JPH04235529A - Manufacture of wiring substrate - Google Patents

Abstract

PURPOSE:To facilitate washing after exfoliation of a resist and reducing the dimension of a manufacturing device by facilitating the exfoliation of the resist after etching is carried out by using the positive type resist. CONSTITUTION:An ITO(indium tin oxide) film is formed on a substrate, and a positive type resist is applied. After the resist is heated-hardened, ultraviolet rays are radiated on the resist staying in other than in an electrode formation region, and after development, the ITO film is subjected to etching. Then, ultraviolet rays are radiated on the whole surface of the substrate, and after the resist covering the electrode is softened, the exfoliation of the resist is carried out by a resist exfoliation liquid, which is perfectly removed through washing.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a wiring board for forming electrodes of a liquid crystal display element.

0002

2. Description of the Related Art FIG. 4 is a process diagram showing a conventional manufacturing method for forming band-shaped electrodes 4 and 5 used in a liquid crystal display element 1, and FIG. 2 is a cross-sectional view of the liquid crystal display element 1. and are commonly referred to in the Examples. In step a1, an ITO (indium tin oxide) film, which is the material of electrodes 4 and 5, is formed on the transparent substrates 2 and 3, and in step a2, the ITO
A positive resist is applied onto the membrane. In step a3, pre-baking is performed to heat and harden the resist applied in step a2, and in step a4, areas other than the areas where the electrodes 4 and 5 are formed are exposed to light. In step a5, the resist is developed, and the exposed portions of the resist are peeled off using, for example, a 1% NaOH solution. After that, washing with water and drying are performed, and if the strength of the resist on the electrode 4, 5 formation area is insufficient in the etching in step a7 to be described later, a post-baking is performed in step a6 to further heat and harden the resist. . In step a7, the ITO film is etched to form electrodes 4 and 5, and in step a8, a solution with a higher concentration than the developer, for example 1% NaO, is used for development.
When a H solution is used, the resist on the electrodes 4 and 5 is stripped off using a stripping solution of 3% NaOH solution. Thereafter, in step a9, the substrates 2 and 3 on which the electrodes 4 and 5 are formed are cleaned.

0003

[Problem to be solved by the invention] In the above-mentioned prior art,
A highly concentrated stripping solution is used when stripping off the resist on the electrodes 4 and 5. If the stripping solution remains on the substrates 2, 3 and the electrodes 4, 5, it may be difficult to form the alignment films 6, 7 uniformly during the formation of the alignment films 6, 7, which is the next step in the manufacturing process of the liquid crystal display element 1. This causes a problem in that display unevenness occurs and display quality deteriorates. In order to solve this problem, it is necessary to completely remove the resist stripping solution in the cleaning step performed in step a9. Therefore, the cleaning process and manufacturing equipment become complicated, such as using brushes or ultrasonic waves to clean the substrates 2 and 3. Furthermore, since repeated cleaning must be performed, there is a problem that the apparatus becomes larger.

[0004] An object of the present invention is to provide a method for manufacturing a wiring board, which makes it possible to easily peel off the coating layer on the wiring and to simplify the manufacturing method, thereby making it possible to downsize the device.

[0005]

[Means for Solving the Problems] The present invention provides a method for manufacturing a wiring board in which wiring made of a conductor is formed on a base material, which includes the following steps A) to E). This is a method for manufacturing a substrate.

A) A conductive layer serving as wiring is formed on a base material, and a coating layer made of a photosensitive material is further applied thereon.

B) Exposing a portion of the covering layer other than the area that will become the wiring.

C) After developing the coating layer, the conductor layer is etched to form wiring on the base material.

D) The entire surface of the base material is exposed to light.

E) Peel off the coating layer on the wiring.

[0011]

[Operation] According to the present invention, as a method for manufacturing a wiring board in which wiring made of a conductor is formed on a base material, a conductive layer that will become the wiring is first formed on the base material, and then a photosensitive layer is formed on the conductive layer. Apply a covering layer of a synthetic material. Next, a portion of the covering layer other than the region that will become the wiring is exposed, and after development, the conductor layer is etched to form the wiring on the base material. Thereafter, the entire surface of the base material is exposed to light, and the coating layer on the wiring is peeled off.

0012

[Example] FIG. 1 is a process diagram illustrating the process of forming band-shaped electrodes 4 and 5 used in a liquid crystal display element 1 according to an embodiment of the present invention, and FIG. 1 is a cross-sectional view of a liquid crystal display element 1. FIG. Translucent substrate 2, which is a pair of base materials;
Band-shaped electrodes 4 and 5, which are wiring formed in the process shown in FIG. 1, are formed on the electrode 3 at a predetermined interval. Alignment films 6 and 7 are formed thereon and subjected to a rubbing process. Both substrates 2 and 3 are faced to each other so that electrodes 4 and 5 are perpendicular to each other, and after being bonded together with a sealing material 8, liquid crystal 9 is injected to complete the liquid crystal display element 1.

FIG. 3 is a sectional view showing the manufacturing process of electrodes 4 and 5 according to an embodiment of the present invention.

