JPH04224928A - Heat sealing method for film or sheet - Google Patents
Heat sealing method for film or sheetInfo
- Publication number
- JPH04224928A JPH04224928A JP2414915A JP41491590A JPH04224928A JP H04224928 A JPH04224928 A JP H04224928A JP 2414915 A JP2414915 A JP 2414915A JP 41491590 A JP41491590 A JP 41491590A JP H04224928 A JPH04224928 A JP H04224928A
- Authority
- JP
- Japan
- Prior art keywords
- film
- heat
- sheet
- heat sealing
- agents
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 19
- 150000001875 compounds Chemical class 0.000 claims abstract description 16
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 12
- 239000011342 resin composition Substances 0.000 claims abstract description 12
- 230000000740 bleeding effect Effects 0.000 claims abstract description 7
- -1 Brighteners Substances 0.000 claims description 10
- 239000003963 antioxidant agent Substances 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 239000006057 Non-nutritive feed additive Substances 0.000 claims description 3
- 230000003078 antioxidant effect Effects 0.000 claims description 3
- 239000003086 colorant Substances 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 239000003431 cross linking reagent Substances 0.000 claims description 3
- 239000002781 deodorant agent Substances 0.000 claims description 3
- 239000012760 heat stabilizer Substances 0.000 claims description 3
- 239000003112 inhibitor Substances 0.000 claims description 3
- 239000004611 light stabiliser Substances 0.000 claims description 3
- 239000000314 lubricant Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000004014 plasticizer Substances 0.000 claims description 3
- 239000003755 preservative agent Substances 0.000 claims description 3
- 239000005871 repellent Substances 0.000 claims description 3
- 230000002940 repellent Effects 0.000 claims description 3
- 239000003381 stabilizer Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000002216 antistatic agent Substances 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 claims description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims 1
- 229920000098 polyolefin Polymers 0.000 abstract description 18
- 230000004927 fusion Effects 0.000 abstract description 6
- 230000003064 anti-oxidating effect Effects 0.000 abstract 1
- 239000007800 oxidant agent Substances 0.000 abstract 1
- 238000004049 embossing Methods 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- GLZPCOQZEFWAFX-UHFFFAOYSA-N Geraniol Chemical compound CC(C)=CCCC(C)=CCO GLZPCOQZEFWAFX-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- RVHSTXJKKZWWDQ-UHFFFAOYSA-N 1,1,1,2-tetrabromoethane Chemical compound BrCC(Br)(Br)Br RVHSTXJKKZWWDQ-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- YHCGGLXPGFJNCO-UHFFFAOYSA-N 2-(2H-benzotriazol-4-yl)phenol Chemical compound OC1=CC=CC=C1C1=CC=CC2=C1N=NN2 YHCGGLXPGFJNCO-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- 239000005792 Geraniol Substances 0.000 description 1
- GLZPCOQZEFWAFX-YFHOEESVSA-N Geraniol Natural products CC(C)=CCC\C(C)=C/CO GLZPCOQZEFWAFX-YFHOEESVSA-N 0.000 description 1
- BIUTYOQLOWNRHP-UHFFFAOYSA-N O-triacontyl propanethioate Chemical compound C(CCCCCCCCCCC)CCCCCCCCCCCCCCCCCCOC(CC)=S BIUTYOQLOWNRHP-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 241000270708 Testudinidae Species 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- GWOWVOYJLHSRJJ-UHFFFAOYSA-L cadmium stearate Chemical compound [Cd+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O GWOWVOYJLHSRJJ-UHFFFAOYSA-L 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 229940088516 cipro Drugs 0.000 description 1
