JPH0423335Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to an optical semiconductor device lead bending inspection device, and in particular to a device that transports an optical semiconductor device having a pair of leads while determining whether the leads are bent or not. .

[Technical background of the invention]

As is well known, a light receiving element is known as a device that receives light from a light emitting diode or the like. Such a light receiving element is generally provided with a pair of leads. By the way, since the leads of these light receiving elements are made of metal, they tend to bend even with some force.
It was necessary to inspect the lead for bending.

Conventionally, defects in the shape of the light-receiving element, such as bent leads, have been removed by visual inspection by an operator.

[Problems with background technology]

However, according to the prior art, the lead bending of the light receiving element is visually inspected by an operator, which takes a lot of time and does not improve work efficiency. Further, the standard for lead bending is not constant.

[Purpose of invention]

The present invention has been developed in view of the above circumstances, and is an optical semiconductor element lead bending inspection device that can automatically determine lead bending of optical semiconductor elements such as light receiving elements based on a certain standard, thereby improving work efficiency. The purpose is to provide

[Summary of the idea]

The present invention includes a rail for transporting an optical semiconductor element that is curved at a predetermined location and has a pair of leads while being lowered, and a rail provided near the curved portion of the rail.
A guide having a notch having a pitch different from the pitch of the leads of the optical semiconductor element and a predetermined width is provided at the upper end thereof, and by applying vibration to the rail, the optical semiconductor can be easily bent. The leads of the device are passed through the notch, the center of gravity of the device is moved to the opposite side of the guide, the optical semiconductor device is shaken off the rail, and only the optical semiconductor device with less lead bending is placed in the curved portion. The main feature is that the lead bending test for optical semiconductor devices can be carried out according to a certain standard with good workability.

In the present invention, the pitch of the notch provided in the guide and the pitch of the leads of the optical semiconductor element are different. Therefore, when vibrations are applied to the rail in the horizontal and vertical directions, an optical semiconductor element with many lead bends is guided by a pair of leads of the optical semiconductor element into the notch part of the guide at the curved part of the rail, respectively.
The optical semiconductor element falls on the opposite side from the guide. On the other hand, in the case of optical semiconductor devices with less lead bending,
Even when the optical semiconductor element comes to a curved part of the rail, one of the leads is not guided by the notch of the guide, endures the vibration of the rail, and is transported to a predetermined location without being shaken off. . This results in
It is easy to determine whether the leads of an optical semiconductor device are bent or not.

[Example of idea]

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. Here, FIG. 1 is a schematic perspective view of an optical semiconductor element lead bend inspection apparatus according to the present invention, and FIG. 2 is a partially enlarged perspective view of FIG. 1.

1 in the figure is a band-shaped and spiral rail of a parts field (not shown). A predetermined portion of this rail 1 has an inwardly curved portion (curved portion) 2. This curved portion 2 is provided with an upper guide 3 and a lower guide 4 that is integrated with the rail 1. The upper guide 3 is curved in the same direction as the rail 1, and the curved portion 2 of the rail 1 touches the envelope end of the light receiving element 5.
A plurality of notches 7 are provided at the upper end of the lower guide 4 to guide the leads 6 of the light receiving element 5. Here, the pitch of the notches 7, 7 and the pitch of the leads 6, 6 of the light receiving element 5 are different. A defective box (not shown) is provided below the curved portion 2 of the rail 1 to accommodate the light-receiving element 5 with a large lead bend.

Next, the operation of the optical semiconductor element lead bend inspection apparatus having such a structure will be explained.

First, the light receiving element 5 having a pair of leads is aligned in a certain direction on the rail 1 which is vibrated in the horizontal direction (arrow X) and the vertical direction (arrow Y). It is supplied so as to pass through the lower guide 4. At this time, the lead 6 of the light receiving element 5
If there is little bending, one of the pair of leads 6, 6 will come into contact with the inner wall of the lower guide 4, as shown in FIG. It is sent downward while touching the test section, and flows to the test section shoot rail (not shown). On the other hand, if the lead 6 of the light-receiving element 5 is bent a lot, the light-receiving element 5
The pair of leads 6, 6 enter the notches 7, 7 of the lower guide 4, respectively, and the center of gravity of the light receiving element 5 is inclined to the inside of the rail 1 (arrow Z), and the light receiving element 1 is placed at the curved part 2 of the rail 1. It falls into the defective box. In this way, the light-receiving elements 5 with few lead bends and the light-receiving elements 5 with many lead bends are sorted out.

According to the present invention, the curved portion 2 is provided at a predetermined location of the strip-like spiral rail 1, the upper guide 3 for guiding the light receiving element 5 is provided on the curved portion 2, and the upper guide 3 for guiding the light receiving element 5 is provided on the curved portion 2. Since the lower guide 4 is provided with a notch 7 having a pitch different from the pitch between the leads of the light-receiving element 5, the light-receiving element 5 with less lead bending is sent as is to the test section shoot rail as described above. The light receiving element 5 with many bent leads can be dropped into the defective box at the curved portion. Therefore, it is possible to automatically determine whether the lead of the light receiving element 5 is bent or not based on a certain standard.
As a result, workability can be improved. Furthermore, electrical and software processing is not required, making the device inexpensive.

In the above embodiments, the case where the rail is strip-shaped and spiral-shaped is described, but the rail is not limited to this, and any rail that allows an optical semiconductor element such as a light-receiving element to be gradually lowered by vibration may be used.

Further, in the above embodiment, an upper guide is provided to guide the end portion of the envelope of the light receiving element, but the present invention is not limited to this. For example, in the above embodiment, the rail stands vertically, but the upper end of the curved part of the rail is slightly inclined inward to eliminate the need for the upper guide to guide the envelope of the light-receiving element. You can also use it as

Further, in the above embodiment, a case has been described in which a light receiving element is transported, but the invention is not limited to this, and for example, a light emitting element or the like may be used.

[Effect of idea]

As detailed above, according to the present invention, there is provided an optical semiconductor device lead bending inspection device that can automatically inspect the lead bending of an optical semiconductor device such as a light receiving element based on a certain standard, thereby improving work efficiency. can.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an optical semiconductor device lead bending inspection device according to an embodiment of the present invention, FIG. 2 is an enlarged perspective view of FIG. FIGS. 4 and 5, which are diagrams for explaining the relationship with the guide, are diagrams showing the relationship between the light-receiving element, which has many bent leads, and the lower guide, respectively. DESCRIPTION OF SYMBOLS 1... Rail, 2... Curved part, 3... Upper guide, 4... Lower guide, 5... Light receiving element, 6... Lead, 7... Notch part.

Claims (1)

[Claims for Utility Model Registration] (1) A rail for transporting an optical semiconductor element, which is curved at a predetermined point and has a pair of leads, while lowering it; A guide having a notch having a pitch different from that of the leads of the semiconductor element and having a predetermined width is provided, and by applying vibration to the rail, the leads of the opto-semiconductor element, which have a lot of lead bending, are removed. The center of gravity of the element is moved to the opposite side of the guide by passing through the notch, the optical semiconductor element is shaken off the rail, and only the optical semiconductor element with less lead bending is conveyed to the downstream of the curved part. An optical semiconductor device lead bending inspection device characterized by: (2) The optical semiconductor device lead bending inspection device according to claim 1, wherein the rail is spiral, and vibrations are applied to the rail in the lateral and vertical directions.