JPH04230051A - Control device for electrostatic chuck - Google Patents
Control device for electrostatic chuckInfo
- Publication number
- JPH04230051A JPH04230051A JP2416058A JP41605890A JPH04230051A JP H04230051 A JPH04230051 A JP H04230051A JP 2416058 A JP2416058 A JP 2416058A JP 41605890 A JP41605890 A JP 41605890A JP H04230051 A JPH04230051 A JP H04230051A
- Authority
- JP
- Japan
- Prior art keywords
- electrostatic chuck
- voltage
- chuck
- attracted
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012212 insulator Substances 0.000 claims abstract description 15
- 101000763579 Homo sapiens Toll-like receptor 1 Proteins 0.000 abstract description 6
- 102100027010 Toll-like receptor 1 Human genes 0.000 abstract description 6
- DAZSWUUAFHBCGE-KRWDZBQOSA-N n-[(2s)-3-methyl-1-oxo-1-pyrrolidin-1-ylbutan-2-yl]-3-phenylpropanamide Chemical compound N([C@@H](C(C)C)C(=O)N1CCCC1)C(=O)CCC1=CC=CC=C1 DAZSWUUAFHBCGE-KRWDZBQOSA-N 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 238000001179 sorption measurement Methods 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 5
- WEUCVIBPSSMHJG-UHFFFAOYSA-N calcium titanate Chemical compound [O-2].[O-2].[O-2].[Ca+2].[Ti+4] WEUCVIBPSSMHJG-UHFFFAOYSA-N 0.000 description 4
- 230000010287 polarization Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 101000831567 Homo sapiens Toll-like receptor 2 Proteins 0.000 description 3
- 102100024333 Toll-like receptor 2 Human genes 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 3
- 229910002113 barium titanate Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 244000145845 chattering Species 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000000609 electron-beam lithography Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、半導体の製造装置など
において、シリコンなどのウェハを固定、搬送するため
に用いられる静電チャックの制御装置に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a control device for an electrostatic chuck used for fixing and transporting silicon wafers in semiconductor manufacturing equipment and the like.
【０００２】0002
【従来の技術】従来より、半導体製造装置において、シ
リコンウェハを固定、搬送するために、静電チャックが
用いられていた。特に、電子ビーム描画装置、ドライエ
ッチング装置、ＣＶＤ装置、ＰＶＤ装置など、真空中で
シリコンウェハを固定、搬送する場合は、真空チャック
が使えないため、静電チャックが有効であった。2. Description of the Related Art Conventionally, electrostatic chucks have been used in semiconductor manufacturing equipment to fix and transport silicon wafers. In particular, when a silicon wafer is fixed and transported in vacuum, such as in an electron beam lithography system, dry etching system, CVD system, or PVD system, an electrostatic chuck has been effective because a vacuum chuck cannot be used.
【０００３】このような静電チャックの構造は、図５に
示すように、絶縁体１に内部電極２を備え、該内部電極
２に通電するための導入端子３を具備していた。そして
、表面絶縁層１ａの上面にシリコンウェハなどの被吸着
物（不図示）を置き、内部電極２と被吸着物間に直流電
圧を印加すると、内部電極２と被吸着物間における絶縁
体１に分極現象が起こり、この静電気力によってシリコ
ンウェハなどの被吸着物を吸着保持するようになってい
た。As shown in FIG. 5, the structure of such an electrostatic chuck includes an insulator 1, an internal electrode 2, and an introduction terminal 3 for supplying electricity to the internal electrode 2. Then, when an object (not shown) such as a silicon wafer is placed on the upper surface of the surface insulating layer 1a and a DC voltage is applied between the internal electrode 2 and the object, the insulator 1 between the internal electrode 2 and the object A polarization phenomenon occurs, and this electrostatic force attracts and holds objects such as silicon wafers.
【０００４】また、このような静電チャックには、単極
型と双極型の二種類があった。単極型の場合は、図６に
示すように、内部電極２と被吸着物４の間に直流電圧５
を印加するため、効率は良いが被吸着物４にアースを取
る必要があり、用途が限定されてしまう。一方、双極型
の場合は、図７に示すように、内部電極２を二つ以上に
分割し、それぞれの間に直流電圧５を印加するため、や
や吸着効率は劣るが、被吸着物に電圧を印加する必要が
ないため、取扱が簡便であるという特徴をもっていた。[0004] Furthermore, there are two types of such electrostatic chucks: a monopolar type and a bipolar type. In the case of a single-pole type, as shown in FIG.