- MYSWGUAQZAJSOK-UHFFFAOYSA-N ciprofloxacin Chemical compound C12=CC(N3CCNCC3)=C(F)C=C2C(=O)C(C(=O)O)=CN1C1CC1 MYSWGUAQZAJSOK-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 229930003935 flavonoid Natural products 0.000 description 1
- 150000002215 flavonoids Chemical class 0.000 description 1
- 235000017173 flavonoids Nutrition 0.000 description 1
- 229940113087 geraniol Drugs 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012170 montan wax Substances 0.000 description 1
- XKIVKIIBCJIWNU-UHFFFAOYSA-N o-[3-pentadecanethioyloxy-2,2-bis(pentadecanethioyloxymethyl)propyl] pentadecanethioate Chemical compound CCCCCCCCCCCCCCC(=S)OCC(COC(=S)CCCCCCCCCCCCCC)(COC(=S)CCCCCCCCCCCCCC)COC(=S)CCCCCCCCCCCCCC XKIVKIIBCJIWNU-UHFFFAOYSA-N 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- JZNDMMGBXUYFNQ-UHFFFAOYSA-N tris(dodecylsulfanyl)phosphane Chemical compound CCCCCCCCCCCCSP(SCCCCCCCCCCCC)SCCCCCCCCCCCC JZNDMMGBXUYFNQ-UHFFFAOYSA-N 0.000 description 1
- MWOOGOJBHIARFG-UHFFFAOYSA-N vanillin Chemical compound COC1=CC(C=O)=CC=C1O MWOOGOJBHIARFG-UHFFFAOYSA-N 0.000 description 1
- FGQOOHJZONJGDT-UHFFFAOYSA-N vanillin Natural products COC1=CC(O)=CC(C=O)=C1 FGQOOHJZONJGDT-UHFFFAOYSA-N 0.000 description 1
- 235000012141 vanillin Nutrition 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
Landscapes
- Package Closures (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明はポリオレフィン系樹脂組
成物から製造したフィルムまたはシートをヒートシール
する方法に関し、該方法は各種物品の包装袋、または建
築、土木、農業等に使用する広幅シート、バックインボ
ックス、簡易手袋、プラスチック封筒等をフィルムまた
はシートから製造する際に利用される。[Industrial Application Field] The present invention relates to a method for heat sealing films or sheets manufactured from polyolefin resin compositions, and the method is applicable to packaging bags for various articles, wide sheets used in architecture, civil engineering, agriculture, etc. It is used to manufacture back-in-boxes, simple gloves, plastic envelopes, etc. from films or sheets.
【0002】0002
【従来の技術】ポリエチレンやポリプロピレンから製造
したフィルムやシートを、ヒートシーラーでその融点以
上に加熱し、フィルムまたはシート同士を熱融着させる
方法は広く一般に行われている公知技術である。2. Description of the Related Art A method of heating films or sheets made of polyethylene or polypropylene to a temperature above their melting point using a heat sealer to heat-seal the films or sheets together is a widely known and commonly practiced method.
【0003】しかしながら、近年、ポリオレフィン系フ
ィルムまたはシートから製造した物品は多種の産業分野
で使用され、要求される性能・機能も多様になり、これ
を満足させるために、素材であるポリオレフィン自体の
物性を変更したり、ポリオレフィンに機能付与のため各
種化合物を配合している。例えば、機械的特性、光学的
特性、加工特性を改良するためにポリオレフィンの分子
量分布を広くすることがあり、この場合低分子量のポリ
オレフィンの量が増加する。また、分子量分布を狭くす
る必要がある場合においても、重合触媒・重合方法の制
約上低分子量のポリオレフィンが随意的に生成する場合
がある。このように低分子量のポリオレフィンが比較的
多量に高分子量ポリオレフィン中に生成した場合、溶媒
によって抽出除去する場合もあるが、コストアップの要
因となるので、製品の性質に大きな弊害を与えない限り
そのまま使用している。However, in recent years, articles manufactured from polyolefin films or sheets have been used in a variety of industrial fields, and the performance and functions required have become diverse. or add various compounds to the polyolefin to give it functionality. For example, the molecular weight distribution of polyolefins may be broadened to improve mechanical, optical, and processing properties, in which case the amount of low molecular weight polyolefins is increased. Further, even when it is necessary to narrow the molecular weight distribution, a low molecular weight polyolefin may be arbitrarily produced due to restrictions on the polymerization catalyst and polymerization method. If a relatively large amount of low molecular weight polyolefin is generated in a high molecular weight polyolefin in this way, it may be extracted and removed using a solvent, but this will increase the cost, so it should be left as is unless it has a major adverse effect on the properties of the product. I am using it.
