temperature and pressure, the base 2 is removed from the heat press machine. Since the eluted resin does not adhere to the metal guide pins of the lamination mold 2 at all, the copper-clad laminate is easily removed from the base 2, and the lamination process is completed.

[0011] In this example, a fluorine-based resin was used for the heat-resistant resin member, but the resin is not limited to this as long as it has a heat resistance higher than the heating temperature during lamination. .

0012

As described above, according to the present invention, it is extremely easy to separate the copper-clad laminate from the metal guide pin and stainless steel plate of the lamination mold after hot pressing, and the lamination of the multilayer printed wiring board can be easily separated. This can greatly contribute to improving productivity in the process. In addition, it is possible to automate the separation work that was conventionally performed by operators, and at the same time, the copper-clad laminate is free from scratches and cracks, and the process yield can be significantly improved.

[Brief explanation of the drawing]

[Fig. 1] (a), (b), and (c) are cross-sectional views showing steps for explaining a method for manufacturing a multilayer printed wiring board in an embodiment of the present invention.

[Figure 2] (a) and (b) are cross-sectional views showing steps to explain the conventional manufacturing method.

[Explanation of symbols]

1 Metal guide pin 2 Base stand 3 Heat-resistant resin parts 5a, 5b Copper foil 6a, 6b, 6c Prepreg 7a, 7b Printed wiring board for inner layer 8 Positioning hole

Claims (1)

[Claims] Claim 1: A ring-shaped heat-resistant resin member is used, the ring-shaped heat-resistant resin member is fitted onto the outer periphery of a metal guide pin of a laminated mold, and then a plurality of heat-resistant resin members are inserted over the ring-shaped heat-resistant resin member. A method for manufacturing a multilayer printed wiring board, characterized by stacking an inner layer printed wiring board, prepreg, and copper foil through positioning holes, and welding and laminating a plurality of inner layer printed wiring boards, prepreg, and copper foil. .