Although the efficiency is good, it is necessary to ground the object 4, which limits its uses. On the other hand, in the case of the bipolar type, as shown in Fig. 7, the internal electrode 2 is divided into two or more parts, and a DC voltage 5 is applied between each part. Since there is no need to apply energy, it is easy to handle.
【０００５】また、上記絶縁体１としては、たとえば特
開昭５９−１２９７７９ 号公報に示されるように樹脂
を用いたものが一般的であったが、近年、アルミナなど
のセラミックスを用いることが考えられていた（特開昭
６０−２６１３７７ 号、特開昭６２−２６４６３８
号公報等参照）。さらに、静電チャックの吸着力は、誘
電分極現象による分極電荷の量によって決まることから
、より吸着力を高めるために、チタン酸カルシウム（Ｔ
ｉＣａＯ ３ ）またはチタン酸バリウム（ＢａＴｉＯ
３ ）などの誘電率の大きいセラミックスを用いて静
電チャックを構成することを、本出願人は既に提案した
。[0005] Furthermore, as the insulator 1, resin was generally used as shown in, for example, Japanese Unexamined Patent Publication No. 59-129779, but in recent years, it has been considered to use ceramics such as alumina. (Japanese Patent Application Laid-Open No. 60-261377, JP-A No. 62-264638)
(Refer to the publication number, etc.) Furthermore, since the adsorption force of an electrostatic chuck is determined by the amount of polarized charge due to the dielectric polarization phenomenon, calcium titanate (T
iCaO 3 ) or barium titanate (BaTiO
The applicant has already proposed constructing an electrostatic chuck using ceramics with a high dielectric constant such as 3).
【０００６】[0006]
【発明が解決しようとする課題】上記したように、静電
チャックの吸着力は分極電荷の量によって定まるが、こ
の分極電荷量は、印加電圧との間でヒステリシス（履歴
現象）ループを描くことが知られている。即ち、図８に
示すように、印加電圧の変化に伴って、分極電荷量はＯ
からＣまで変化するが、この後印加電圧を減少させても
分極電荷量はもとの経路Ｂ−Ｏを通らずに、Ｂ−Ｄのよ
うに変化する。つまり、印加電圧を０にしても分極電荷
量は０にならず残ってしまうのである。これが残留吸着
力となって現れ、印加電圧を切っても被吸着物が離脱し
にくいという問題点があった。[Problems to be Solved by the Invention] As mentioned above, the attraction force of an electrostatic chuck is determined by the amount of polarized charge, but this amount of polarized charge draws a hysteresis (hysteresis phenomenon) loop with the applied voltage. It has been known. That is, as shown in FIG. 8, as the applied voltage changes, the amount of polarized charge increases
However, even if the applied voltage is reduced thereafter, the amount of polarized charge does not go through the original path B--O, but changes like B--D. In other words, even if the applied voltage is reduced to 0, the amount of polarized charge does not become 0 and remains. This appears as a residual adsorption force, which poses a problem in that the adsorbed object is difficult to detach even when the applied voltage is turned off.
【０００７】さらに、上記のようにヒステリシスループ
を描くことから、一定の電圧を印加しても分極電荷量す
なわち吸着力が一定とならず、吸着力の再現性にも劣っ
ていた。Furthermore, since a hysteresis loop is drawn as described above, even if a constant voltage is applied, the amount of polarized charge, that is, the attraction force is not constant, and the reproducibility of the attraction force is also poor.
【０００８】[0008]
【課題を解決するための手段】そこで、本発明は、絶縁
体の内部に備えた電極に直流電圧を印加する静電チャッ
クに対し、吸着前および離脱時に、作動電圧と異なる極
性の電圧を短時間印加する手段を備えて、静電チャック
の制御装置を構成したものである。[Means for Solving the Problems] Therefore, the present invention provides an electrostatic chuck that applies a DC voltage to an electrode provided inside an insulator. This is a control device for an electrostatic chuck that includes means for applying time.