【0004】一方、ポリオレフィンはそれ自体の性能が
最終用途の要求する性能を全て満足させることはできず
、各種の性能を有する酸化防止剤、帯電防止剤、紫外線
吸収剤、遠赤外線発生剤、難燃剤、滑剤、可塑剤、架橋
剤、光沢剤、光安定剤、熱安定剤、加工助剤、金属腐蝕
防止剤、防曇剤、霧発生防止剤、着色剤、防カビ剤、鮮
度保持剤、防臭剤、揆水剤、電圧安定剤、トリー防止剤
等の機能付与剤が配合されている。On the other hand, the performance of polyolefin itself cannot satisfy all the performance requirements of the end use. Fire additives, lubricants, plasticizers, crosslinking agents, brighteners, light stabilizers, heat stabilizers, processing aids, metal corrosion inhibitors, antifogging agents, anti-fog agents, colorants, anti-mold agents, freshness-preserving agents, Contains functional agents such as deodorants, water repellents, voltage stabilizers, and anti-tree agents.
【0005】これらの低分子量ポリオレフィンや機能付
与剤はエントロピーや極性の相違で微量であっても高分
子量ポリオレフィンマトリックス中から表面にブリード
(滲出)する傾向があり、微量の場合は高分子量ポリオ
レフィン同士の界面に存在しても溶融した高分子量ポリ
オレフィン同士の熱融着を妨害しないが、多量となると
高分子量ポリオレフィン同士の熱融着を阻害することを
、本発明者等は実験により確認した。[0005] These low-molecular-weight polyolefins and functional agents tend to bleed from the high-molecular-weight polyolefin matrix to the surface even in minute amounts due to differences in entropy and polarity. The present inventors have confirmed through experiments that even if it exists at the interface, it does not interfere with the thermal fusion between molten high molecular weight polyolefins, but when it is present in a large amount, it inhibits the thermal fusion between high molecular weight polyolefins.
【0006】[0006]
【発明が解決しようとする課題】このように、低分子量
ポリオレフィンや機能付与剤等の表面ブリード性化合物
を多量に含有するポリオレフィン系樹脂組成物からのフ
ィルムやシートは、機能や性能の面で好ましいものであ
るにもかかわらず、それらの熱融着が困難であるため包
装袋等に利用できなかった。本発明はこのような問題点
を解決するためになされたものであり、表面ブリード性
化合物が表面に多量にブリードしているために通常のヒ
ートシール方法では熱融着できなかったポリオレフィン
系樹脂組成物から製造したフィルムまたはシートを熱融
着できる方法を提供することを課題とする。[Problems to be Solved by the Invention] As described above, films and sheets made from polyolefin resin compositions containing large amounts of surface-bleeding compounds such as low-molecular-weight polyolefins and functional agents are preferable in terms of function and performance. However, because it is difficult to heat-seal them, they could not be used for packaging bags, etc. The present invention was made to solve these problems, and it is a polyolefin resin composition that cannot be thermally bonded by a normal heat sealing method because a large amount of a surface-bleeding compound bleeds onto the surface. An object of the present invention is to provide a method for heat-sealing films or sheets manufactured from materials.
【0007】[0007]
【課題を解決するための手段】本発明者等は鋭意研究の
結果、フィルムまたはシート表面に存在する表面ブリー
ド性化合物がポリオレフィン系樹脂組成物から製造した
フィルムまたはシートのヒートシール方法による熱融着
を阻害する原因であることを実証し、フィルムまたはシ
ートの表面形態と熱融着強度との相関関係について数多
くの実験を行い、特定の表面形態の場合、表面ブリード
性化合物が多量に存在していても熱融着が可能であるこ
とを見出し、本発明を完成させた。[Means for Solving the Problem] As a result of intensive research, the present inventors have found that the surface bleeding compound present on the surface of the film or sheet can be thermally fused by a heat sealing method of a film or sheet manufactured from a polyolefin resin composition. We conducted a number of experiments on the correlation between the surface morphology of the film or sheet and the thermal bonding strength, and found that in the case of a specific surface morphology, surface bleeding compounds are present in large amounts. The present invention was completed based on the discovery that heat fusion is possible even when the material is heated.
