JPH0425196A - Manufacture of circuit module - Google Patents

Abstract

PURPOSE:To lessen a circuit module in manufacturing man-hours and cost by a method wherein through-holes through which terminals are inserted are provided to a circuit board, paste solder is applied onto the surfaces of through- hole lands and pads through printing, and the terminals and a surface mounting component are soldered concurrently through a reflow soldering method. CONSTITUTION:Ribs 10a are provided to the head of a terminal 10 through processing by a press. Paste solder 5A is applied onto the surfaces of pads 2 and through-hole lands 16 provided to the surface of a circuit board 1 through printing. Then, a surface mounting component 6 is placed on the pads 2, the rib 10a of the terminal 10 is press-fitted into a through-hole 15 to plant the terminal 10 upright on the circuit board 1. Thereafter, all the circuit board 1 is heated to reflow-solder the surface mounting component 6 and the terminal 10 to the pad 2 and the through-hole 15 respectively. By this setup, a circuit module can be lessened in manufacturing man-hours and improved in reliability of soldering.

Description

[Detailed Description of the Invention] [Summary] A method for manufacturing a circuit module in which surface mount components and input/output terminals connected to the outside are mounted on a circuit board, which reduces manufacturing man-hours and improves solder reliability. The aim is to provide a method for manufacturing circuit modules with high performance, by printing and applying paste-like solder to the surfaces of pads and through-hole lands arranged on the surface of the circuit board, respectively.
Next, the surface mount component is placed on the pad, and the folds formed on the head are press-fitted into the through-holes.
Terminals are planted on the circuit board, and then heated to reflow solder the surface mount components to the pads and the terminals to the through holes.

[Industrial application field]

The present invention relates to a method for manufacturing a circuit module in which surface-mounted components and input/output terminals connected to the outside are mounted on a circuit board.

With the demand for smaller size, higher density, and lower cost of devices such as OA equipment and electronic equipment 1 communication equipment, certain circuits (for example, circuits that process particularly high-speed signals) in these devices are required to be mounted on small circuit boards. There is a tendency to mount the circuit module on the motherboard by mounting desired circuit components on the motherboard to form a circuit module, attaching input/output terminals to the circuit module, and connecting the terminals to the motherboard.

[Conventional technology]

FIG. 4 is a diagram showing a conventional manufacturing process of a circuit module.

In FIG. 4, 1 is a circuit board made of, for example, a glass epoxy board, 6 is a surface mount component mounted on the circuit board 1, and 10 is a pin-type terminal for input/output of the circuit module.

On the circuit board 1, a circuit pattern (not shown) and pads 2 for surface mount components are arranged in a desired manner, and the desired pattern is extended near the side edge of the circuit board I, and a terminal is attached to each terminal. A pad 3 for use is formed.

A circuit module is constructed by soldering surface mount components 6 and terminals 10 to such a circuit board I.
Conventionally, the surface mount components 6 are first reflow soldered to the circuit board 1, and then the terminals 10 are manually soldered to the circuit board 1.

That is, as shown in FIG. 4(a), paste solder 5A is applied by printing onto the surface of the pad 2.

Next, align the electrodes or leads of the surface mount component with the corresponding pads 2, place the surface mount component 6 on the circuit board 1, and place the surface mount component 6 on the circuit board 1 using the adhesive force of the paste solder 5A. Attach temporarily.

In this state, the circuit board 1 is sent to, for example, a reflow soldering furnace and heated to melt the solder, and then cooled to harden the paste-like solder 5A to form the solder 5, as shown in FIG.
1]), a surface mount component 6 is reflow soldered to a circuit board 1 via a solder 5.

Thereafter, as shown in FIG. 4(C), the head of the terminal 10 is pressed against the surface of the terminal pad 3, the terminal 10 is held by hand, and the head of the terminal 10 and the terminal pad 3 are soldered. By soldering (manual soldering) using 8, the terminal 10 is planted on the circuit board l.

[Problem to be solved by the invention]

By the way, the conventional method described in item 1 is divided into two processes: a process for glue flow soldering of surface mount components and a process for soldering the terminals, and the soldering of the terminals is done manually.

Therefore, there is a risk that a large amount of man-hours will be required and the cost will be high.Also, since the terminals are soldered by hand, the solder may not be spread evenly around the terminals, or the terminals may be stuck at an angle. There was a problem.

The present invention was created in view of these points, and an object of the present invention is to provide a method for manufacturing a circuit module that reduces the number of manufacturing steps and has high soldering reliability.

[Means to solve the problem]

In order to achieve the above object, the present invention, as shown in FIG.
It is assumed that Oa is provided.

Then, paste solder 5A is applied by printing onto the surfaces of the pads 2 and through-hole lands 16 provided on the surface of the circuit board 1, respectively.

Next, the surface mount component 6 is placed on the pad 2, and the fold 10a of the terminal 10 is press-fitted into the through hole 5, so that the terminal 10 is planted on the circuit board 1.

Thereafter, the entire circuit board is heated to reflow solder the surface mount components 6 to the pads 2 and the terminals 10 to the through holes 15, respectively.