【０００９】[0009]
【作用】本発明によれば、吸着前に作動電圧と異なる極
性の直流電圧を短時間印加することによって、吸着力を
安定させることができる。また、離脱時に作動電圧と異
なる極性の直流電圧を短時間印加することによって、絶
縁体の残留電荷をなくし、被吸着物を確実に離脱させる
ことができる。According to the present invention, the suction force can be stabilized by applying a DC voltage of a polarity different from the operating voltage for a short time before suction. Further, by applying a DC voltage of a polarity different from the operating voltage for a short time at the time of detachment, residual charges on the insulator can be eliminated and the object to be attracted can be detached reliably.
【００１０】0010
【実施例】以下、本発明の実施例を図によって説明する
。図１、図２は、本発明の静電チャックの制御装置をシ
ーケンス制御図で表したものである。図１は静電チャッ
クの吸着、離脱時に自動制御を行うリレー電源制御側で
あり、図２は実際に静電チャックの印加電圧を制御する
静電チャック電源制御側である。[Embodiments] Hereinafter, embodiments of the present invention will be explained with reference to the drawings. 1 and 2 are sequence control diagrams showing the electrostatic chuck control device of the present invention. FIG. 1 shows a relay power supply control side that automatically controls when an electrostatic chuck is attracted and detached, and FIG. 2 shows an electrostatic chuck power supply control side that actually controls the voltage applied to the electrostatic chuck.
【００１１】また、本発明の制御装置で用いる静電チャ
ックは、図５に示すように、樹脂、セラミックスなどか
らなる絶縁体１に内部電極２を埋設し、この内部電極２
に通電するための導入端子３を備えている。Further, as shown in FIG. 5, the electrostatic chuck used in the control device of the present invention has an internal electrode 2 embedded in an insulator 1 made of resin, ceramics, etc.
It is provided with an introduction terminal 3 for supplying electricity.
【００１２】ここで、本発明の制御装置の作動を説明す
る。まず、図１の吸着スイッチを押すと、リレーＲ１に
より吸着スイッチ側がロックされ、同時に図２の静電チ
ャック電源用接点Ｒ１も接続される。図２において、あ
らかじめ接点Ｒ３は静電チャックに逆接続されているた
め、この時点で、静電チャックには作動電圧と異なる極
性の逆電圧が印加されることになる。また、このとき、
図１において、表示灯ＳＬ２ が作動して、逆電圧印加
中であることを表示し、タイマーＴＬＲ１に通電される
。[0012] Here, the operation of the control device of the present invention will be explained. First, when the suction switch shown in FIG. 1 is pressed, the suction switch side is locked by the relay R1, and at the same time, the electrostatic chuck power supply contact R1 shown in FIG. 2 is also connected. In FIG. 2, since the contact R3 is connected in reverse to the electrostatic chuck in advance, a reverse voltage having a polarity different from the operating voltage is applied to the electrostatic chuck at this point. Also, at this time,
In FIG. 1, the indicator light SL2 is activated to indicate that reverse voltage is being applied, and the timer TLR1 is energized.
【００１３】そして、０．５ 秒後に上記タイマーＴＬ
Ｒ１が作動し、リレーＲ３により、図２中の接点Ｒ３は
正接続に切り替わって、この後静電チャックには正電圧
が供給される。また、図１において、表示灯ＳＬ２ は
消え、代わりに表示灯ＳＬ１ が作動して、吸着中であ
ることを表示する。[0013] Then, after 0.5 seconds, the above-mentioned timer TL
R1 is activated, contact R3 in FIG. 2 is switched to positive connection by relay R3, and thereafter a positive voltage is supplied to the electrostatic chuck. Further, in FIG. 1, the indicator light SL2 goes out, and the indicator light SL1 is activated instead to indicate that the suction is in progress.