【0008】すなわち、本発明のフィルムまたはシート
のヒートシール方法は、表面ブリード性化合物を多量に
含有するポリオレフィン系樹脂組成物から製造したフィ
ルムまたはシートをヒートシールする方法において、該
フィルムまたはシートの表面に深さ5〜30μmのエン
ボス模様を施したことを特徴とする。That is, the method for heat-sealing a film or sheet of the present invention is a method for heat-sealing a film or sheet manufactured from a polyolefin resin composition containing a large amount of a surface-bleeding compound. It is characterized by having an embossed pattern with a depth of 5 to 30 μm.
【0009】本発明の上記ヒートシール方法において、
表面ブリード性化合物がブリード性の低分子量重合体、
酸化防止剤、帯電防止剤、紫外線吸収剤、遠赤外線発生
剤、難燃剤、滑剤、可塑剤、架橋剤、光沢剤、光安定剤
、熱安定剤、加工助剤、金属腐蝕防止剤、防曇剤、霧発
生防止剤、着色剤、防カビ剤、鮮度保持剤、防臭剤、揆
水剤、電圧安定剤、トリー防止剤等から選択されるもの
であり、このような化合物には具体的に以下のものが包
含される:2,6−ジ第三ブチルパラクレゾール、ラウ
リルステアリルチオプロピオネート、2−ヒドロキシベ
ンゾフェノン、(2’−ヒドロキシフェニル)ベンゾト
リアゾール、トリラウリルトリチオホスファイト、塩素
化パラフィン、テトラブロムエタン、ソルビタンモノ脂
肪酸エステル、脂肪酸のエチレンオキサイド付加物、ス
テアリルアミド、エチレンビステアロアミド、モンタン
ロウ、ステアリン酸カドミウム、ポリエチレンオキサイ
ド、フタロシアニンブルー、ポリエチレンワックス、ジ
クミルパーオキサイド、ポリシロキサン、テトラメトキ
シシラン、γ−メタクリロキシプロピルトリメトキシシ
ラン、ポリシロキサン−オキシアルキレン共重合体、バ
ニリン、ゲラニオール、フラボノイド、低分子量ポリオ
レフィン等。[0009] In the above heat sealing method of the present invention,
Low molecular weight polymer whose surface bleed compound bleeds,
Antioxidants, antistatic agents, ultraviolet absorbers, far-infrared generators, flame retardants, lubricants, plasticizers, crosslinking agents, brighteners, light stabilizers, heat stabilizers, processing aids, metal corrosion inhibitors, antifogging agents. These compounds are selected from agents, anti-fog agents, colorants, anti-mold agents, freshness-preserving agents, deodorants, water repellents, voltage stabilizers, anti-tree agents, etc. Included are: 2,6-di-tert-butyl para-cresol, laurylstearylthiopropionate, 2-hydroxybenzophenone, (2'-hydroxyphenyl)benzotriazole, trilauryltrithiophosphite, chlorinated paraffins. , tetrabromoethane, sorbitan monofatty acid ester, ethylene oxide adduct of fatty acid, stearylamide, ethylene bistearoamide, montan wax, cadmium stearate, polyethylene oxide, phthalocyanine blue, polyethylene wax, dicumyl peroxide, polysiloxane, tetramethoxy Silane, γ-methacryloxypropyltrimethoxysilane, polysiloxane-oxyalkylene copolymer, vanillin, geraniol, flavonoids, low molecular weight polyolefins, etc.
