JPH0425269U - - Google Patents
Info
- Publication number
- JPH0425269U JPH0425269U JP6583090U JP6583090U JPH0425269U JP H0425269 U JPH0425269 U JP H0425269U JP 6583090 U JP6583090 U JP 6583090U JP 6583090 U JP6583090 U JP 6583090U JP H0425269 U JPH0425269 U JP H0425269U
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- hole
- layer
- wiring board
- lands
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009413 insulation Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6583090U JPH0425269U (de) | 1990-06-21 | 1990-06-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6583090U JPH0425269U (de) | 1990-06-21 | 1990-06-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0425269U true JPH0425269U (de) | 1992-02-28 |
Family
ID=31598017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6583090U Pending JPH0425269U (de) | 1990-06-21 | 1990-06-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0425269U (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002071819A1 (fr) * | 2001-03-07 | 2002-09-12 | Sony Corporation | Pastille de carte de circuit imprime, procede de fabrication de la carte de circuit imprime et procede de montage de ladite carte |
| WO2020026959A1 (ja) * | 2018-07-31 | 2020-02-06 | 株式会社村田製作所 | 樹脂基板、および樹脂基板の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63119596A (ja) * | 1986-11-07 | 1988-05-24 | 日本電波工業株式会社 | 回路基板及びこれを使用した電子装置 |
| JPS6361181B2 (de) * | 1979-11-22 | 1988-11-28 |
-
1990
- 1990-06-21 JP JP6583090U patent/JPH0425269U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6361181B2 (de) * | 1979-11-22 | 1988-11-28 | ||
| JPS63119596A (ja) * | 1986-11-07 | 1988-05-24 | 日本電波工業株式会社 | 回路基板及びこれを使用した電子装置 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002071819A1 (fr) * | 2001-03-07 | 2002-09-12 | Sony Corporation | Pastille de carte de circuit imprime, procede de fabrication de la carte de circuit imprime et procede de montage de ladite carte |
| KR100887894B1 (ko) * | 2001-03-07 | 2009-03-11 | 소니 가부시끼 가이샤 | 프린트 배선판의 랜드부, 프린트 배선판의 제조 방법, 및프린트 배선판 실장 방법 |
| WO2020026959A1 (ja) * | 2018-07-31 | 2020-02-06 | 株式会社村田製作所 | 樹脂基板、および樹脂基板の製造方法 |
| JPWO2020026959A1 (ja) * | 2018-07-31 | 2021-03-25 | 株式会社村田製作所 | 樹脂基板、および樹脂基板の製造方法 |
| US11277919B2 (en) | 2018-07-31 | 2022-03-15 | Murata Manufacturing Co., Ltd. | Resin substrate and method for producing resin substrate |