JPH0423160U - - Google Patents

Info

Publication number
JPH0423160U
JPH0423160U JP6502490U JP6502490U JPH0423160U JP H0423160 U JPH0423160 U JP H0423160U JP 6502490 U JP6502490 U JP 6502490U JP 6502490 U JP6502490 U JP 6502490U JP H0423160 U JPH0423160 U JP H0423160U
Authority
JP
Japan
Prior art keywords
connection pad
sop
pad
lead
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6502490U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6502490U priority Critical patent/JPH0423160U/ja
Publication of JPH0423160U publication Critical patent/JPH0423160U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP6502490U 1990-06-20 1990-06-20 Pending JPH0423160U (US07576130-20090818-C00114.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6502490U JPH0423160U (US07576130-20090818-C00114.png) 1990-06-20 1990-06-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6502490U JPH0423160U (US07576130-20090818-C00114.png) 1990-06-20 1990-06-20

Publications (1)

Publication Number Publication Date
JPH0423160U true JPH0423160U (US07576130-20090818-C00114.png) 1992-02-26

Family

ID=31596485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6502490U Pending JPH0423160U (US07576130-20090818-C00114.png) 1990-06-20 1990-06-20

Country Status (1)

Country Link
JP (1) JPH0423160U (US07576130-20090818-C00114.png)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05335731A (ja) * 1992-05-29 1993-12-17 Nippon Seiki Co Ltd プリント基板
US8309862B2 (en) 2009-01-30 2012-11-13 Mitsubishi Electric Corporation Dual inline lead-type electronic-part-mounted printed circuit board, method of soldering dual inline lead-type electronic part, printed circuit board and air-conditioner
CN105555024A (zh) * 2014-10-24 2016-05-04 富士施乐株式会社 基板、基板装置以及基板装置的制造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05335731A (ja) * 1992-05-29 1993-12-17 Nippon Seiki Co Ltd プリント基板
US8309862B2 (en) 2009-01-30 2012-11-13 Mitsubishi Electric Corporation Dual inline lead-type electronic-part-mounted printed circuit board, method of soldering dual inline lead-type electronic part, printed circuit board and air-conditioner
CN105555024A (zh) * 2014-10-24 2016-05-04 富士施乐株式会社 基板、基板装置以及基板装置的制造方法
JP2016086070A (ja) * 2014-10-24 2016-05-19 富士ゼロックス株式会社 基板及び基板装置並びに基板装置の製造方法

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