JPH04260344A - Inner lead bonding equipment - Google Patents

Abstract

PURPOSE:To quantitatively measure the inclination of a bonding surface of a bonding tool to a bonding stage surface, by measuring the distances from a bonding stage to three or more measurement points positioned on the bonding surface of the bonding tool. CONSTITUTION:Points on a bonding surface 12 which are positioned on vertical lines of three measurement reference points on the bonding stage 22 side are turned into measurement points 271, 272, 273 of the bonding surface side 12. The lengths I1, I2, I3 between the measurement reference points 261, 262, 263 and the measurement points 271, 272, 273 are measured with a length measuring sensor 24. On the basis of the distances I1, I2, I3 at the measurement positions 261, 262, 263 of the length measuring sensor 24, the operation part of a controller 25 calculates the inclination of the bonding surface 12 to the bonding stage 22 surface. Further, correction values in the X, Y directions of the bonding surface 12 are calculated, and the bonding surface 12 of a bonding tool 11 is rotated and moved in the X, Y directions according to the correction values.

Description

[Detailed description of the invention]

[Purpose of the invention]

0001

[Industrial Application Field] The present invention relates to an electrode of a semiconductor element,
The present invention relates to an inner lead bonding device for bonding inner leads formed on a film carrier.

0002

2. Description of the Related Art A conventional internal lead bonding apparatus is shown in FIG. 1 is a film carrier tape, and inner leads 2 are formed at predetermined intervals in the transport direction. Reference numeral 3 designates a tape guide, which is provided with an opening at the center of the tape guide 3, which is a bonding position, and which guides the inner lead 2 of the film carrier tape 1, which is transported by a tape transport mechanism (not shown), to the tape guide 3. - Guide it to the bonding position along the bottom surface of the guide 3. A bonding stage 4 is provided below the opening of the tape guide 3 and mounts the semiconductor element 5 at a bonding position. 6
is a bonding tool, which has a bonding surface 7 on its lower surface for collectively bonding the electrodes of the semiconductor element 5 and the inner leads 2 by thermocompression bonding. A bonding tool 6 is fixed to a tool arm 8 above the bonding position by a tool holder 9 so as to be movable up and down. A base 10 is located above the tool arm 8 and supports the tool arm 8.

[0003] In the inner lead bonding apparatus constructed as described above, the film carrier tape 1 is transported along the lower surface of the tape guide 3 by a tape transport mechanism (not shown), and the film carrier tape 1 is transported along the lower surface of the tape guide 3. The bonding portion of the inner lead 2 formed in the tape guide 3 is guided to the bonding position located in the central opening of the tape guide 3. The semiconductor element 5 transferred by a transfer arm (not shown) is positioned and held at a bonding position on the bonding stage 4. Then, the bonding tool 6 descends to the bonding position in the opening of the tape guide 3. The inner leads 2 are bonded by thermocompression to the electrodes of the semiconductor element 5 using the bonding surface 7 of the bonding tool 6, thereby collectively bonding them. After bonding the semiconductor element 5 to the inner lead 2, the film carrier tape 1 is transported at a predetermined pitch 4 by the tape transport mechanism. This operation is repeated thereafter.

In such an internal bonding device, the electrode of the semiconductor element 5 and the film carrier tape are connected to each other.
In order to make a good connection between the inner leads 2 of the semiconductor element 5 and the inner leads 2, it is necessary to uniformly press the electrodes of the semiconductor element 5 and the inner leads 2 at the bonding surface 7. Therefore, the bonding surface 7 of the bonding tool 6 and the bonding stage 4
Parallelism with the surface is required.

Conventionally, as a method for adjusting the parallelism, a sheet of polyimide or the like is placed on the 4 surfaces of the bonding stage, the bonding tool 6 is lowered, and the sheet is placed on the heated bonding surface 7. Press the button. Thereafter, the inclination of the bonding surface 7 with respect to the surface of the bonding stage 4 is examined by visually observing the condition of the indentation on the sheet. Then, the inclination of the bonding surface 7 is finely adjusted by moving the bonding tool 6 with a fine adjustment screw. Parallelism was adjusted by repeating this series of operations.