【００１４】この後、被吸着物を離脱させる場合は、図
１における離脱スイッチを押すと、リレーＲ２により離
脱スイッチ側がロックされ、同時に吸着スイッチ側の接
点Ｒ２が切れて、タイマーＴＬＲ１への通電が遮断され
るため、各接点ＴＬＲ１が初期状態に戻り、リレーＲ３
も初期状態に戻る。そのため、図２において、接点Ｒ３
が初期の逆接続状態にもどり、静電チャックには逆電圧
が印加されることになる。また、このとき、図１におい
て、表示灯ＳＬ１ が消え、代わりに表示灯ＳＬ２ が
作動して、逆電圧印加中であることを表示する。さらに
、このときタイマーＴＬＲ２にも通電される。After this, when the object to be attracted is to be removed, when the removal switch shown in FIG. 1 is pressed, the removal switch side is locked by the relay R2, and at the same time, the contact R2 on the attraction switch side is cut off, and the energization to the timer TLR1 is stopped. Since the circuit is cut off, each contact TLR1 returns to its initial state, and relay R3
also returns to its initial state. Therefore, in FIG. 2, contact R3
returns to the initial reverse connection state, and a reverse voltage is applied to the electrostatic chuck. Also, at this time, in FIG. 1, the indicator light SL1 goes out, and the indicator light SL2 is activated instead to indicate that the reverse voltage is being applied. Furthermore, at this time, timer TLR2 is also energized.
【００１５】そして、０．５ 秒後に、上記タイマーＴ
ＬＲ２が作動して、図１に示す接点ＴＬＲ２が切れ、リ
レー駆動用の電源が遮断されるため、すべての接点が初
期状態に戻る。そのため、図２において、接点Ｒ１も切
れて、静電チャックへの印加電圧は０となる。Then, after 0.5 seconds, the timer T
LR2 is activated, contact TLR2 shown in FIG. 1 is cut off, and the power supply for driving the relay is cut off, so that all contacts return to their initial states. Therefore, in FIG. 2, the contact R1 is also broken, and the voltage applied to the electrostatic chuck becomes zero.
【００１６】このように、本発明によれば、吸着前に０
．５ 秒間の逆電圧を印加することによって、分極電荷
を初期状態に復帰させて、吸着力が安定する。また、離
脱時にも０．５ 秒間の逆電圧を印加することで、残留
電荷をなくし、容易に吸着物を離脱させることができる
。なお、逆電圧を印加する時間は、図１におけるタイマ
ーＴＬＲ１、ＴＬＲ２の設定時間を変えることで、自由
に変化させることができるが、本発明者等が種々実験の
結果、０．１ 〜１０秒としておけば良好に作動した。
逆電圧印加時間が０．１ 秒より短いと、残留電荷の除
去が充分でなく、また、急激に接点が切り替わるため、
チャタリングを生じて回路が正常に作動しなかった。一
方、逆電圧印加時間が１０秒より長いと、逆向きの電荷
が発生して被吸着物が離脱できなかった。As described above, according to the present invention, 0
．． By applying a reverse voltage for 5 seconds, the polarized charges are returned to their initial state and the adsorption force is stabilized. Furthermore, by applying a reverse voltage for 0.5 seconds during detachment, residual charges can be eliminated and the adsorbed matter can be easily detached. Note that the time for applying the reverse voltage can be freely changed by changing the set times of timers TLR1 and TLR2 in FIG. 1, but as a result of various experiments conducted by the present inventors, It worked fine if I set it as such. If the reverse voltage application time is shorter than 0.1 seconds, the residual charge will not be removed sufficiently and the contacts will switch suddenly.
Chattering occurred and the circuit did not operate properly. On the other hand, when the reverse voltage application time was longer than 10 seconds, opposite charges were generated and the adsorbed object could not be detached.
【００１７】また、図２に示すように、静電チャックの
供給電源に１ＭΩ程度の抵抗を挿入しておくと、接点Ｒ
１が切れた時点で、静電チャック内部に残る分極電荷を
より完全に除去することができる。また、この抵抗の代
わりに電圧計を挿入すると、印加電圧の状態を確認する
こともできる。さらに、大きな電圧を切り換える接点に
は、接点保護回路を組み込むこともできる。また、離脱
時の逆電圧は、減衰させばがら印加してもよい。このよ
うに、図１、図２には、最も基本的な回路を示したが、
本願発明の範囲を逸脱しない範囲で、自由に回路を設定
すればよい。Furthermore, as shown in FIG. 2, if a resistor of about 1 MΩ is inserted into the power supply of the electrostatic chuck, the contact point R
1, the polarized charges remaining inside the electrostatic chuck can be more completely removed. Also, if you insert a voltmeter in place of this resistor, you can check the state of the applied voltage. Furthermore, contact protection circuits can be incorporated into contacts that switch large voltages. Further, the reverse voltage at the time of detachment may be applied while being attenuated. In this way, although the most basic circuits are shown in FIGS. 1 and 2,
The circuit may be freely set without departing from the scope of the present invention.