In step b1 of FIG. 1, an ITO (indium tin oxide) film 10, which is a conductive layer, is formed on the transparent substrates 2 and 3, and in step b2, a coating layer is formed on the ITO film 10. A positive resist 11 made of, for example, novolac resin is applied as shown in FIG. 3(1). In step b3, prebaking is performed to heat and harden the resist 11. As conditions for prebaking, for example, in the case of batch processing, processing is performed at a temperature of 80° C. for 30 minutes, and in the case of continuous processing, processing is performed at a temperature of 120° C. for 2 to 3 minutes.

In step b4, exposure to ultraviolet light is performed through the pattern 12 having through holes 12a in areas other than the areas where the electrodes 4 and 5 are formed, as shown in FIG. 3(2). For example, this ultraviolet light has a wavelength of 365 nm and an intensity of 120 mJ/
irradiated at cm2. In step b5, development is performed, and in step b4, the portion of the resist 11 irradiated with ultraviolet light is removed by a developer. As a developer, for example, 1%
A NaOH solution or the like is used. In step b7, IT
Although the O film 10 is etched, the electrodes 4 and 5
If the resist 11 covering the area is not strong enough for the etching solution used in step b7, post-baking is performed to harden the resist 11 by heating in step b6. The conditions for post-bake are, for example, the same as those shown for pre-bake.

In step b7, the ITO film 10 is etched using, for example, strong acid to form the electrodes 4 and 5 as shown in FIG. 3(3). In step b8, the entire surface of the substrates 2 and 3 on which the electrodes 4 and 5 are formed is exposed to ultraviolet light as shown in FIG. 3(4). Although the ultraviolet light irradiation conditions are the same as the pattern exposure performed in step b4, step b6
When post-baking is performed, the intensity of the ultraviolet light may be increased in accordance with the curing of the resist 11.

In step b9, the resist 11 is removed as shown in FIG. 3(5). The conditions for removing resist 11 are as follows:
For example, the developing conditions are the same as those in step b5. Process b
In step 10, cleaning is performed to remove the stripping liquid.

As described above, according to this embodiment, the electrodes 4,
There is no need to use a highly concentrated stripping solution to remove the resist 11 formed on the resist 5. As a result, the stripping solution used in the prior art can be diluted and the amount of stripping solution used can be reduced. Since a low concentration stripping solution is used, cleaning for removing the stripping solution can be easily performed. For example, in the prior art, four stages of showers were used, but in this embodiment, the stripping liquid can be removed by using three stages of showers. Therefore, the manufacturing apparatus can be downsized. Further, since the stripping liquid can be removed without performing brush cleaning, ultrasonic cleaning, etc., which were performed in the prior art, it is possible to further downsize the manufacturing apparatus. When performing brush cleaning or ultrasonic cleaning, the cleaning time can be shortened, so the manufacturing time can be shortened. Also,
According to this embodiment, an effect was also obtained in that cleaning could be performed more reliably than in the prior art.

[0019] Therefore, the coating layer on the wiring can be easily peeled off, and the manufacturing apparatus can be downsized using a simplified manufacturing method.

In this example, the resist 11 was easily peeled off by irradiating the resist 11 with ultraviolet light; however, the method is not limited to ultraviolet light, and may vary depending on the resist 11 used. Irradiation with infrared light or visible light may also be performed.

Further, in this embodiment, the strip-shaped electrodes 4 and 5 of the liquid crystal display element 1 have been described as the wiring, but the shape is not limited to the strip-shaped one, and the wires can be similarly used for wiring other than the liquid crystal display element. be able to. Furthermore, although ITO is used as the material for the electrodes 4 and 5, it is not limited to this.

[0022]

According to the present invention, after the conductor layer is etched to form wiring, the entire surface of the base material is exposed to light, and the coating film covering the wiring is exposed. Therefore, the coating film on the wiring can be easily peeled off, the method for manufacturing the wiring board can be simplified, and the manufacturing apparatus can be downsized.

[Brief explanation of the drawing]

FIG. 1 is a process diagram illustrating steps for forming band-shaped electrodes 4 and 5 used in a liquid crystal display element 1 according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a liquid crystal display element 1 using band-shaped electrodes 4 and 5. FIG.

FIG. 3 is a cross-sectional view showing the manufacturing process of electrodes 4 and 5 according to an embodiment of the present invention.

[Fig. 4] Strip-shaped electrodes 4 and 5 used in the liquid crystal display element 1
1 is a process diagram showing a conventional manufacturing method for forming a

[Explanation of symbols]

2, 3 Board 4,5 Electrode 10 ITO film 11 Resist

Claims (1)

[Claims] 1. A method for manufacturing a wiring board comprising wiring made of a conductor formed on a base material, the method comprising the following steps A) to E). A) A conductive layer serving as wiring is formed on a base material, and a coating layer made of a photosensitive material is further applied thereon. B) Exposing a portion of the covering layer other than the area that will become the wiring. C) After developing the coating layer, the conductor layer is etched to form wiring on the base material. D) The entire surface of the base material is exposed. E) Peel off the coating layer on the wiring.