JPH0424373B2 - - Google Patents

Info

Publication number
JPH0424373B2
JPH0424373B2 JP12865888A JP12865888A JPH0424373B2 JP H0424373 B2 JPH0424373 B2 JP H0424373B2 JP 12865888 A JP12865888 A JP 12865888A JP 12865888 A JP12865888 A JP 12865888A JP H0424373 B2 JPH0424373 B2 JP H0424373B2
Authority
JP
Japan
Prior art keywords
formula
molding
prepreg
laminate
flame retardant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12865888A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01299837A (ja
Inventor
Toshiharu Takada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP12865888A priority Critical patent/JPH01299837A/ja
Publication of JPH01299837A publication Critical patent/JPH01299837A/ja
Publication of JPH0424373B2 publication Critical patent/JPH0424373B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
JP12865888A 1988-05-26 1988-05-26 積層板の製造方法 Granted JPH01299837A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12865888A JPH01299837A (ja) 1988-05-26 1988-05-26 積層板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12865888A JPH01299837A (ja) 1988-05-26 1988-05-26 積層板の製造方法

Publications (2)

Publication Number Publication Date
JPH01299837A JPH01299837A (ja) 1989-12-04
JPH0424373B2 true JPH0424373B2 (enrdf_load_stackoverflow) 1992-04-24

Family

ID=14990249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12865888A Granted JPH01299837A (ja) 1988-05-26 1988-05-26 積層板の製造方法

Country Status (1)

Country Link
JP (1) JPH01299837A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020053534A (ja) * 2018-09-26 2020-04-02 パナソニックＩｐマネジメント株式会社 積層板の製造方法、プリント配線板の製造方法及び積層板製造装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002194211A (ja) * 2001-10-29 2002-07-10 Hitachi Chem Co Ltd 印刷配線板用樹脂組成物、ワニス、プリプレグ及びそれを用いた印刷配線板用積層板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020053534A (ja) * 2018-09-26 2020-04-02 パナソニックＩｐマネジメント株式会社 積層板の製造方法、プリント配線板の製造方法及び積層板製造装置
WO2020066792A1 (ja) * 2018-09-26 2020-04-02 パナソニックＩｐマネジメント株式会社 積層板の製造方法、プリント配線板の製造方法及び積層板製造装置

Also Published As

Publication number Publication date
JPH01299837A (ja) 1989-12-04

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