【００１８】なお、本発明の制御装置は、単極型、双極
型いずれの静電チャックにも適用でき、絶縁体の材質と
して、樹脂、アルミナセラミックス、あるいは強誘電体
セラミックスなど、さまざまな材質を用いたものに適用
することができる。特に、チタン酸バリウム、チタン酸
カルシウムなど、比誘電率５０以上の強誘電体セラミッ
クスを用いた静電チャックが、最も効果的であった。The control device of the present invention can be applied to both monopolar and bipolar electrostatic chucks, and the insulator can be made of various materials such as resin, alumina ceramics, or ferroelectric ceramics. It can be applied to anything used. In particular, electrostatic chucks using ferroelectric ceramics with a dielectric constant of 50 or more, such as barium titanate and calcium titanate, were most effective.
【００１９】実験例
ここで、実際に静電チャック制御装置の効果を調べるた
めに、各種の実験を試みた。静電チャックとして、チタ
ン酸カルシウム（ＣａＴｉＯ ３ ）系セラミックスか
らなる絶縁体１の内部に、銀（Ａｇ）からなる内部電極
２を備え、直径４インチの円盤状で、表面絶縁層１ａの
厚みは ０．４ｍｍとし、内部電極２は静電チャックの
周囲より２ｍｍ入り込んだ位置まで形成した、単極型の
ものを用意した。Experimental Example Here, various experiments were attempted to actually investigate the effects of the electrostatic chuck control device. The electrostatic chuck is equipped with an internal electrode 2 made of silver (Ag) inside an insulator 1 made of calcium titanate (CaTiO 3 ) ceramics, and has a disc shape with a diameter of 4 inches, and the thickness of the surface insulating layer 1a is as follows. A unipolar type was prepared in which the internal electrode 2 was formed to a position extending 2 mm from the periphery of the electrostatic chuck.
【００２０】まず、比較実験として、この静電チャック
にシリコンウェハを吸着しておいて、離脱時に、内部電
極２とシリコンウェハ間を短絡させてみたが、シリコン
ウェハは吸着されたままであり、ほとんど効果はなかっ
た。First, as a comparative experiment, we tried to attach a silicon wafer to this electrostatic chuck and short-circuit between the internal electrode 2 and the silicon wafer when detaching it, but the silicon wafer remained attached and almost It had no effect.
【００２１】次の比較実験として、シリコンウェハの離
脱時のみに、逆方向への直流電圧印加を試みた。ただし
、逆方向への直流電圧を印加し続けると、逆方向の誘電
分極現象が生じるため、逆電圧印加時間は０．５ 秒と
した。その結果、シリコンウェハの離脱は容易になり、
優れた効果があることがわかった。しかし、何度も実験
を繰り返したときの、印加電圧と吸着力の関係を図３に
示すように、吸着力の再現性が低い点は解消されなかっ
た。As a next comparative experiment, an attempt was made to apply a DC voltage in the opposite direction only when the silicon wafer was detached. However, if a DC voltage in the opposite direction is continuously applied, a dielectric polarization phenomenon occurs in the opposite direction, so the reverse voltage application time was set to 0.5 seconds. As a result, the silicon wafer detaches easily,
It was found to have excellent effects. However, as shown in FIG. 3, which shows the relationship between the applied voltage and the adsorption force when the experiment was repeated many times, the problem of low reproducibility of the adsorption force was not solved.
【００２２】そこで、本発明の制御装置を用いて、離脱
時だけでなく、吸着時の直前にも０．５ 秒の逆電圧印
加を試みたところ、印加電圧と吸着力の関係を図４に示
すように、再現性が高く、しかも大きい吸着力が得られ
た。
これは、電源を切った後も絶縁体１中にわずかに残って
いた分極電荷が、吸着時直前の逆電圧印加によって矯正
されるためであると考えられる。Therefore, using the control device of the present invention, we attempted to apply a reverse voltage for 0.5 seconds not only at the time of detachment but also immediately before the time of attraction, and the relationship between the applied voltage and the attraction force is shown in Figure 4. As shown, high reproducibility and large adsorption force were obtained. This is considered to be because the polarized charge slightly remaining in the insulator 1 even after the power was turned off is corrected by applying a reverse voltage immediately before adsorption.