【0010】本発明におけるこれら表面ブリード性化合
物の使用量は、これらの化合物が通常ポリオレフィン系
樹脂組成物に配合される量を越え、かつフィルムまたは
シートのヒートシール方法による熱融着を阻害する範囲
の使用量または存在量である。例えば、高圧法ポリエチ
レンフィルムに使用される酸化防止剤であるペンタエリ
スリトールテトラキス(β−ラウリルチオプロピオネー
ト)は0.1重量%以下の添加ではフィルム表面に全く
滲出せず、0.1重量%を越えると滲出量も増加してい
き、2重量%ではヒートシール強度が10%低下し、5
重量%ではヒートシールが不可能となる。また、特開昭
59−230011号に開示されている方法に従って、
密度が0.91g/ml、メルトインデックス0.9g
/10分のエチレン−ブテン−1共重合体を製造したと
ころ、重量平均分子量が10000以下のものが8重量
%存在し、このポリマーから製造した厚さ80μmのフ
ィルムを3ヵ月放置後ヒートシールすると、ヒートシー
ル強度は0.2kg/15mmであり、重合時の低分子
量物質がヒートシール強度を阻害していることがわかる
。[0010] The amount of these surface-bleeding compounds to be used in the present invention is within a range that exceeds the amount normally blended into polyolefin resin compositions and inhibits the thermal fusion of the film or sheet by the heat sealing method. is the amount used or present. For example, pentaerythritol tetrakis (β-laurylthiopropionate), an antioxidant used in high-pressure polyethylene films, does not ooze out onto the film surface at all when added at 0.1% by weight or less; Exceeding 5% by weight increases the amount of exudation, and at 2% by weight, the heat seal strength decreases by 10%,
% by weight makes heat sealing impossible. In addition, according to the method disclosed in Japanese Patent Application Laid-Open No. 59-230011,
Density is 0.91g/ml, melt index 0.9g
When an ethylene-butene-1 copolymer with a weight average molecular weight of 10,000 or less was produced, 8% by weight of the ethylene-butene-1 copolymer with a weight average molecular weight of 10,000 or less was produced. The heat seal strength was 0.2 kg/15 mm, indicating that the low molecular weight substance during polymerization inhibited the heat seal strength.
【0011】本発明においてフィルムまたはシートの表
面に深さ5〜30μmのエンボス模様を施す方法は、適
当な表面粗度を有するチルロールとプレッシャーロール
との間でフィルムまたはシートを加圧することにより行
われ、これにより該フィルムまたはシートのヒートシー
ル面にエンボス模様が施される。エンボス模様の種類と
しては亀甲、格子、絹目、ダイヤ、玉虫、麻目、梨地、
しぶき等が有効である。しかし、これらに限定されるも
のではなく、例えば凹部と凸部が連続線上に連なり、交
互に谷と山が形成される場合も包含され、この場合もヒ
ートシール強度の向上が認められる。[0011] In the present invention, the method of forming an embossed pattern with a depth of 5 to 30 μm on the surface of a film or sheet is carried out by pressing the film or sheet between a chill roll and a pressure roll having an appropriate surface roughness. , whereby an embossed pattern is applied to the heat-sealed surface of the film or sheet. Types of embossed patterns include tortoise shell, lattice, silk, diamond, bead, linen, satin,
Spraying etc. is effective. However, the present invention is not limited to these, and includes, for example, a case in which concave portions and convex portions are continuous on a continuous line and valleys and peaks are formed alternately, and an improvement in heat sealing strength is also observed in this case.
