JPH0424801B2 - - Google Patents

Info

Publication number
JPH0424801B2
JPH0424801B2 JP59236689A JP23668984A JPH0424801B2 JP H0424801 B2 JPH0424801 B2 JP H0424801B2 JP 59236689 A JP59236689 A JP 59236689A JP 23668984 A JP23668984 A JP 23668984A JP H0424801 B2 JPH0424801 B2 JP H0424801B2
Authority
JP
Japan
Prior art keywords
light
light emitting
back cover
emitting diode
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59236689A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61116701A (ja
Inventor
Kazuki Takahashi
Hiroyuki Serizawa
Masaji Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Priority to JP59236689A priority Critical patent/JPS61116701A/ja
Publication of JPS61116701A publication Critical patent/JPS61116701A/ja
Publication of JPH0424801B2 publication Critical patent/JPH0424801B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
JP59236689A 1984-11-12 1984-11-12 車輛用灯具 Granted JPS61116701A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59236689A JPS61116701A (ja) 1984-11-12 1984-11-12 車輛用灯具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59236689A JPS61116701A (ja) 1984-11-12 1984-11-12 車輛用灯具

Publications (2)

Publication Number Publication Date
JPS61116701A JPS61116701A (ja) 1986-06-04
JPH0424801B2 true JPH0424801B2 (fr) 1992-04-28

Family

ID=17004310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59236689A Granted JPS61116701A (ja) 1984-11-12 1984-11-12 車輛用灯具

Country Status (1)

Country Link
JP (1) JPS61116701A (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS634501A (ja) * 1986-06-25 1988-01-09 株式会社小糸製作所 照明装置
JP2654650B2 (ja) * 1987-12-14 1997-09-17 三菱電線工業株式会社 送電鉄塔用航空障害灯
JP2602063B2 (ja) * 1988-06-10 1997-04-23 三菱電線工業株式会社 発光ダイオード照明具
JP7479192B2 (ja) * 2020-05-14 2024-05-08 スタンレー電気株式会社 車両用灯具

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55132083A (en) * 1979-03-30 1980-10-14 Sanyo Electric Co Ltd Light emitting diode substrate
JPS5834301B2 (ja) * 1972-12-11 1983-07-26 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション インクフクシヤシキソウチ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834301U (ja) * 1981-08-31 1983-03-05 スタンレー電気株式会社 車輛用表示灯

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834301B2 (ja) * 1972-12-11 1983-07-26 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション インクフクシヤシキソウチ
JPS55132083A (en) * 1979-03-30 1980-10-14 Sanyo Electric Co Ltd Light emitting diode substrate

Also Published As

Publication number Publication date
JPS61116701A (ja) 1986-06-04

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