[0006]

[Problem to be solved by the invention] In such a method,
Since the parallelism between the bonding surface 7 and the bonding stage 4 surface depends on the judgment of the person viewing the indentation state, there is a problem that it is not easy to adjust the parallelism and it takes time. Ta. Furthermore, there is a problem in that the degree of parallelism cannot be known numerically, and therefore the degree of parallelism cannot be accurately adjusted.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an inner tool that can quantitatively and numerically measure the inclination of a bonding tool with respect to a bonding surface and a bonding stage surface.
The purpose of the present invention is to provide a bonding device. [Structure of the invention]

[0008]

[Means for Solving the Problems] In order to achieve the above objects, the present invention has a conveyance means for conveying a film carrier on which an inner lead is formed, a bonding position,
a film carrier guide that guides the inner lead of the film carrier transported by the transport means to a bonding position; a bonding stage that mounts and supports a semiconductor element at the bonding position;

[0009] An inner lead is provided above the bonding position so as to be freely raised and lowered, and has a bonding tool for bonding the inner lead of the film carrier at the bonding position and the electrode of the semiconductor element on the bonding stage by thermocompression bonding. In the bonding device, a length measurement sensor is attached to the bonding stage and measures the distance between the bonding stage and three or more measurement points located on the bonding surface of the bonding tool; The present invention is characterized by providing a parallelism adjusting means for adjusting the parallelism of the bonding surface of the bonding tool with respect to the bonding stage surface in accordance with the detected value of the sensor.

0010

[Operation] With this structure, the distance between the bonding stage and three or more measurement points on the bonding surface of the bonding tool is determined by the length measurement sensor attached to the bonding stage. Measure. The parallelism of the bonding surface of the bonding tool with respect to the bonding stage surface is adjusted by the parallelism adjustment means in accordance with the detected value of the length measurement sensor.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the present invention will be described with reference to the drawings. In FIG. 2, a bonding tool 11 has a bonding surface 12 at its lower end. 13 is a base for rotation in the X direction, and below it is a tool holder 1.
4, the bonding tool 11 is fixed. 15 is Y
It is a base for rotation in the X direction, located on the back of the base 13 for rotation in the X direction, and perpendicular to the front of the base 15 for rotation in the Y direction.
A direction rotation shaft 16 is fixed. This X direction rotation axis 1
6 supports the X-direction rotation base 13 rotatably in the X-direction. Reference numeral 17 denotes a main base, which is arranged on the right side of the Y-direction rotation base 15, and is rotated by a Y-direction rotation shaft 18 fixed perpendicularly to the upper left side of the main base 15. The base 15 is rotatably supported in the Y direction (perpendicular to the drawing). Reference numeral 19 denotes a micrometer head for rotation in the X direction, which is arranged and fixed on the upper left side of the main base 17. The X-direction rotation micrometer head 19 can freely press the upper right side of the X-direction rotation head 13 to rotate the X-direction rotation base around the X-direction rotation shaft 16. A ball plunger 20 is arranged and fixed on the left side of the main base 17, and constantly presses the lower right side of the base 13 for rotation in the X direction. is in constant contact with the micrometer head 19 for rotation in the X direction. 21 is a micrometer head for rotation in the Y direction, and
The micrometer head 21 for rotation in the Y direction is fixed to the left side of the base 17, and the lower right front side of the base 15 for rotation in the Y direction is fixed to the left side surface.
The Y-direction rotation base 15 can be rotated in the Y-direction by pressing freely with the Y-direction rotation shaft 18 . A pole plunger is provided on the opposite side of the Y-direction rotation micrometer head 21 via the Y-direction rotation base 15, and constantly presses the Y-direction rotation base to rotate the Y-direction. The rotation base 15 is always in contact with the Y-direction rotation micrometer head 21. 22 is a bonding stage, and an XY table 23 movable in the X and Y directions.
is installed on top. 24 is a length measurement sensor, which is attached to the side surface of the bonding stage 22. 25
is a controller that freely controls XY table 23.
It is possible to move in this direction, and also to perform measurement operations on the length measurement sensor 24.

FIG. 3 is a diagram showing the measurement principle.
, 262 and 263 are measurement reference points on the bonding stage 22 side, which are set in advance by the controller 25. Using the XY table 23, the length measurement sensor 24 is sequentially moved to measurement reference points 261, 262, and 263. 271, 272, 273 are bonding surfaces 12
This is a measurement point on the side, and is provided on the bonding surface 12 on the lower surface of the bonding tool 11. Starting from each measurement reference point 261 , 262 , 263 , bonding surface 1 is perpendicular to bonding stage 22 surface.
Three measurement points 271 , 272 , 273 are located on 2.