【００２３】なお、上記実験例では、チタン酸カルシウ
ム系セラミックスからなる静電チャックを用いたが、チ
タン酸バリウム系セラミックスを用いたものや、アルミ
ナなどのセラミックス、あるいは樹脂などを用いたもの
であっても同様の結果であった。また、上記実験例では
、単極型の静電チャックを用いたが、双極型でも同様の
結果であった。即ち、本発明の静電チャック制御装置は
、さまざまな静電チャックに適用することができる。[0023] In the above experimental example, an electrostatic chuck made of calcium titanate-based ceramics was used, but it is also possible to use an electrostatic chuck made of barium titanate-based ceramics, ceramics such as alumina, or resin. The results were similar. Further, in the above experimental example, a monopolar electrostatic chuck was used, but similar results were obtained with a bipolar electrostatic chuck. That is, the electrostatic chuck control device of the present invention can be applied to various electrostatic chucks.
【００２４】[0024]
【発明の効果】叙上のように本発明によれば、絶縁体の
内部に備えた電極に直流電圧を印加する静電チャックに
対し、吸着前および離脱時に、作動電圧と異なる極性の
電圧を短時間印加する手段を備えて、静電チャックの制
御装置を構成したことによって、吸着力が安定して、再
現性に優れ、かつ容易に吸着物を離脱することができる
ため、静電チャックの利用性を高め、特に半導体製造装
置等に好適に使用することができる。As described above, according to the present invention, a voltage of a polarity different from the operating voltage is applied to an electrostatic chuck that applies a DC voltage to an electrode provided inside an insulator before adsorption and during detachment. By configuring the control device for the electrostatic chuck with a means to apply it for a short time, the adsorption force is stable, has excellent reproducibility, and the object to be adsorbed can be easily removed. It improves the usability and can be particularly suitably used in semiconductor manufacturing equipment and the like.
【図１】本発明実施例に係る静電チャック制御装置のリ
レー電源制御側のシーケンス制御図である。FIG. 1 is a sequence control diagram on the relay power supply control side of an electrostatic chuck control device according to an embodiment of the present invention.
【図２】本発明実施例に係る静電チャック制御装置の静
電チャック電源制御側のシーケンス制御図である。FIG. 2 is a sequence control diagram of the electrostatic chuck power supply control side of the electrostatic chuck control device according to the embodiment of the present invention.
【図３】比較例における、静電チャックの印加電圧と吸
着力の関係を示すグラフである。FIG. 3 is a graph showing the relationship between the applied voltage of the electrostatic chuck and the adsorption force in a comparative example.
【図４】本発明の制御装置を用いた静電チャックの、印
加電圧と吸着力の関係を示すグラフである。FIG. 4 is a graph showing the relationship between applied voltage and attraction force of an electrostatic chuck using the control device of the present invention.
【図５】一般的な静電チャックの構造を示す、一部破断
斜視図である。FIG. 5 is a partially cutaway perspective view showing the structure of a general electrostatic chuck.
【図６】単極型の静電チャックを示す概略図である。FIG. 6 is a schematic diagram showing a monopolar electrostatic chuck.
【図７】双極型の静電チャックを示す概略図である。FIG. 7 is a schematic diagram showing a bipolar electrostatic chuck.
【図８】従来の静電チャックにおける、印加電圧と分極
電荷量の関係を示すグラフである。FIG. 8 is a graph showing the relationship between applied voltage and polarization charge amount in a conventional electrostatic chuck.
１：絶縁体 １ａ：表面絶縁層 ２：内部電極 ３：導通端子 1: Insulator 1a: Surface insulating layer 2: Internal electrode 3: Continuity terminal
Claims (1)
て物体を吸着する静電チャックに対し、吸着前および離
脱時に、作動電圧と異なる極性の電圧を短時間印加する
手段を備えたことを特徴とする静電チャックの制御装置
。Claim 1: An electrostatic chuck that attracts an object by applying a DC voltage to an electrode provided in an insulator is provided with means for applying a voltage of a polarity different from the operating voltage for a short period of time before attracting and at the time of detachment. An electrostatic chuck control device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP41605890A JP3101954B2 (en) | 1990-12-27 | 1990-12-27 | Control device for electrostatic chuck |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP41605890A JP3101954B2 (en) | 1990-12-27 | 1990-12-27 | Control device for electrostatic chuck |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04230051A true JPH04230051A (en) | 1992-08-19 |
| JP3101954B2 JP3101954B2 (en) | 2000-10-23 |
Family
ID=18524309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP41605890A Expired - Fee Related JP3101954B2 (en) | 1990-12-27 | 1990-12-27 | Control device for electrostatic chuck |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3101954B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04247639A (en) * | 1991-02-04 | 1992-09-03 | Fujitsu Ltd | Method of sucking and separating wafer by electrostatic chuck |
| JP2002280438A (en) * | 2001-03-19 | 2002-09-27 | Ulvac Japan Ltd | Vacuum treatment method |
| WO2012014428A1 (en) * | 2010-07-27 | 2012-02-02 | 株式会社アルバック | Substrate conveyance method and substrate conveyance system |
| US8593780B2 (en) | 2011-03-30 | 2013-11-26 | Tokyo Electron Limited | Substrate removing method and storage medium |
| US8964350B2 (en) | 2011-03-30 | 2015-02-24 | Tokyo Electron Limited | Substrate removing method and storage medium |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7041989B1 (en) * | 2004-10-22 | 2006-05-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| KR100788355B1 (en) | 2005-12-30 | 2008-01-02 | 동부일렉트로닉스 주식회사 | Method for Controlling Temperature of ElectroStatic Chuck |
| KR100769472B1 (en) | 2006-01-06 | 2007-10-23 | 코닉시스템 주식회사 | Apparatus for controlling driving voltage of electrostatic chuck by using pressure as a feedback signal |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58114437A (en) * | 1981-12-26 | 1983-07-07 | Fujitsu Ltd | Electrostatic attracting method |
| JPS62255039A (en) * | 1986-11-21 | 1987-11-06 | Kureha Chem Ind Co Ltd | Receasing method of attracted body from electrostatic attracting device |
| JPH01181544A (en) * | 1988-01-12 | 1989-07-19 | Sumitomo Metal Ind Ltd | Electrostatic chuck |
-
1990
- 1990-12-27 JP JP41605890A patent/JP3101954B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58114437A (en) * | 1981-12-26 | 1983-07-07 | Fujitsu Ltd | Electrostatic attracting method |
| JPS62255039A (en) * | 1986-11-21 | 1987-11-06 | Kureha Chem Ind Co Ltd | Receasing method of attracted body from electrostatic attracting device |
| JPH01181544A (en) * | 1988-01-12 | 1989-07-19 | Sumitomo Metal Ind Ltd | Electrostatic chuck |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04247639A (en) * | 1991-02-04 | 1992-09-03 | Fujitsu Ltd | Method of sucking and separating wafer by electrostatic chuck |
| JP2576294B2 (en) * | 1991-02-04 | 1997-01-29 | 富士通株式会社 | Wafer suction / release method for electrostatic chuck |
| JP2002280438A (en) * | 2001-03-19 | 2002-09-27 | Ulvac Japan Ltd | Vacuum treatment method |
| JP4647122B2 (en) * | 2001-03-19 | 2011-03-09 | 株式会社アルバック | Vacuum processing method |
| WO2012014428A1 (en) * | 2010-07-27 | 2012-02-02 | 株式会社アルバック | Substrate conveyance method and substrate conveyance system |
| JP5470460B2 (en) * | 2010-07-27 | 2014-04-16 | 株式会社アルバック | Substrate transfer method and substrate transfer system |
| US8717737B2 (en) | 2010-07-27 | 2014-05-06 | Ulvac, Inc. | Substrate conveyance method and substrate conveyance system |
| US8593780B2 (en) | 2011-03-30 | 2013-11-26 | Tokyo Electron Limited | Substrate removing method and storage medium |
| US8964350B2 (en) | 2011-03-30 | 2015-02-24 | Tokyo Electron Limited | Substrate removing method and storage medium |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3101954B2 (en) | 2000-10-23 |
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