Furthermore, as shown in FIG. 2, the terminal 10 is provided with a flange 11 at the end surface of the head.

Then, paste-like solder 5A is applied by printing onto the surfaces of the pads 2 for the surface mounting portion and the through-hole lands 16 provided on the surface of the circuit board 1, respectively.

Next, the surface mount component 6 is placed on the pad 2, and
The terminal 10 is inserted into the through hole 15 and suspended so that the collar 11 is engaged with the through hole land 16.

Thereafter, the entire circuit board is heated to reflow solder the surface mount components 6 to the pads 2 and the terminals 10 to the through holes 15, respectively.

[Effect]

Since the present invention is a method of reflow soldering the surface mount component 6 and the terminal 10 at the same time in a two-way manner, the manufacturing time of the circuit module is shortened and the cost is reduced.

In addition, the reflow soldering was performed at the previous stage, so that the folds of the terminal 10],
Oa is press-fitted into the through hole 15 or the collar 11
is locked to the through-hole land 16, so
The terminal 10 is held perpendicularly to the surface of the circuit board 1.

Furthermore, the through-hole lands 16 are uniformly coated with paste solder 5A.

Therefore, the molten solder uniformly adheres to the head of the terminal 10, and the terminal 10 is soldered in a state where it stands at right angles without being tilted. That is, the reliability of soldering the terminals is high.

〔Example〕

The present invention will be specifically described below with reference to the drawings. Note that the same reference numerals refer to the same objects throughout the plan.

Figure 1 is a diagram showing the manufacturing process of the first invention, Figure 2 is a diagram showing the manufacturing process of the first invention.
FIG. 3 is a diagram showing the manufacturing process of another embodiment of the invention.

In FIG. 1, a circuit pattern (not shown) and pads 2 for surface mount components are arranged in a desired manner on one surface of a circuit board 1, and a desired pattern is formed on one surface of the circuit board 1.
The terminal extends near the side edge of the through-hole land 16 .

A through hole 15 is provided in the center of the through hole land 16.

Reference numeral 10 denotes a pin-shaped terminal for input/output of the circuit module, and the head portion inserted into the through hole 15 is formed with several longitudinally long folds 10 on the outer circumferential surface by pressing or the like.
A is provided.

In order to solder the surface mount component 6 and the terminal 10 to such a circuit board I, as shown in FIG. Paste solder 5A
Print and apply.

Next, as shown in FIG. 1(b), the surface mount component 6 is placed on the circuit board 1 by aligning the electrode or lead of the surface mount component with the corresponding para l' 2, and the paste solder 5A is placed on the surface mount component 6.
The surface mount component 6 is temporarily bonded onto the circuit board 1 by the adhesive force.

On the other hand, by press-fitting the folds 10a into the through holes 15, the terminals 10 are held vertically on the circuit board 1.

In this state, the circuit board 1 is sent to, for example, a reflow soldering furnace and heated to a solder melting temperature (for example, around 250° C.) to melt the paste solder 5A.

As a result, the pad 2 and the electrode (or lead) of the surface mount component 6 are bonded together via the molten solder.

On the other hand, the molten solder in the through-hole land 16 portion flows into the through-hole 15 and adheres to the head of the terminal 10, so that the terminal 10, the through-hole land 16, and the inner wall of the through-hole 15 are connected via the molten half IB. Glue.

Therefore, by taking out the circuit board 1 from the furnace, the first
As shown in Figure (C), the molten solder hardens and the solder 5
Thus, the surface mount component 6 is soldered onto the pad 2 via the solder 5, and the terminal 10 is soldered in a state where it is planted in the through hole 15.

In FIG. 2, a pin-shaped terminal 10 for input/output of a circuit module has its head crushed and a collar 11 provided on the end face of the head.

Note that the diameter of this collar j1 is preferably smaller than the diameter of the through-hole land 16.

As shown in FIG. 2(a), paste-like semi-IE5 is applied to the surface of the pad 2 and the surface of the through-hole land 16.
Print and apply A.

Next, align the electrodes or leads of the surface mount component with the corresponding pads 2, place the surface mount component 6 on the circuit board 1, and use the adhesive force of the paste solder 5A to place the surface mount component 6 on the circuit board 1. Attach temporarily.

On the other hand, insert the terminal 10 into the through hole I5, and
Through-hole land 16 via paste solder 5A
, and the terminal 10 is vertically suspended from the circuit board 1.

In this state, the circuit board 1 is sent to, for example, a reflow soldering furnace and heated to a solder melting temperature (for example, around 250° C.) to melt the paste solder 5A and perform reflow soldering.

At this time, the molten solder in the through-hole land 16 portion flows into the through-hole 15 and adheres not only to the lower end surface of the collar 11 but also to the periphery and upper end surface of the collar 11.

Therefore, by taking out the circuit board 1 from the furnace, the second
As shown in the figure (one), the molten material hardens and the solder 5
Thus, the surface mount component 6 is soldered onto the pad 2 via the solder 5, and the terminal 10 is soldered in a state where it is planted in the through hole 15.