The operation of the internal lead bonding apparatus constructed as described above will be explained. In FIGS. 1 and 2, the length measurement sensor 24 is moved to three measurement reference points 261 that are set in advance by moving the XY table 23 using the controller 25.
, 262 , 263 sequentially. Points on the bonding surface 12 located on the vertical line of the three measurement reference points on the bonding stage 22 side become measurement points 271 , 272 , 273 on the bonding surface 12 side. Measurement reference points 261 and 262 are determined by the length measurement sensor 24.
, 263 and the measurement points 271 , 272 , 273 , distances l1 , l2 , l3 are measured. Length measurement sensor
24 measurement positions 261 (x1, y1), 262
Based on the distances l1, l2, l3 at (x2, y2), 263 (x3, y3), the calculation section of the controller 25 calculates the inclination of the bonding surface 12 with respect to the surface of the bonding stage 22. Furthermore, correction values for the bonding surface 12 in the X and Y directions for making it parallel are calculated and displayed on the display panel on the controller 25. The operator moves the micrometer head 18 for rotation in the X direction and the micrometer head 21 for rotation in the Y direction using the controller 25 based on the correction values, and moves the base 13 for rotation in the X direction and the base 13 for rotation in the Y direction. - By rotating the base 15, the bonding surface 1 of the bonding tool 11
2 by the correction value in the X and Y directions. thus,
The parallelism between the bonding surface 12 and the bonding stage 22 surface can be finely adjusted.

The micrometer head 19 for rotation in the X direction and the micrometer head 20 for rotation in the Y direction are each driven by a servo motor. By rotating these servo motors according to commands from the controller, the micrometer head 19 for rotation in the X direction and the micrometer head 21 for rotation in the Y direction are moved. In this way, parallelism can be adjusted automatically.

As another embodiment, the inclination of the bonding surface can be measured without moving the bonding stage by changing the emission direction of the sensor light of the length measurement sensor.

[0016]

According to the present invention, the inclination of the bonding surface of the bonding tool with respect to the bonding stage surface can be quantitatively measured and adjusted. It becomes possible to make it parallel to. Therefore, it is possible to uniformly apply pressure to the electrodes and inner leads of the semiconductor element during bonding, so it is possible to provide an inner lead bonding apparatus that can perform stable and high quality bonding.

[Brief explanation of the drawing]

FIG. 1 is an external view of main parts of an inner lead bonding apparatus showing an embodiment of the present invention.

FIG. 2 is a perspective view showing measurement reference points and measurement points for measuring the inclination of a bonding surface in an embodiment of the present invention.

FIG. 3 is a front view of a bonding section of a conventional inner lead bonding device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1...Carrier tape, 2...Inner lead, 3...Tape guide, 4...Bonding stage, 5...Semiconductor element,
6... Bonding tool, 7... Bonding surface, 8... Tool arm, 9
...Tool holder, 10...Arm base, 11...Bonding tool,
12... Bonding surface, 13... Base for rotation in the X direction, 14... Tool holder, 15... Base for rotation in the Y direction, 16... Rotation axis in the X direction, 1
7...Main base, 18
...Y direction rotation axis, 19...Micrometer head for X direction rotation, 20...Ball plunger, 21...Micrometer head for Y direction rotation, 22...Bonding stage, 23...XY table,
24...Length measurement sensor, 25...Controller,
261 , 262 , 263
...Measurement reference point, 271, 272, 273...Measurement point.

Claims (1)

[Claims] 1. A transporting means for transporting a film carrier on which an inner lead is formed, a film carrier guide having a bonding position and guiding the inner lead of the film carrier transported by the transporting means to the bonding position, and a bonding method. A bonding stage that supports and mounts a semiconductor element at a position, and a bonding stage that is movable up and down above the bonding position, and the inner lead of the film carrier at the bonding position and the electrode of the semiconductor element on the bonding stage are bonded by thermocompression. The distance between the bonding stage and three or more measurement points located on the bonding surface of the bonding tool, which is attached to the bonding stage in an inner lead bonding device that has a bonding tool to be bonded. A length measurement sensor that measures the
An inner lead bonding apparatus comprising: a parallelism adjustment means for adjusting the parallelism of a bonding surface of a bonding tool with respect to a bonding stage surface in accordance with a detected value of a length measurement sensor.