JPH028080U - - Google Patents
Info
- Publication number
- JPH028080U JPH028080U JP8475988U JP8475988U JPH028080U JP H028080 U JPH028080 U JP H028080U JP 8475988 U JP8475988 U JP 8475988U JP 8475988 U JP8475988 U JP 8475988U JP H028080 U JPH028080 U JP H028080U
- Authority
- JP
- Japan
- Prior art keywords
- land
- component mounting
- wiring board
- printed wiring
- extension part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 239000012212 insulator Substances 0.000 claims 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8475988U JPH028080U (de) | 1988-06-27 | 1988-06-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8475988U JPH028080U (de) | 1988-06-27 | 1988-06-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH028080U true JPH028080U (de) | 1990-01-18 |
Family
ID=31309440
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8475988U Pending JPH028080U (de) | 1988-06-27 | 1988-06-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH028080U (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100346679C (zh) * | 2000-12-08 | 2007-10-31 | 日本电气株式会社 | 电路基板、使用该电路基板的电子设备和电路基板的分选方法 |
-
1988
- 1988-06-27 JP JP8475988U patent/JPH028080U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100346679C (zh) * | 2000-12-08 | 2007-10-31 | 日本电气株式会社 | 电路基板、使用该电路基板的电子设备和电路基板的分选方法 |