【0012】また、エンボス深さ(JIS B060
1に準拠して測定)は5〜30μmであるが、これは5
μm以下であるとヒートシール強度が不十分であり、3
0μm以上であっても同様にヒートシール強度が不十分
であることによる。さらに詳細には、エンボス深さが5
μm以下では表面にブリードした化合物が比較的平坦に
厚い表面層を形成しており、これがヒートシールによっ
てポリオレフィン系のフィルムのエンボス凸部が露出し
バージンな凸部同士が圧着され熱融着されることを阻害
する。一方、30μm以上ではエンボス凸部はヒートシ
ールにより凸部のポリオレフィンが露出しバージンな凸
部同士が圧着され熱融着されるものの、エンボス深さの
値が大きいということは、フィルム全体の面積に対して
凸部の面積が相対的に減少しているということであり、
熱融着する凸部同士の面積が減少しており、面積あたり
のヒートシール強度は低下する。これに対し、本発明に
おけるエンボス深さの数値範囲である5〜30μmの範
囲では、凸部の熱融着面同士の界面に存在する表面ブリ
ード性化合物が相対的に減少し、かつフィルム面積に対
して凸部の面積が相対的に大きく、両者の効果のバラン
スがとれており、高いヒートシール強度が得られるもの
である。なお、本発明におけるエンボス深さは15〜2
5μmが好適である。[0012] Also, the embossing depth (JIS B060
1) is 5 to 30 μm;
If it is less than μm, the heat sealing strength is insufficient;
This is because the heat sealing strength is similarly insufficient even if the thickness is 0 μm or more. More specifically, the emboss depth is 5
At micrometers or less, the compound that bleeds onto the surface forms a relatively flat and thick surface layer, and when this is heat-sealed, the embossed convex parts of the polyolefin film are exposed, and the virgin convex parts are pressed together and heat-sealed. to prevent things from happening. On the other hand, at 30 μm or more, the polyolefin of the embossed convex portion is exposed by heat sealing, and the virgin convex portions are pressed together and heat-sealed, but the large value of the emboss depth means that the area of the entire film In contrast, the area of the convex portion is relatively reduced,
The area of the convex portions that are heat-sealed to each other is reduced, and the heat-sealing strength per area is reduced. On the other hand, in the range of 5 to 30 μm, which is the numerical range of the embossing depth in the present invention, the surface bleeding compound present at the interface between the heat-sealed surfaces of the convex portions is relatively reduced, and the film area is reduced. On the other hand, the area of the convex portion is relatively large, and both effects are well balanced and high heat sealing strength can be obtained. In addition, the embossing depth in the present invention is 15 to 2
5 μm is suitable.
【0013】本発明においてポリオレフィン系樹脂とは
、高圧法ポリエチレン、線状低密度ポリエチレン、エチ
レン−α−オレフィン共重合体、エチレン−酢酸ビニル
共重合体、エチレン−アクリル酸エステル共重合体、エ
チレン−ビニルアルコール共重合体、エチレン−一酸化
炭素系共重合体、アイオノマー、高密度ポリエチレン、
中密度ポリエチレン、ポリプロピレン、プロピレン−α
−オレフィン共重合体等を意味する。In the present invention, polyolefin resins include high-pressure polyethylene, linear low-density polyethylene, ethylene-α-olefin copolymer, ethylene-vinyl acetate copolymer, ethylene-acrylic acid ester copolymer, ethylene- Vinyl alcohol copolymer, ethylene-carbon monoxide copolymer, ionomer, high density polyethylene,
Medium density polyethylene, polypropylene, propylene-α
- means an olefin copolymer, etc.
【0014】[0014]
【実施例】次に実施例に基づいて本発明をさらに詳細に
説明する。
実施例1〜3,比較例1〜2
エチルアクリレート含有量19%、メルトインデックス
0.75g/10分のエチレン−エチルアクリレート共
重合体(日本ユニカー製,商品名WN−130)100
重量部、酸化防止剤ペンタエリスリトールテトラキス(
β−ラウリルチオプロピオネート)(シプロ化成製,商
品名Seenox412S)1.8重量部をバンバリー
ミキサーにより160℃で10分間混練した後、造粒し
てペレットを得た。このペレットの形態にある樹脂組成
物からTダイにより厚さ100μmのフィルムを製造し
、そのフィルムに梨地模様のエンボス加工を、下の表1
に示す種々のエンボス深さで施し、これを3ヵ月室温で
放置した後、ヒートシール(温度140℃,圧力1kg
/cm2 ,1秒)を行い、ヒートシール強度を測定し
た。結果を表1にまとめて示す。なお、上記フィルムの
エンボス加工を施さずに上記と同様の条件でヒートシー
ルしたもののヒートシール強度は、フィルム製造直後で
1.3kg/15mmであり、3ヵ月後は0.1kg/
15mmであった。EXAMPLES Next, the present invention will be explained in more detail based on examples. Examples 1 to 3, Comparative Examples 1 to 2 Ethylene-ethyl acrylate copolymer with ethyl acrylate content of 19% and melt index of 0.75 g/10 min (manufactured by Nippon Unicar, trade name WN-130) 100
Parts by weight, antioxidant pentaerythritol tetrakis (
After kneading 1.8 parts by weight of β-lauryl thiopropionate (manufactured by Cipro Kasei, trade name: Seenox 412S) at 160°C for 10 minutes using a Banbury mixer, the mixture was granulated to obtain pellets. A film with a thickness of 100 μm was produced from this resin composition in the form of pellets using a T-die, and the film was embossed with a satin pattern as shown in Table 1 below.