FIG. 3 shows an embodiment in which surface mount components 6 are mounted on both sides of the circuit board 1.

The circuit board 1 shown in FIG. 3 has pads 2 arranged on one side IA and the other side IB, and through holes I5 near the left and right side edges.

Note that there are through holes 1 on both sides of the circuit board I.
A through-hole land 16 connected to the conductor No. 5 is provided.

First, as shown in FIG. 3(a), paste solder 5A is applied by printing onto the surface of one single-sided IA pad 2. As shown in FIG.

Next, as shown in FIG. 3 (one), adhesive 9 is applied between the opposing pads 2, respectively.

Then, as shown in FIG. 3(C), the electrodes or leads of the surface mount component are aligned with the corresponding pads 2, the surface mount component 6 is placed on the circuit board 1, and the adhesive strength of the paste solder 5A is The surface mount component 6 is temporarily bonded to the circuit board by using the adhesive 9, and the bottom surface of the surface mount component 6 is bonded to the circuit board 1 using an adhesive 9.

Next, as shown in FIG. 3 ((1)), turn the circuit board 1 over, turn the other side IB into two sides, and apply paste solder to the surfaces of the pads 2 and through-hole lands 16 on that side. Print and apply 5A.

Then, the surface mount component 6 is placed on the pad 2 of one side IB, and the surface mount component 6 is temporarily bonded to the circuit board by the adhesive force of the paste solder 5A.

On the other hand, the head of the terminal 10 is press-fitted into the through hole 15 to hold the terminal JO vertically on the circuit board 1.

In this state, the circuit board 1 is sent to a reflow soldering furnace and reflow soldered, as shown in FIG. 3(e).
The surface mount components 6 are soldered to both sides of the circuit board 1, and the terminals 10 are soldered while being planted in the λ through holes 15.

The circuit module configured as described above is shown in FIG.
), the terminals 10 are generally sealed and housed in a case 20 so as to protrude outward from the case cover 21 and mounted on a motherboard (not shown).

More specifically, 20 is a box-shaped case made of synthetic resin with one side open.

Reference numeral 21 denotes a case cover made of a synthetic resin plate that closes the opening of the case 20, and is provided with holes through which the terminals 10 pass, at positions corresponding to the respective terminals 10.

After inserting the circuit module into the case 20 so that the circuit board 1 is parallel to the bottom plate of the case 20 and supporting the edge of the circuit board 1 on a protrusion provided on the inner wall of the case 20, the adhesive 19 is applied. Then, the circuit board l is adhesively fixed to the case 20.

Next, the case cover 21 is inserted into the opening surface of the case 20 so that the terminals 10 pass through each of the arranged holes, and the gaps between the four circumferences of the case cover 21 and the inner wall of the case 20 are sealed with adhesive 19. At the same time, the gap between the hole in the case cover 21 and the terminal 10 is sealed with an adhesive (9).

〔Effect of the invention〕

As described above-1-, the present invention provides a through hole for inserting a terminal into a circuit board, and prints and coats the surface of the through hole land and the surface of the pad with a paste-like semi-[H] to bond the terminal and surface mounting. By attaching the parts and the reflow half 1'II at the same time, manufacturing of the circuit module =
■The two numbers are shortened, resulting in lower costs and higher soldering reliability, which has excellent practical effects.

[Brief explanation of drawings]

Figure 1 is a diagram showing the manufacturing process of the first invention, Figure 2 is a diagram showing the manufacturing process of the first invention.
FIG. 3 is a diagram showing the manufacturing process of another embodiment of the invention, and FIG. 4 is a diagram showing the conventional manufacturing process. In the figure, 1 is a circuit board, 2 is a pad, 3 is a terminal pad, 5 is solder, 5A is paste solder,
6 is a surface mount component, 9.19 is an adhesive, 1
0 is the terminal, ]Oa is the fold, II is the tsuba, 1
5 indicates a through hole, and 16 indicates a through hole land.

Claims (1)

[Claims] [1] Pad (2) arranged on the surface of the circuit board (1)
Paste solder (5A) is printed and coated on the surface of the pad (2) and through-hole land (16), and then the surface mount component (6) is placed on the pad (2), and the folds formed on the head are The terminal (10) is planted on the circuit board (1) by press-fitting the part (10a) into the through hole (15), and then heated to attach the surface mount component (6) to the pad (2).
), a method for manufacturing a circuit module, characterized in that the terminals (10) are reflow soldered to the through holes (15), respectively. [2] Pad (2) arranged on the surface of the circuit board (1)
Paste solder (5A) is printed and coated on the surfaces of the pads (16) and through-hole lands (16), and then the surface mount components (6) are placed on the pads (2) and formed on the end surface of the head. Connect the terminal (10) so that the collar (11) is engaged with the through-hole land (16).
is inserted into the through hole (15) and suspended, and then heated to reflow solder the surface mount component (6) to the pad (2) and the terminal (10) to the through hole (15), respectively. A method for manufacturing a circuit module, characterized in that: