JPH0423416B2 - - Google Patents
Info
- Publication number
- JPH0423416B2 JPH0423416B2 JP56088394A JP8839481A JPH0423416B2 JP H0423416 B2 JPH0423416 B2 JP H0423416B2 JP 56088394 A JP56088394 A JP 56088394A JP 8839481 A JP8839481 A JP 8839481A JP H0423416 B2 JPH0423416 B2 JP H0423416B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- semiconductor substrate
- thin film
- etched
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005530 etching Methods 0.000 claims description 65
- 239000000758 substrate Substances 0.000 claims description 63
- 239000004065 semiconductor Substances 0.000 claims description 59
- 239000010409 thin film Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 21
- 229920002120 photoresistant polymer Polymers 0.000 claims description 18
- 238000001312 dry etching Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 150000002500 ions Chemical class 0.000 description 22
- 239000007789 gas Substances 0.000 description 19
- 238000009792 diffusion process Methods 0.000 description 6
- 230000005684 electric field Effects 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8839481A JPS57202734A (en) | 1981-06-09 | 1981-06-09 | Method and device for manufacturing of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8839481A JPS57202734A (en) | 1981-06-09 | 1981-06-09 | Method and device for manufacturing of semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57202734A JPS57202734A (en) | 1982-12-11 |
| JPH0423416B2 true JPH0423416B2 (de) | 1992-04-22 |
Family
ID=13941574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8839481A Granted JPS57202734A (en) | 1981-06-09 | 1981-06-09 | Method and device for manufacturing of semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57202734A (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6030887A (en) * | 1998-02-26 | 2000-02-29 | Memc Electronic Materials, Inc. | Flattening process for epitaxial semiconductor wafers |
| WO1998044549A1 (en) * | 1997-04-03 | 1998-10-08 | Memc Electronic Materials, Inc. | Flattening process for epitaxial semiconductor wafers |
| US6200908B1 (en) | 1999-08-04 | 2001-03-13 | Memc Electronic Materials, Inc. | Process for reducing waviness in semiconductor wafers |
| JP2005209809A (ja) * | 2004-01-21 | 2005-08-04 | Murata Mfg Co Ltd | エッチング装置およびこれを用いたエッチング方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5179650A (ja) * | 1975-01-08 | 1976-07-12 | Hitachi Ltd | Supatsutaetsuchingusochi |
| JPS557646U (de) * | 1978-06-29 | 1980-01-18 |
-
1981
- 1981-06-09 JP JP8839481A patent/JPS57202734A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5179650A (ja) * | 1975-01-08 | 1976-07-12 | Hitachi Ltd | Supatsutaetsuchingusochi |
| JPS557646U (de) * | 1978-06-29 | 1980-01-18 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57202734A (en) | 1982-12-11 |
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