The embossing depths shown in Figure 1 were applied to various embossing depths, and after being left at room temperature for 3 months, heat sealing was performed (temperature 140°C, pressure 1kg).
/cm2, 1 second) to measure the heat seal strength. The results are summarized in Table 1. The heat-seal strength of the above film heat-sealed under the same conditions as above without embossing was 1.3 kg/15 mm immediately after film production, and 0.1 kg/15 mm after 3 months.
It was 15 mm.
【0015】実施例4〜6,比較例3〜4特開昭59−
230011号に開示されている方法に従って、密度0
.906g/ml、メルトインデックス0.8g/10
分、重量平均分子量60000であり、重量平均分子量
が15000以下の低重合体を15重量%含有するエチ
レン−ブテン−1共重合体から、Tダイ法により厚さ8
0μmのフィルムを製造し、直後にヒートシール(温度
150℃,圧力1kg/cm2 ,1秒)を行ったとこ
ろ、ヒートシール強度は1.5kg/15mmであった
。また、フィルムを3ヵ月室温で放置した後、上記と同
様の条件でヒートシールを行ったところ、ヒートシール
強度は0.2kg/15mmであった。一方、フィルム
製造直後、梨地模様のエンボス加工を、下の表2に示す
種々のエンボス深さで施し、これを3ヵ月室温で放置し
た後、上記と同様の条件でヒートシールを行ったものに
ついても、ヒートシール強度を測定した。結果を表2に
まとめて示す。Examples 4 to 6, Comparative Examples 3 to 4 JP-A-59-
According to the method disclosed in No. 230011, the density is 0.
.. 906g/ml, melt index 0.8g/10
From an ethylene-butene-1 copolymer having a weight average molecular weight of 60,000 and containing 15% by weight of a low polymer having a weight average molecular weight of 15,000 or less, a thickness of 8
Immediately after producing a 0 μm film, heat sealing (temperature 150° C., pressure 1 kg/cm 2 , 1 second) was performed, and the heat sealing strength was 1.5 kg/15 mm. Further, after the film was left at room temperature for 3 months, heat sealing was performed under the same conditions as above, and the heat seal strength was 0.2 kg/15 mm. On the other hand, immediately after the film was manufactured, it was embossed with a satin pattern at various embossing depths shown in Table 2 below, and after being left at room temperature for three months, it was heat-sealed under the same conditions as above. The heat seal strength was also measured. The results are summarized in Table 2.
【0016】[0016]
【発明の効果】以上詳細に説明したように、本発明のフ
ィルムまたはシートのヒートシール方法は、フィルムま
たはシート表面に特定範囲のエンボス深さのエンボス模
様を施したことにより、従来のヒートシール法では熱融
着できなかった表面ブリード性化合物を多量に含有する
ポリオレフィン系樹脂組成物からのフィルムまたはシー
トを、ヒートシール強度を低下させることなく、熱融着
することを可能とした。Effects of the Invention As explained in detail above, the film or sheet heat sealing method of the present invention is superior to the conventional heat sealing method by providing an embossed pattern with a specific range of emboss depth on the surface of the film or sheet. It has now become possible to heat-seal a film or sheet made of a polyolefin resin composition containing a large amount of surface-bleeding compound, which could not be heat-sealed in the previous method, without reducing the heat-sealing strength.
【0017】従って、本発明の方法によれば、優れた機
能を有していながらヒートシール強度が低いという理由
で従来利用されなかった低分子量重合体を含有するポリ
オレフィンや、機能性付与剤を通常の使用量以上に多量
に含有するポリオレフィン系樹脂組成物から製造された
フィルムまたはシートのヒートシール強度を改善するこ
とができ、これらのフィルムまたはシートの利用分野が
拡大され、機能および性能に優れた各種物品の包装袋、
または建築、土木、農業等に使用する広幅シート、バッ
クインボックス、簡易手袋、プラスチック封筒等の製造
が可能である。Therefore, according to the method of the present invention, polyolefins containing low molecular weight polymers and functional agents, which have excellent functions but have not been used conventionally because of their low heat sealing strength, and functional agents can be used. It is possible to improve the heat seal strength of films or sheets manufactured from polyolefin resin compositions containing a larger amount than the amount used, expanding the field of use of these films or sheets, and improving functionality and performance. Packaging bags for various items,
Alternatively, it is possible to manufacture wide sheets, back-in-boxes, simple gloves, plastic envelopes, etc. used in construction, civil engineering, agriculture, etc.
Claims (2)
るポリオレフィン系樹脂組成物から製造したフィルムま
たはシートをヒートシールする方法において、該フィル
ムまたはシートの表面に深さ5〜30μmのエンボス模
様を施したことを特徴とするフィルムまたはシートのヒ
ートシール方法。Claim 1: A method of heat-sealing a film or sheet produced from a polyolefin resin composition containing a large amount of a surface-bleeding compound, in which an embossed pattern with a depth of 5 to 30 μm is applied to the surface of the film or sheet. A method for heat sealing a film or sheet, characterized by:
低分子量重合体、酸化防止剤、帯電防止剤、紫外線吸収
剤、遠赤外線発生剤、難燃剤、滑剤、可塑剤、架橋剤、
光沢剤、光安定剤、熱安定剤、加工助剤、金属腐蝕防止
剤、防曇剤、霧発生防止剤、着色剤、防カビ剤、鮮度保
持剤、防臭剤、揆水剤、電圧安定剤、トリー防止剤等か
ら選択される請求項1記載のフィルムまたはシートのヒ
ートシール方法。2. The surface bleeding compound is a bleeding low molecular weight polymer, an antioxidant, an antistatic agent, an ultraviolet absorber, a far-infrared generator, a flame retardant, a lubricant, a plasticizer, a crosslinking agent,
Brighteners, light stabilizers, heat stabilizers, processing aids, metal corrosion inhibitors, anti-fog agents, anti-fog agents, colorants, anti-mold agents, freshness-preserving agents, deodorants, water repellents, voltage stabilizers 2. The method of heat sealing a film or sheet according to claim 1, wherein the heat sealing agent is selected from the group consisting of .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP41491590A JP3049097B2 (en) | 1990-12-27 | 1990-12-27 | Heat sealing method for film or sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP41491590A JP3049097B2 (en) | 1990-12-27 | 1990-12-27 | Heat sealing method for film or sheet |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04224928A true JPH04224928A (en) | 1992-08-14 |
JP3049097B2 JP3049097B2 (en) | 2000-06-05 |
Family
ID=18523343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP41491590A Expired - Fee Related JP3049097B2 (en) | 1990-12-27 | 1990-12-27 | Heat sealing method for film or sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3049097B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1110707A3 (en) * | 1997-03-26 | 2002-08-21 | Takata Corporation | Air bag |
-
1990
- 1990-12-27 JP JP41491590A patent/JP3049097B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1110707A3 (en) * | 1997-03-26 | 2002-08-21 | Takata Corporation | Air bag |
Also Published As
Publication number | Publication date |
---|---|
JP3049097B2 (en) | 2000-06-05 |
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