JPH0425628Y2 - - Google Patents
Info
- Publication number
- JPH0425628Y2 JPH0425628Y2 JP5198787U JP5198787U JPH0425628Y2 JP H0425628 Y2 JPH0425628 Y2 JP H0425628Y2 JP 5198787 U JP5198787 U JP 5198787U JP 5198787 U JP5198787 U JP 5198787U JP H0425628 Y2 JPH0425628 Y2 JP H0425628Y2
- Authority
- JP
- Japan
- Prior art keywords
- test
- subject
- jig
- liquid
- test liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000012360 testing method Methods 0.000 claims description 37
- 239000007788 liquid Substances 0.000 claims description 23
- 238000007789 sealing Methods 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000009940 knitting Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Examining Or Testing Airtightness (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5198787U JPH0425628Y2 (US20020128544A1-20020912-P00008.png) | 1987-04-06 | 1987-04-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5198787U JPH0425628Y2 (US20020128544A1-20020912-P00008.png) | 1987-04-06 | 1987-04-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63159741U JPS63159741U (US20020128544A1-20020912-P00008.png) | 1988-10-19 |
JPH0425628Y2 true JPH0425628Y2 (US20020128544A1-20020912-P00008.png) | 1992-06-19 |
Family
ID=30876757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5198787U Expired JPH0425628Y2 (US20020128544A1-20020912-P00008.png) | 1987-04-06 | 1987-04-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0425628Y2 (US20020128544A1-20020912-P00008.png) |
-
1987
- 1987-04-06 JP JP5198787U patent/JPH0425628Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS63159741U (US20020128544A1-20020912-P00008.png) | 1988-10-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3693239A (en) | A method of making a micromodular package | |
KR100227121B1 (ko) | 뒷면 개방부를 갖는 반도체 소자 검사용 지지체 | |
US6843107B2 (en) | System and process for detecting leaks in sealed articles | |
US5098630A (en) | Method of molding a solid state image pickup device | |
JPH0425628Y2 (US20020128544A1-20020912-P00008.png) | ||
Shook et al. | Diffusion model to derate moisture sensitive surface mount IC's for factory use conditions | |
US7208773B2 (en) | Cap for semiconductor device | |
BRPI0413417B1 (pt) | "processo para fabricação de um dispositivo que requer um material de sorção não evaporável para sua operação". | |
JPS63249034A (ja) | 気密封止試験装置 | |
Cotofana et al. | Low-cost plastic sensor packaging using the open-window package concept | |
EP0436907A2 (en) | Resin mold packaged electronic parts | |
JPS6018941A (ja) | 半導体装置 | |
JP2859820B2 (ja) | 半導体圧力センサ | |
TWI227549B (en) | Optical sensor packaging method and its packaging structure | |
JPS63284835A (ja) | 気密封止型半導体装置の検査方法 | |
JP3341382B2 (ja) | 半導体装置の外観検査装置 | |
JPH0199244A (ja) | 半導体集積回路装置 | |
JPH0772351A (ja) | 光半導体モジュール | |
JPH04152555A (ja) | 半導体集積回路装置 | |
KR930000403Y1 (ko) | 확대경 부착식 기포시험기 | |
Duffalo et al. | Novel failure modes with overmolded printed circuit board-based surface mount packages | |
Ebel | Application of 1018.2 to Hybrid and VLSI Devices | |
KR200171360Y1 (ko) | 검사장비의소켓보드 | |
CA2176270C (en) | Hybrid microcircuit glass-to-metal seal repair process | |
JPH0442943A (ja) | 半導体装置の検査装置 |