JP7059202B2 - Crosslinkable resin compositions and crosslinked products, their production methods, and multilayer structures. - Google Patents
Crosslinkable resin compositions and crosslinked products, their production methods, and multilayer structures. Download PDFInfo
- Publication number
- JP7059202B2 JP7059202B2 JP2018559549A JP2018559549A JP7059202B2 JP 7059202 B2 JP7059202 B2 JP 7059202B2 JP 2018559549 A JP2018559549 A JP 2018559549A JP 2018559549 A JP2018559549 A JP 2018559549A JP 7059202 B2 JP7059202 B2 JP 7059202B2
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- JP
- Japan
- Prior art keywords
- ethylene
- group
- cross
- evoh
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011342 resin composition Substances 0.000 title claims description 50
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 claims description 92
- 239000003431 cross linking reagent Substances 0.000 claims description 63
- 238000004132 cross linking Methods 0.000 claims description 32
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 27
- 239000005977 Ethylene Substances 0.000 claims description 27
- 229920001567 vinyl ester resin Polymers 0.000 claims description 25
- 150000002989 phenols Chemical class 0.000 claims description 21
- 238000002156 mixing Methods 0.000 claims description 18
- 238000007127 saponification reaction Methods 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 15
- 238000007334 copolymerization reaction Methods 0.000 claims description 10
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims description 8
- UFRKOOWSQGXVKV-UHFFFAOYSA-N ethene;ethenol Chemical compound C=C.OC=C UFRKOOWSQGXVKV-UHFFFAOYSA-N 0.000 description 77
- 239000004715 ethylene vinyl alcohol Substances 0.000 description 76
- -1 amide compound Chemical class 0.000 description 60
- 239000010410 layer Substances 0.000 description 57
- 239000000047 product Substances 0.000 description 48
- 238000000034 method Methods 0.000 description 41
- 229920000642 polymer Polymers 0.000 description 31
- 238000000465 moulding Methods 0.000 description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 25
- 238000002844 melting Methods 0.000 description 23
- 230000008018 melting Effects 0.000 description 23
- 239000002904 solvent Substances 0.000 description 19
- 238000010894 electron beam technology Methods 0.000 description 16
- 238000001125 extrusion Methods 0.000 description 15
- 239000011229 interlayer Substances 0.000 description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 12
- 238000010030 laminating Methods 0.000 description 12
- 229910052760 oxygen Inorganic materials 0.000 description 12
- 239000001301 oxygen Substances 0.000 description 12
- 239000002356 single layer Substances 0.000 description 12
- 230000002087 whitening effect Effects 0.000 description 12
- 229910052783 alkali metal Inorganic materials 0.000 description 11
- 230000000694 effects Effects 0.000 description 11
- 238000004898 kneading Methods 0.000 description 11
- 239000005022 packaging material Substances 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 239000000499 gel Substances 0.000 description 9
- 229920000098 polyolefin Polymers 0.000 description 9
- 239000004743 Polypropylene Substances 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 8
- 229920001155 polypropylene Polymers 0.000 description 8
- 125000003342 alkenyl group Chemical group 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 7
- 235000010338 boric acid Nutrition 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 6
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- 229910019142 PO4 Inorganic materials 0.000 description 6
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 6
- 239000010452 phosphate Substances 0.000 description 6
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 5
- OKOBUGCCXMIKDM-UHFFFAOYSA-N Irganox 1098 Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NCCCCCCNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 OKOBUGCCXMIKDM-UHFFFAOYSA-N 0.000 description 5
- 239000004952 Polyamide Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 150000001340 alkali metals Chemical class 0.000 description 5
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 5
- 150000001639 boron compounds Chemical class 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 150000002430 hydrocarbons Chemical group 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 229920002647 polyamide Polymers 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 5
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 4
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 4
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 4
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical group OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 4
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 125000000304 alkynyl group Chemical group 0.000 description 4
- 150000001408 amides Chemical class 0.000 description 4
- 229960002645 boric acid Drugs 0.000 description 4
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 4
- 150000002148 esters Chemical group 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 125000001424 substituent group Chemical group 0.000 description 4
- 229920001169 thermoplastic Polymers 0.000 description 4
- 150000003918 triazines Chemical class 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 3
- 231100000987 absorbed dose Toxicity 0.000 description 3
- 239000002998 adhesive polymer Substances 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 125000005619 boric acid group Chemical class 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 3
- 235000013305 food Nutrition 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000005842 heteroatom Chemical group 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 3
- 238000003856 thermoforming Methods 0.000 description 3
- JIHQDMXYYFUGFV-UHFFFAOYSA-N 1,3,5-triazine Chemical compound C1=NC=NC=N1 JIHQDMXYYFUGFV-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004971 Cross linker Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical class C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 150000001336 alkenes Chemical group 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 150000001642 boronic acid derivatives Chemical class 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- 238000010101 extrusion blow moulding Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 235000011056 potassium acetate Nutrition 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000001632 sodium acetate Substances 0.000 description 2
- 235000017281 sodium acetate Nutrition 0.000 description 2
- 239000001488 sodium phosphate Substances 0.000 description 2
- 229910000162 sodium phosphate Inorganic materials 0.000 description 2
- 235000011008 sodium phosphates Nutrition 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 150000003460 sulfonic acids Chemical class 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 2
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- FYADHXFMURLYQI-UHFFFAOYSA-N 1,2,4-triazine Chemical compound C1=CN=NC=N1 FYADHXFMURLYQI-UHFFFAOYSA-N 0.000 description 1
- ZXHDVRATSGZISC-UHFFFAOYSA-N 1,2-bis(ethenoxy)ethane Chemical compound C=COCCOC=C ZXHDVRATSGZISC-UHFFFAOYSA-N 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- VFBJXXJYHWLXRM-UHFFFAOYSA-N 2-[2-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]ethylsulfanyl]ethyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCSCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 VFBJXXJYHWLXRM-UHFFFAOYSA-N 0.000 description 1
- XDVOLDOITVSJGL-UHFFFAOYSA-N 3,7-dihydroxy-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane Chemical compound O1B(O)OB2OB(O)OB1O2 XDVOLDOITVSJGL-UHFFFAOYSA-N 0.000 description 1
- FYRWKWGEFZTOQI-UHFFFAOYSA-N 3-prop-2-enoxy-2,2-bis(prop-2-enoxymethyl)propan-1-ol Chemical compound C=CCOCC(CO)(COCC=C)COCC=C FYRWKWGEFZTOQI-UHFFFAOYSA-N 0.000 description 1
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical group C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 1
- ZVVFVKJZNVSANF-UHFFFAOYSA-N 6-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]hexyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCCCCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 ZVVFVKJZNVSANF-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
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- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical class OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
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- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229920010126 Linear Low Density Polyethylene (LLDPE) Polymers 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
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- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
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- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
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- 239000003513 alkali Substances 0.000 description 1
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- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001356 alkyl thiols Chemical class 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
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- 125000005018 aryl alkenyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
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- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical class B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000480 butynyl group Chemical group [*]C#CC([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
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- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
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- 229940125904 compound 1 Drugs 0.000 description 1
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- 150000007973 cyanuric acids Chemical class 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000001047 cyclobutenyl group Chemical group C1(=CCC1)* 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 1
- 125000003493 decenyl group Chemical group [H]C([*])=C([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002781 deodorant agent Substances 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- ZPWVASYFFYYZEW-UHFFFAOYSA-L dipotassium hydrogen phosphate Chemical compound [K+].[K+].OP([O-])([O-])=O ZPWVASYFFYYZEW-UHFFFAOYSA-L 0.000 description 1
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- IWGQOMVDNOSOKA-GKFVBPDJSA-N ethenyl (5z,8z,11z,14z)-icosa-5,8,11,14-tetraenoate Chemical compound CCCCC\C=C/C\C=C/C\C=C/C\C=C/CCCC(=O)OC=C IWGQOMVDNOSOKA-GKFVBPDJSA-N 0.000 description 1
- YCUBDDIKWLELPD-UHFFFAOYSA-N ethenyl 2,2-dimethylpropanoate Chemical compound CC(C)(C)C(=O)OC=C YCUBDDIKWLELPD-UHFFFAOYSA-N 0.000 description 1
- MEGHWIAOTJPCHQ-UHFFFAOYSA-N ethenyl butanoate Chemical compound CCCC(=O)OC=C MEGHWIAOTJPCHQ-UHFFFAOYSA-N 0.000 description 1
- GLVVKKSPKXTQRB-UHFFFAOYSA-N ethenyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OC=C GLVVKKSPKXTQRB-UHFFFAOYSA-N 0.000 description 1
- GFJVXXWOPWLRNU-UHFFFAOYSA-N ethenyl formate Chemical compound C=COC=O GFJVXXWOPWLRNU-UHFFFAOYSA-N 0.000 description 1
- AFSIMBWBBOJPJG-UHFFFAOYSA-N ethenyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC=C AFSIMBWBBOJPJG-UHFFFAOYSA-N 0.000 description 1
- QBDADGJLZNIRFQ-UHFFFAOYSA-N ethenyl octanoate Chemical compound CCCCCCCC(=O)OC=C QBDADGJLZNIRFQ-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 235000012438 extruded product Nutrition 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000005021 flexible packaging material Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000005003 food packaging material Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000005251 gamma ray Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 125000005980 hexynyl group Chemical group 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229920005679 linear ultra low density polyethylene Polymers 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910001386 lithium phosphate Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229910000402 monopotassium phosphate Inorganic materials 0.000 description 1
- 235000019796 monopotassium phosphate Nutrition 0.000 description 1
- 229910000403 monosodium phosphate Inorganic materials 0.000 description 1
- 235000019799 monosodium phosphate Nutrition 0.000 description 1
- 125000006606 n-butoxy group Chemical group 0.000 description 1
- 125000003506 n-propoxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 125000005187 nonenyl group Chemical group C(=CCCCCCCC)* 0.000 description 1
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 1
- MBAUOPQYSQVYJV-UHFFFAOYSA-N octyl 3-[4-hydroxy-3,5-di(propan-2-yl)phenyl]propanoate Chemical compound OC1=C(C=C(C=C1C(C)C)CCC(=O)OCCCCCCCC)C(C)C MBAUOPQYSQVYJV-UHFFFAOYSA-N 0.000 description 1
- 125000005069 octynyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C#C* 0.000 description 1
- 238000006384 oligomerization reaction Methods 0.000 description 1
- 230000003606 oligomerizing effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- VGTPKLINSHNZRD-UHFFFAOYSA-N oxoborinic acid Chemical compound OB=O VGTPKLINSHNZRD-UHFFFAOYSA-N 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 125000005981 pentynyl group Chemical group 0.000 description 1
- 239000000575 pesticide Substances 0.000 description 1
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229940114930 potassium stearate Drugs 0.000 description 1
- ANBFRLKBEIFNQU-UHFFFAOYSA-M potassium;octadecanoate Chemical compound [K+].CCCCCCCCCCCCCCCCCC([O-])=O ANBFRLKBEIFNQU-UHFFFAOYSA-M 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- QLNJFJADRCOGBJ-UHFFFAOYSA-N propionamide Chemical compound CCC(N)=O QLNJFJADRCOGBJ-UHFFFAOYSA-N 0.000 description 1
- 125000002568 propynyl group Chemical group [*]C#CC([H])([H])[H] 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 229920006300 shrink film Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 1
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 125000004213 tert-butoxy group Chemical group [H]C([H])([H])C(O*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- AJSTXXYNEIHPMD-UHFFFAOYSA-N triethyl borate Chemical compound CCOB(OCC)OCC AJSTXXYNEIHPMD-UHFFFAOYSA-N 0.000 description 1
- TWQULNDIKKJZPH-UHFFFAOYSA-K trilithium;phosphate Chemical compound [Li+].[Li+].[Li+].[O-]P([O-])([O-])=O TWQULNDIKKJZPH-UHFFFAOYSA-K 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- WRECIMRULFAWHA-UHFFFAOYSA-N trimethyl borate Chemical compound COB(OC)OC WRECIMRULFAWHA-UHFFFAOYSA-N 0.000 description 1
- 229920001866 very low density polyethylene Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/12—Hydrolysis
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
- C08K5/105—Esters; Ether-esters of monocarboxylic acids with phenols
- C08K5/107—Esters; Ether-esters of monocarboxylic acids with phenols with polyphenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/20—Carboxylic acid amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
- C08L29/02—Homopolymers or copolymers of unsaturated alcohols
- C08L29/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Description
本発明は、樹脂組成物及び架橋物、並びにそれらの製造方法、並びに多層構造体に関する。 The present invention relates to resin compositions and crosslinked products, methods for producing them, and multilayer structures.
エチレン-ビニルアルコール共重合体(以下、単に「EVOH」ともいう)は、その酸素透過量が他のプラスチックに比較して非常に小さく、また溶融成形性も良好であるため、食品包装材料その他の包装材料として幅広く使用されている。しかしながら、EVOHを用いた包装材料にレトルト処理を行ったり、高温高湿度条件で長時間にわたって使用したりした場合、白化や変形が生じたり、バリア性が低下したりすることがあったため、耐熱水性の向上が求められていた。また、産業用パイプ用途にEVOHを用いる場合には、耐熱溶剤性の向上が求められていた。 Ethylene-vinyl alcohol copolymer (hereinafter, also simply referred to as "EVOH") has a very small oxygen permeation amount as compared with other plastics and has good melt moldability. Widely used as a packaging material. However, when the packaging material using EVOH is retort-treated or used for a long time under high temperature and high humidity conditions, whitening or deformation may occur or the barrier property may be deteriorated. Was required to improve. Further, when EVOH is used for industrial pipe applications, improvement in heat-resistant solvent resistance has been required.
耐熱水性や耐熱溶剤性を改善する方策として、電子線等の活性エネルギー線の利用により、EVOHに架橋を施すという技術が種々提案されている。例えば、特許文献1には架橋剤としてトリアリルシアヌレート又はトリアリルイソシアヌレートを使用し、これらをEVOHと溶融混練した後に、電子線を照射して架橋させる方法が開示されている。 As a measure for improving heat-resistant water-resistant water-resistant solvent-resistant properties, various techniques have been proposed in which EVOH is crosslinked by using an active energy ray such as an electron beam. For example, Patent Document 1 discloses a method in which triallyl cyanurate or triallyl isocyanurate is used as a cross-linking agent, and these are melt-kneaded with EVOH and then irradiated with an electron beam for cross-linking.
また、特許文献2には、EVOHにアリルエーテル基を2つ以上有する化合物を添加し、電子線を照射して架橋させる手法が開示されている。 Further, Patent Document 2 discloses a method of adding a compound having two or more allyl ether groups to EVOH and irradiating it with an electron beam to crosslink it.
さらに、特許文献3には、EVOHを、二重結合を有するエポキシ化合物及び二重結合を有しないエポキシ化合物で変性し、得られた変性EVOHの少なくとも一部を、電子線を照射して架橋させる方法が開示されている。 Further, in Patent Document 3, EVOH is modified with an epoxy compound having a double bond and an epoxy compound having no double bond, and at least a part of the obtained modified EVOH is crosslinked by irradiating with an electron beam. The method is disclosed.
また、特許文献4には、EVOHに複数の二重結合を有するアミド化合物を添加し、電子線を照射して架橋させる手法が開示されている。 Further, Patent Document 4 discloses a method of adding an amide compound having a plurality of double bonds to EVOH and irradiating it with an electron beam to crosslink it.
しかしながら、特許文献1または特許文献2で得られた架橋物を用いたフィルムをラミネートした多層フィルムは、層間接着性が不十分となることがあると共に、耐熱水性及び耐熱溶剤性に改善の余地があった。特許文献3の架橋物では、EVOHを変性させるのに特殊な押出機が必要であり、汎用性に欠けるといった問題があった。特許文献4には、架橋剤に特定の極性基を持たせ、かつ、そのSP値をEVOHのSP値に近づけることで、ブリードアウトを有効に抑制できることが記載されているが、EVOHのSP値はエチレン含量等により変動するため、用いるEVOHの種類によっては架橋剤のブリードアウトの抑制が十分で無く、包装材としたときに衛生上の問題が懸念された。 However, the multilayer film obtained by laminating the film using the crosslinked product obtained in Patent Document 1 or Patent Document 2 may have insufficient interlayer adhesiveness, and there is room for improvement in heat resistance water resistance and heat resistance solvent resistance. there were. The crosslinked product of Patent Document 3 requires a special extruder to denature EVOH, and has a problem of lacking versatility. Patent Document 4 describes that bleed-out can be effectively suppressed by giving a specific polar group to the cross-linking agent and bringing the SP value close to the SP value of EVOH. Since bleed-out of the cross-linking agent is not sufficiently suppressed depending on the type of EVOH used, there is a concern about hygiene problems when it is used as a packaging material.
本発明は上記のような事情に基づいてなされたものであり、その目的は、耐熱水性、耐熱溶剤性と多層構造体としたときの層間接着性に優れた架橋物を形成可能な樹脂組成物を、使用するEVOHの種類に制限されることなく提供することにある。 The present invention has been made based on the above circumstances, and an object thereof is a resin composition capable of forming a crosslinked product having excellent heat-resistant water-resistant property, heat-resistant solvent property, and interlayer adhesion when formed into a multilayer structure. Is provided without limitation on the type of EVOH used.
本発明者らは、官能基の種類や対称性など、特定の化学構造を有する架橋性化合物が、EVOHに対して特に架橋効果が高く、耐熱水性及び耐熱溶剤性を向上させることを見出した。また、本発明者らは、架橋性化合物がブリードアウトを起こす要因は、EVOHと架橋剤の化学的相互作用だけではなく、架橋剤の物理的状態や分子量(分子サイズ)なども影響を与えることを見出し、本発明に至った。上記課題を解決するためになされた発明は、以下の通りである。 The present inventors have found that a crosslinkable compound having a specific chemical structure such as the type and symmetry of a functional group has a particularly high crosslinking effect on EVOH and improves heat resistant water and heat resistant solvent resistance. In addition, the present inventors consider that the factors that cause the crosslinkable compound to bleed out are not only the chemical interaction between EVOH and the crosslinker, but also the physical state and molecular weight (molecular size) of the crosslinker. And came to the present invention. The inventions made to solve the above problems are as follows.
(1) エチレン-ビニルアルコール共重合体(A)100質量部に対し、架橋剤(B)0.4~10質量部を含む樹脂組成物であって、架橋剤(B)が、3以上の重合性基を有する融点40℃を超えるトリアジン誘導体である、樹脂組成物;
(2) 架橋剤(B)がトリアリルシアヌレートの重合体、トリアリルイソシアヌレートの重合体、トリメタリルイソシアヌレート及びトリメタリルイソシアヌレートの重合体からなる群より選ばれる少なくとも一種を含む、上記(1)に記載の樹脂組成物;
(3) 架橋剤(B)がトリメタリルイソシアヌレートである、上記(1)又は(2)に記載の樹脂組成物;
(4) 前記エチレン-ビニルアルコール共重合体(A)100質量部に対し、エステル結合又はアミド結合を有するヒンダードフェノール系化合物(C)0.05~10質量部をさらに含む、上記(1)~(3)のいずれか1項に記載の樹脂組成物;
(5) ヒンダードフェノール系化合物(C)がアミド結合を有する、上記(4)に記載の樹脂組成物;
(6) 活性エネルギー線架橋用である、上記(1)~(5)のいずれか1項に記載の樹脂組成物;
(7) 上記(1)~(6)のいずれか1項に記載の樹脂組成物から得られる架橋物;
(8) 上記(7)に記載の架橋物からなるフィルム;
(9) 上記(7)に記載の架橋物からなる層を有する多層構造体;
(10) 上記(9)に記載の多層構造体を有するレトルト容器;
(11) 上記(9)に記載の多層構造体を有するパイプ;
(12) エチレンとビニルエステルとを共重合してエチレン-ビニルエステル共重合体を得る共重合工程、前記エチレン-ビニルエステル共重合体をけん化してエチレン-ビニルアルコール共重合体(A)を得るけん化工程、及びエチレン-ビニルアルコール共重合体(A)と架橋剤(B)とを混合して混合物を得る混合工程を含む、上記(1)~(6)のいずれか1項に記載の樹脂組成物の製造方法;
(13) エチレンとビニルエステルとを共重合してエチレン-ビニルエステル共重合体を得る共重合工程、前記エチレン-ビニルエステル共重合体をけん化してエチレン-ビニルアルコール共重合体(A)を得るけん化工程、エチレン-ビニルアルコール共重合体(A)と架橋剤(B)とを混合して混合物を得る混合工程、及び前記混合工程で得られた前記混合物に活性エネルギー線を照射する架橋工程を含む、上記(7)に記載の架橋物の製造方法。(1) A resin composition containing 0.4 to 10 parts by mass of the cross-linking agent (B) with respect to 100 parts by mass of the ethylene-vinyl alcohol copolymer (A), and the cross-linking agent (B) is 3 or more. A resin composition which is a triazine derivative having a polymerizable group and having a melting point of more than 40 ° C.;
(2) The cross-linking agent (B) contains at least one selected from the group consisting of a polymer of triallyl cyanurate, a polymer of triallyl isocyanurate, a polymer of trimetalyl isocyanurate and a polymer of trimetalyl isocyanurate. The resin composition according to 1);
(3) The resin composition according to (1) or (2) above, wherein the cross-linking agent (B) is trimetalyl isocyanurate.
(4) The above (1) further contains 0.05 to 10 parts by mass of a hindered phenolic compound (C) having an ester bond or an amide bond with respect to 100 parts by mass of the ethylene-vinyl alcohol copolymer (A). The resin composition according to any one of (3);
(5) The resin composition according to (4) above, wherein the hindered phenolic compound (C) has an amide bond;
(6) The resin composition according to any one of (1) to (5) above, which is used for active energy ray cross-linking;
(7) A crosslinked product obtained from the resin composition according to any one of (1) to (6) above;
(8) A film made of the crosslinked product according to (7) above;
(9) A multilayer structure having a layer made of the crosslinked product according to (7) above;
(10) A retort container having the multilayer structure according to (9) above;
(11) A pipe having the multilayer structure according to (9) above;
(12) A copolymerization step of copolymerizing ethylene and a vinyl ester to obtain an ethylene-vinyl ester copolymer, and saponifying the ethylene-vinyl ester copolymer to obtain an ethylene-vinyl alcohol copolymer (A). The resin according to any one of (1) to (6) above, which comprises a saponification step and a mixing step of mixing the ethylene-vinyl alcohol copolymer (A) and the cross-linking agent (B) to obtain a mixture. Method for producing the composition;
(13) A copolymerization step of copolymerizing ethylene and vinyl ester to obtain an ethylene-vinyl ester copolymer, and cross-linking the ethylene-vinyl ester copolymer to obtain an ethylene-vinyl alcohol copolymer (A). A saponification step, a mixing step of mixing the ethylene-vinyl alcohol copolymer (A) and the cross-linking agent (B) to obtain a mixture, and a cross-linking step of irradiating the mixture obtained in the mixing step with active energy rays. The method for producing a crosslinked product according to (7) above, which comprises.
本発明の樹脂組成物は、耐熱水性及び耐熱溶剤性に優れた架橋物を形成可能である。また、前記架橋物を用いた多層構造体は層間接着性に優れる。 The resin composition of the present invention can form a crosslinked product having excellent heat-resistant water-resistant and heat-resistant solvent properties. Further, the multilayer structure using the crosslinked product is excellent in interlayer adhesiveness.
<樹脂組成物>
本発明の樹脂組成物は、EVOH(A)及び架橋剤(B)を含有する。前記樹脂組成物では、架橋剤(B)として、3以上の重合性基を有する融点40℃を超えるトリアジン誘導体を用いているので、架橋反応が安定かつ十分に進行し、また、架橋剤(B)のブリードアウトを抑制することができ、耐熱水性、耐熱溶剤性及び層間接着性に優れかつ安全性の高い架橋物を提供することができる。以下、各成分について説明する。<Resin composition>
The resin composition of the present invention contains EVOH (A) and a cross-linking agent (B). In the resin composition, since the cross-linking agent (B) uses a triazine derivative having 3 or more polymerizable groups and having a melting point of more than 40 ° C., the cross-linking reaction proceeds stably and sufficiently, and the cross-linking agent (B). ) Can suppress bleed-out, and can provide a crosslinked product having excellent heat-resistant water-resistant, heat-resistant solvent resistance and interlayer adhesion and high safety. Hereinafter, each component will be described.
<EVOH(A)>
EVOH(A)は、本発明の樹脂組成物の主成分である。ここで、EVOH(A)は、主構造単位として、エチレン単位及びビニルアルコール単位を有する共重合体である。<EVOH (A)>
EVOH (A) is the main component of the resin composition of the present invention. Here, EVOH (A) is a copolymer having an ethylene unit and a vinyl alcohol unit as the main structural unit.
EVOH(A)のエチレン単位含有量(EVOH(A)中の単量体単位の総数に対するエチレン単位の数の割合)の下限としては20mol%が好ましく、22mol%がより好ましく、24mol%がさらに好ましい。一方、EVOHのエチレン単位含有量の上限としては60mol%が好ましく、55mol%がより好ましく、50mol%がさらに好ましい。EVOH(A)のエチレン単位含有量が20mol%以上であることで、高湿度下での架橋物の酸素バリア性や溶融成形性に優れたものとなる。また、EVOH(A)のエチレン単位含有量が60mol%以下であることで、酸素バリア性に優れたものとなる。 The lower limit of the ethylene unit content of EVOH (A) (the ratio of the number of ethylene units to the total number of monomer units in EVOH (A)) is preferably 20 mol%, more preferably 22 mol%, still more preferably 24 mol%. .. On the other hand, the upper limit of the ethylene unit content of EVOH is preferably 60 mol%, more preferably 55 mol%, still more preferably 50 mol%. When the ethylene unit content of EVOH (A) is 20 mol% or more, the crosslinked product has excellent oxygen barrier properties and melt moldability under high humidity. Further, when the ethylene unit content of EVOH (A) is 60 mol% or less, the oxygen barrier property is excellent.
EVOH(A)のけん化度(EVOH(A)中のビニルアルコール単位及びビニルエステル単位の総数に対するビニルアルコール単位の数の割合)の下限としては、80mol%が好ましく、95mol%がより好ましく、99mol%がさらに好ましい。一方、EVOH(A)のけん化度の上限としては100mol%が好ましく、99.99mol%がより好ましい。 The lower limit of the saponification degree of EVOH (A) (the ratio of the number of vinyl alcohol units to the total number of vinyl alcohol units and vinyl ester units in EVOH (A)) is preferably 80 mol%, more preferably 95 mol%, and more preferably 99 mol%. Is even more preferable. On the other hand, the upper limit of the saponification degree of EVOH (A) is preferably 100 mol%, more preferably 99.99 mol%.
EVOH(A)が、エチレン単位含有量の異なる2種類以上のEVOHの混合物からなる場合には、混合質量比から算出される平均値をエチレン単位含有量とする。この場合、エチレン単位含有量が最も離れたEVOH同士のエチレン単位含有量の差が30モル%以下であることが好ましい。エチレン単位含有量の差は20モル%以下がより好ましく、15モル%以下がさらに好ましい。同様に、EVOH(A)が、けん化度の異なる2種類以上のEVOHの混合物からなる場合には、混合質量比から算出される平均値を混合物のけん化度とする。この場合、けん化度の差は7%以下が好ましく、5%以下がより好ましい。EVOH(A)を含む樹脂組成物から得られる架橋物を成形して多層構造体とした時に、前記多層構造体として、熱成型性及び酸素バリア性がより高いレベルでバランスがとれたものを所望する場合は、エチレン単位含有量が24モル%以上34モル%以下であり、けん化度が99%以上のEVOHと、エチレン単位含有量が34モル%以上50モル%以下であり、けん化度が99%以上のEVOHとを、配合質量比が60/40~90/10となるように混合し、EVOH(A)として使用することが好ましい。 When EVOH (A) is composed of a mixture of two or more types of EVOH having different ethylene unit contents, the average value calculated from the mixed mass ratio is taken as the ethylene unit content. In this case, the difference in ethylene unit content between EVOHs having the farthest ethylene unit contents is preferably 30 mol% or less. The difference in ethylene unit content is more preferably 20 mol% or less, further preferably 15 mol% or less. Similarly, when EVOH (A) is composed of a mixture of two or more types of EVOH having different saponification degrees, the average value calculated from the mixed mass ratio is taken as the saponification degree of the mixture. In this case, the difference in saponification degree is preferably 7% or less, more preferably 5% or less. When a crosslinked product obtained from a resin composition containing EVOH (A) is molded into a multi-layer structure, it is desired that the multi-layer structure has a well-balanced thermal moldability and oxygen barrier property at a higher level. In this case, EVOH having an ethylene unit content of 24 mol% or more and 34 mol% or less and a saponification degree of 99% or more and an ethylene unit content of 34 mol% or more and 50 mol% or less and a saponification degree of 99 % Or more of EVOH is preferably mixed so as to have a blending mass ratio of 60/40 to 90/10 and used as EVOH (A).
EVOH(A)のエチレン単位含有量及びけん化度は、核磁気共鳴(NMR)法により求めることができる。 The ethylene unit content and saponification degree of EVOH (A) can be determined by a nuclear magnetic resonance (NMR) method.
EVOH(A)のメルトフローレート(JIS K 7210に準拠、温度210℃、荷重2160gでの測定値)の下限としては、0.1g/10分が好ましく、0.5g/10分がより好ましく、1g/10分がさらに好ましく、3g/10分が特に好ましい。一方、EVOH(A)のメルトフローレートの上限としては、200g/10分が好ましく、50g/10分がより好ましく、30g/10分がさらに好ましく、15g/10分が特に好ましく、10g/10分が最も好ましい。EVOH(A)のメルトフローレートを上記範囲の値とすることで、得られる樹脂組成物の溶融混練性及び溶融成形性が向上する。 The lower limit of the melt flow rate of EVOH (A) (based on JIS K 7210, measured value at a temperature of 210 ° C. and a load of 2160 g) is preferably 0.1 g / 10 minutes, more preferably 0.5 g / 10 minutes. 1 g / 10 minutes is more preferable, and 3 g / 10 minutes is particularly preferable. On the other hand, the upper limit of the melt flow rate of EVOH (A) is preferably 200 g / 10 minutes, more preferably 50 g / 10 minutes, further preferably 30 g / 10 minutes, particularly preferably 15 g / 10 minutes, and 10 g / 10 minutes. Is the most preferable. By setting the melt flow rate of EVOH (A) to a value in the above range, the melt-kneadability and melt-moldability of the obtained resin composition are improved.
EVOH(A)は、本発明の目的が阻害されない範囲で、エチレン単位及びビニルアルコール単位以外のその他の単量体の単位を共重合単位として少量含有することもできる。このような単量体としては、例えば、プロピレン、1-ブテン、イソブテン、4-メチル-1-ペンテン、1-ヘキセン、1-オクテン等のα-オレフィン;イタコン酸、メタクリル酸、アクリル酸、マレイン酸等の不飽和カルボン酸、その塩、その部分又は完全エステル、そのニトリル、そのアミド、その無水物;ビニルトリメトキシシラン、ビニルトリエトキシシラン、ビニルトリ(β-メトキシエトキシ)シラン、γ-メタクリルオキシプロピルトリメトキシシラン等のビニルシラン系化合物;不飽和スルホン酸又はその塩;不飽和チオール類;ビニルピロリドン類等が挙げられる。 EVOH (A) may also contain a small amount of units of other monomers other than the ethylene unit and the vinyl alcohol unit as the copolymerization unit, as long as the object of the present invention is not impaired. Examples of such a monomer include α-olefins such as propylene, 1-butene, isobutene, 4-methyl-1-pentene, 1-hexene and 1-octene; itaconic acid, methacrylic acid, acrylic acid and maleine. Unsaturated carboxylic acids such as acids, salts thereof, partial or complete esters thereof, nitriles thereof, amides thereof, anhydrides thereof; vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri (β-methoxyethoxy) silane, γ-methacryloxy Vinyl silane compounds such as propyltrimethoxysilane; unsaturated sulfonic acid or a salt thereof; unsaturated thiols; vinylpyrrolidones and the like can be mentioned.
上記その他の単量体の中でも、EVOH(A)に共重合成分としてビニルシラン化合物を0.0002モル%以上0.2モル%以下含有させると、EVOH(A)を含む本発明の樹脂組成物を、基材となるべき重合体(例えば、ポリエステル)と共に、共押出成形又は共射出成形して多層構造体を得る際に、前記基材となるべき重合体との溶融粘性の整合性を改善でき、均質な成形物を製造できる。ビニルシラン系化合物としては、ビニルトリメトキシシラン、ビニルトリエトキシシラン等が好適に用いられる。 Among the above other monomers, when EVOH (A) contains 0.0002 mol% or more and 0.2 mol% or less of a vinylsilane compound as a copolymerization component, the resin composition of the present invention containing EVOH (A) can be obtained. When a multilayer structure is obtained by coextrusion molding or co-injection molding together with a polymer to be a base material (for example, polyester), the consistency of melt viscosity with the polymer to be a base material can be improved. , A homogeneous molded product can be produced. As the vinylsilane compound, vinyltrimethoxysilane, vinyltriethoxysilane and the like are preferably used.
また、EVOH(A)に柔軟性を付与するために、従来公知の方法でEVOHを変性することも好適である。この場合、後述する架橋剤(B)の構造や量、EVOHの製法を調整して、EVOH(A)の酸素透過速度を調整することもできる。 Further, in order to impart flexibility to EVOH (A), it is also preferable to modify EVOH by a conventionally known method. In this case, the oxygen permeation rate of EVOH (A) can be adjusted by adjusting the structure and amount of the cross-linking agent (B) described later and the method for producing EVOH.
<架橋剤(B)>
架橋剤(B)は、3以上の重合性基を有する融点40℃を超えるトリアジン誘導体である。架橋剤(B)の融点は40℃を超えているため、包装材料として通常使用され得る温度条件下では固体となり、ブリードアウトを防止することができる。また、架橋剤(B)が3以上の重合性基を有することから、電子線等の活性エネルギー線照射により、効率よく架橋物を製造することができる。このようにして得られる架橋物は、衛生的で耐熱水性及び耐熱溶剤性に優れ、かつ多層構造体としたときの層間接着性にも優れる。なお、本発明において、架橋剤(B)が明確な融点を示さない場合は、軟化温度を融点の代わりに用いることができ、軟化温度が40℃を超えるものも架橋剤(B)として用いることができる。また、40℃を超える領域で融解も軟化も示さないものについても、架橋剤(B)として用いることができる。<Crosslinking agent (B)>
The cross-linking agent (B) is a triazine derivative having 3 or more polymerizable groups and having a melting point of more than 40 ° C. Since the melting point of the cross-linking agent (B) exceeds 40 ° C., it becomes a solid under the temperature conditions that can be usually used as a packaging material, and bleed-out can be prevented. Further, since the cross-linking agent (B) has 3 or more polymerizable groups, a cross-linked product can be efficiently produced by irradiation with an active energy ray such as an electron beam. The crosslinked product thus obtained is hygienic, has excellent heat-resistant water-resistant and heat-resistant solvent properties, and is also excellent in interlayer adhesion when formed into a multilayer structure. In the present invention, when the cross-linking agent (B) does not show a clear melting point, the softening temperature can be used instead of the melting point, and those having a softening temperature exceeding 40 ° C. are also used as the cross-linking agent (B). Can be done. Further, those which do not show melting or softening in the region above 40 ° C. can also be used as the cross-linking agent (B).
上記した通り、架橋剤(B)の融点は、40℃を超えている。ブリードアウトをさらに抑制する目的から、架橋剤(B)の融点または軟化温度は、50℃以上であることが好ましく、60℃以上であることがより好ましく、70℃以上であることがさらに好ましい。また、EVOHとの混合を容易にする目的から、架橋剤(B)の融点または軟化温度は、200℃以下であることが好ましく、150℃以下であることがより好ましく、120℃以下であることがさらに好ましい。架橋剤(B)の沸点及び熱分解温度は、200℃以上であることが好ましく、240℃以上であることがより好ましく、260℃以上であることがさらに好ましい。沸点及び熱分解温度が高いことで、溶融混練及び溶融成形時の化合物の損失が抑制され、十分な架橋効果を得やすくなる。 As described above, the melting point of the cross-linking agent (B) exceeds 40 ° C. For the purpose of further suppressing bleed-out, the melting point or softening temperature of the cross-linking agent (B) is preferably 50 ° C. or higher, more preferably 60 ° C. or higher, and even more preferably 70 ° C. or higher. Further, for the purpose of facilitating mixing with EVOH, the melting point or softening temperature of the cross-linking agent (B) is preferably 200 ° C. or lower, more preferably 150 ° C. or lower, and 120 ° C. or lower. Is even more preferable. The boiling point and the thermal decomposition temperature of the cross-linking agent (B) are preferably 200 ° C. or higher, more preferably 240 ° C. or higher, and even more preferably 260 ° C. or higher. When the boiling point and the thermal decomposition temperature are high, the loss of the compound during melt kneading and melt molding is suppressed, and it becomes easy to obtain a sufficient crosslinking effect.
架橋剤(B)が有する重合性基としては、EVOH(A)との架橋反応を生じ得る限り限定されず、例えば、不飽和炭化水素基、カルボキシル基、エポキシ基、イソシアネート基が挙げられる。これらの中でも、活性エネルギー線による架橋を容易に行える点から不飽和炭化水素基が好ましい。 The polymerizable group of the cross-linking agent (B) is not limited as long as it can cause a cross-linking reaction with EVOH (A), and examples thereof include unsaturated hydrocarbon groups, carboxyl groups, epoxy groups, and isocyanate groups. Among these, unsaturated hydrocarbon groups are preferable because they can be easily crosslinked by active energy rays.
上記不飽和炭化水素基としては、エチレン性不飽和結合及びアセチレン性不飽和結合のうちの少なくとも1種を有する基である限り限定されず、例えばアルケニル基、アルカジエニル基、アルカトリエニル基、アリールアルケニル基、アルキニル基、アルカジイニル基、アルカトリイニル基が挙げられる。不飽和炭化水素基の炭素数としては、通常2~12であり、2~10が好ましく、2~8がより好ましく、3~8がさらに好ましい。 The unsaturated hydrocarbon group is not limited as long as it is a group having at least one of an ethylenically unsaturated bond and an acetylene unsaturated bond. Examples include a group, an alkynyl group, an alkadynyl group, and an alkatolynyl group. The unsaturated hydrocarbon group usually has 2 to 12 carbon atoms, preferably 2 to 10, more preferably 2 to 8, and even more preferably 3 to 8.
上記アルケニル基としては、例えば、ビニル基、プロペニル基(アリル基)、ブテニル基、ペンテニル基、ヘキセニル基、ヘプテニル基、オクテニル基、ノネニル基、デセニル基等の直鎖状アルケニル基、2-プロペニル基、1-メチルプロペニル基、2-メチルプロペニル基等の分岐鎖状アルケニル基、シクロブテニル基、シクロペンテニル基、シクロヘキセニル基等の環状アルケニル基等が挙げられる。 Examples of the alkenyl group include a linear alkenyl group such as a vinyl group, a propenyl group (allyl group), a butenyl group, a pentenyl group, a hexenyl group, a heptenyl group, an octenyl group, a nonenyl group and a decenyl group, and a 2-propenyl group. , 1-Methylpropenyl group, 2-methylpropenyl group and other branched chain alkenyl groups, cyclobutenyl group, cyclopentenyl group, cyclohexenyl group and other cyclic alkenyl groups and the like.
上記アルカジエニル基としては、例えば、ペンタジエニル基、ヘキサジエニル基、ヘプタジエニル基、オクタジエニル基等の直鎖状アルカジエニル基、1-メチルペンタジエニル基、2-メチルペンタジエニル基等の分岐鎖状アルカジエニル基等が挙げられる。 Examples of the alkazienyl group include a linear alkazienyl group such as a pentadienyl group, a hexadienyl group, a heptadienyl group and an octadienyl group, a branched chain alkazienyl group such as a 1-methylpentadienyl group and a 2-methylpentadienyl group, and the like. Can be mentioned.
上記アルカトリエニル基としては、例えば、ヘキサトリエニル基、ヘプタトリエニル基、オクタトリエニル基等の直鎖状アルカトリイニル基、1-メチルヘキサトリエニル基、2-メチルヘキサトリエニル基等の分岐鎖状アルカトリエニル基等が挙げられる。 Examples of the alkatolynyl group include a linear alkatolynyl group such as a hexatrienyl group, a heptatrienyl group and an octatrienyl group, a branch of a 1-methylhexatrienyl group and a 2-methylhexatorienyl group. Examples thereof include a chain-like alcatrienyl group.
上記アリールアルケニル基としては、例えば、フェニルビニル基、フェニルプロペニル基等が挙げられる。 Examples of the arylalkenyl group include a phenylvinyl group and a phenylpropenyl group.
上記アルキニル基としては、例えば、プロピニル基、ブチニル基、ペンチニル基、ヘキシニル基、ヘプチニル基、オクチニル基等の直鎖状アルキニル基、1-メチルプロピニル基、2-メチルブチニル基等の分岐鎖状アルキニル基等が挙げられる。 Examples of the alkynyl group include a linear alkynyl group such as a propynyl group, a butynyl group, a pentynyl group, a hexynyl group, a heptynyl group and an octynyl group, and a branched chain alkynyl group such as a 1-methylpropynyl group and a 2-methylbutynyl group. And so on.
上記アルカジイニル基としては、例えば、ペンタジイニル基、ヘキサジイニル基、ヘプタジイニル基、オクタジイニル基等の直鎖状アルカジイニル基、1-メチルペンタジイニル基、2-メチルヘキサジイニル基等の分岐鎖状アルカジイニル基が挙げられる。 Examples of the alkaziynyl group include a linear alkaziinyl group such as a pentadiynyl group, a hexadiynyl group, a heptadiynyl group and an octadiynyl group, and a branched chain alkaziyl group such as a 1-methylpentadiynyl group and a 2-methylhexadiynyl group. Nyl group is mentioned.
上記アルカトリイニル基としては、例えば、ヘキサトリイニル基、ヘプタトリイニル基、オクタトリイニル基等の直鎖状アルカトリイニル基、1-メチルヘプタトリイニル基、2-メチルオクタトリイニル基等の分岐鎖状アルカトリイニル基等が挙げられる。 Examples of the alkatolynyl group include a linear alkatolynyl group such as a hexatriinyl group, a heptatriinyl group and an octatriinyl group, a branch of a 1-methylheptatriinyl group and a 2-methyloctatriinyl group. Examples thereof include a chain alkatriinyl group.
上述の重合性基の中でも、ビニル基又は炭素数3~8のアルケニル基若しくはアルカジエニル基が好ましく、ビニル基又は炭素数3~6のアルケニル基がより好ましく、ビニル基又は炭素数3~5のアルケニル基がさらに好ましい。架橋剤(B)の重合性基をこれらの特定の基とすることにより、EVOH(A)との架橋反応をスムーズかつ十分に進行させることができる。また、十分な架橋効果を得るため、架橋剤(B)は3以上の重合性基を有することが必要である。重合性基が2以下の場合は、耐熱水性または耐熱溶剤性が不足するか、十分な耐熱水性または耐熱溶剤性を得るために電子線照射量を増やす必要があるという問題が生じ、包装材料や産業用パイプとしての外観や機械物性に悪影響を及ぼすことがある。 Among the above-mentioned polymerizable groups, a vinyl group or an alkenyl group having 3 to 8 carbon atoms or an alkazienyl group is preferable, a vinyl group or an alkenyl group having 3 to 6 carbon atoms is more preferable, and a vinyl group or an alkenyl group having 3 to 5 carbon atoms is more preferable. Groups are even more preferred. By using the polymerizable group of the cross-linking agent (B) as these specific groups, the cross-linking reaction with EVOH (A) can proceed smoothly and sufficiently. Further, in order to obtain a sufficient cross-linking effect, the cross-linking agent (B) needs to have 3 or more polymerizable groups. When the number of polymerizable groups is 2 or less, there is a problem that the heat-resistant water or heat-resistant solvent is insufficient, or the electron beam irradiation amount needs to be increased in order to obtain sufficient heat-resistant water or heat-resistant solvent. It may adversely affect the appearance and mechanical properties of industrial pipes.
上記不飽和炭化水素基の水素原子の一部又は全部は、ヘテロ原子を含む置換基で置換されていてもよい。この場合のヘテロ原子としては、炭素原子及び水素原子以外の原子であればよく、例えば、ハロゲン原子、酸素原子、硫黄原子、窒素原子が挙げられる。ハロゲン原子としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子等が挙げられる。上記ヘテロ原子を含む置換基の具体例としては、例えば、アルコキシ基、ハロゲン原子、水酸基、酸素原子(=O)、シアノ基等が挙げられる。上記アルコキシ基としては、炭素数1~5のアルコキシ基が好ましく、メトキシ基、エトキシ基、n-プロポキシ基、iso-プロポキシ基、n-ブトキシ基、tert-ブトキシ基が好ましく、メトキシ基、エトキシ基がより好ましい。 A part or all of the hydrogen atom of the unsaturated hydrocarbon group may be substituted with a substituent containing a heteroatom. The hetero atom in this case may be an atom other than a carbon atom and a hydrogen atom, and examples thereof include a halogen atom, an oxygen atom, a sulfur atom, and a nitrogen atom. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom and the like. Specific examples of the substituent containing the hetero atom include an alkoxy group, a halogen atom, a hydroxyl group, an oxygen atom (= O), a cyano group and the like. As the alkoxy group, an alkoxy group having 1 to 5 carbon atoms is preferable, a methoxy group, an ethoxy group, an n-propoxy group, an iso-propoxy group, an n-butoxy group and a tert-butoxy group are preferable, and a methoxy group and an ethoxy group are preferable. Is more preferable.
架橋剤(B)はトリアジン誘導体である必要がある。架橋剤(B)が熱的に安定なトリアジン構造を有することにより、架橋剤(B)の耐熱性が大幅に向上し、溶融混練や溶融成形時の架橋剤(B)の分解を防止することができ、得られる架橋物での架橋レベルを十分なものとすることができる。トリアジン基本骨格としては、1,2,3-トリアジン、1,2,4-トリアジン、1,3,5-トリアジンの3種が挙げられるが、熱安定性や架橋部位の位置対称性の面からは、1,3,5-トリアジンを基本骨格とすることがより好ましい。 The cross-linking agent (B) needs to be a triazine derivative. Since the cross-linking agent (B) has a thermally stable triazine structure, the heat resistance of the cross-linking agent (B) is significantly improved, and decomposition of the cross-linking agent (B) during melt kneading and melt molding is prevented. And the cross-linking level in the obtained cross-linked product can be made sufficient. The triazine basic skeleton includes three types, 1,2,3-triazine, 1,2,4-triazine, and 1,3,5-triazine, but from the viewpoint of thermal stability and positional symmetry of the cross-linking site. Is more preferably 1,3,5-triazine as the basic skeleton.
架橋剤(B)は重合性基と同数以上のカルボニル基を有することが好ましい。カルボニル基の種類は特に限定されず、アルデヒド、ケトン、カルボン酸、エステル、アミド、エノンなどの部分構造が挙げられる。当該カルボニル基は、EVOH(A)と架橋剤(B)との相溶性を向上させる効果があり、両者の架橋反応をスムーズかつ十分に進行させることができ、ブリードアウトを抑制することができる。架橋剤(B)におけるカルボニル基の位置は特に限定されないが、架橋剤(B)の熱安定性を向上させ、同時にEVOH(A)との相溶性を効果的に向上させる点から、トリアジン骨格に含まれることが好ましく、例えば、1,3,5-トリアジン-2,4,6(1H,3H,5H)-トリオン構造が挙げられる。 The cross-linking agent (B) preferably has the same number of carbonyl groups as the polymerizable group. The type of the carbonyl group is not particularly limited, and examples thereof include partial structures such as aldehydes, ketones, carboxylic acids, esters, amides, and enones. The carbonyl group has the effect of improving the compatibility between EVOH (A) and the cross-linking agent (B), the cross-linking reaction between the two can proceed smoothly and sufficiently, and bleed-out can be suppressed. The position of the carbonyl group in the cross-linking agent (B) is not particularly limited, but the triazine skeleton can be used from the viewpoint of improving the thermal stability of the cross-linking agent (B) and at the same time effectively improving the compatibility with EVOH (A). It is preferably included, for example, 1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trion structure.
架橋剤(B)の具体的な構造としては、例えばトリアリルシアヌレートの重合体、トリアリルイソシアヌレートの重合体、トリメタリルイソシアヌレート及びトリメタリルイソシアヌレートの重合体などが挙げられる。これらの架橋剤は、熱的に安定で、活性エネルギー線等による架橋反応効率も良好である。また、入手も容易であり、経済的にも優れている。これらの中でも、架橋反応効率、耐熱溶剤性、得られる架橋物の外観が特に優れる点で、トリメタリルイソシアヌレートが好ましい。 Specific structures of the cross-linking agent (B) include, for example, a polymer of triallyl cyanurate, a polymer of triallyl isocyanurate, a polymer of trimetalyl isocyanurate and a polymer of trimetalyl isocyanurate. These cross-linking agents are thermally stable and have good cross-linking reaction efficiency with active energy rays and the like. It is also easy to obtain and economically excellent. Among these, trimetalyl isocyanurate is preferable because it is particularly excellent in cross-linking reaction efficiency, heat-resistant solvent resistance, and appearance of the obtained cross-linked product.
トリアリルシアヌレートやトリアリルイソシアヌレートは融点が40℃以下であり、40℃においては液体であるが、それらをオリゴマー化またはポリマー化することで、40℃において固体とすることができる。これらのオリゴマー化やポリマー化を達成する方法としては、たとえば、酸素の存在下に適当な温度(例えば50~120℃)で適当期間(例えば1時間から24時間程度)加熱処理する方法、有機過酸化物などのラジカル重合開始剤や紫外線を利用する方法などが挙げられる。このこれらのオリゴマーやポリマーとしては、分子量が約500~100000、好ましくは約2000~50000のものが用いられ、このような分子量範囲の市販品をそのまま用いることができる。なお、架橋剤(B)が40℃を超える領域において実質的に固体である限り、融点が40℃以下のトリアリルシアヌレートやトリアリルイソシアヌレートなどの単量体が混在することは、本発明の一態様であるが、40℃において液体で存在する単量体が少ないことで、白化ムラをより低減できる。 Triallyl cyanurates and triallyl isocyanurates have a melting point of 40 ° C. or lower and are liquid at 40 ° C., but can be made solid at 40 ° C. by oligomerizing or polymerizing them. Examples of the method for achieving these oligomerizations and polymerizations include a method of heat-treating in the presence of oxygen at an appropriate temperature (for example, 50 to 120 ° C.) for an appropriate period (for example, about 1 hour to 24 hours), and an organic radical. Examples thereof include a radical polymerization initiator such as an oxide and a method using ultraviolet rays. As these oligomers and polymers, those having a molecular weight of about 500 to 100,000, preferably about 2,000 to 50,000, are used, and commercially available products having such a molecular weight range can be used as they are. As long as the cross-linking agent (B) is substantially solid in the region above 40 ° C., it is the present invention that monomers such as triallyl cyanurate and triallyl isocyanurate having a melting point of 40 ° C. or lower are mixed. Although it is one aspect, uneven whitening can be further reduced by reducing the amount of monomers present as a liquid at 40 ° C.
本発明の樹脂組成物における架橋剤(B)の使用量は、架橋物において要求される架橋度に応じて決めればよいが、その下限はEVOH(A)100質量部に対して0.4質量部であることが必要であり、0.6質量部が好ましく、0.8質量部がより好ましい。その上限はEVOH(A)100質量部に対して10質量部であることが必要であり、8質量部が好ましく、6質量部がより好ましい。架橋剤(B)の使用量を上記範囲とすることで、EVOH(A)の架橋を十分に進行させることができ、耐熱水性、耐熱溶剤性及び層間接着性に優れた架橋物を得ることができる。加えて、前記架橋物をレトルト用のフィルムなどにした場合には、レトルト前後でのガスバリア性に優れたものとなる。架橋剤(B)の使用量が上記範囲より多い場合は、層間接着性が悪化したり、ゲル、ブツや白化ムラなどの外観不良が発生したりすることがある。 The amount of the cross-linking agent (B) used in the resin composition of the present invention may be determined according to the degree of cross-linking required for the cross-linked product, but the lower limit thereof is 0.4 mass by mass with respect to 100 parts by mass of EVOH (A). It is necessary to have parts, 0.6 parts by mass is preferable, and 0.8 parts by mass is more preferable. The upper limit needs to be 10 parts by mass with respect to 100 parts by mass of EVOH (A), preferably 8 parts by mass, and more preferably 6 parts by mass. By setting the amount of the cross-linking agent (B) to be within the above range, the cross-linking of EVOH (A) can be sufficiently promoted, and a cross-linked product having excellent heat-resistant water-resistant, heat-resistant solvent resistance and interlayer adhesion can be obtained. can. In addition, when the crosslinked product is made into a film for retort or the like, the gas barrier property before and after the retort is excellent. If the amount of the cross-linking agent (B) used is larger than the above range, the interlayer adhesiveness may be deteriorated, or appearance defects such as gels, bumps and uneven whitening may occur.
<ヒンダードフェノール系化合物(C)>
本発明の樹脂組成物は必要に応じてヒンダードフェノール系化合物(C)を含有してもよい。ヒンダードフェノール系化合物(C)は、エステル結合又はアミド結合を有する。エステル結合又はアミド結合を有するヒンダードフェノール系化合物(C)を含有することで、EVOH(A)に対する粘度の安定化効果、溶融混練や溶融成形時のゲル状ブツの発生防止効果が優れたものになる。ここで、ヒンダードフェノール系化合物(C)とは、少なくとも1つのフェノール基を含有する有機化合物であって、その芳香族部位が、置換基としてフェノール性ヒドロキシル基を有する炭素に直接隣接する少なくとも1つの位置、好ましくは両方の位置で置換されている、有機化合物を意味する。ヒドロキシル基に隣接する置換基は、炭素原子1~10個を有するアルキル基から適切に選択されるアルキルラジカルであり、好ましくは第3級ブチル基である。<Hindered phenolic compound (C)>
The resin composition of the present invention may contain a hindered phenolic compound (C), if necessary. The hindered phenolic compound (C) has an ester bond or an amide bond. By containing the hindered phenolic compound (C) having an ester bond or an amide bond, the effect of stabilizing the viscosity with respect to EVOH (A) and the effect of preventing the generation of gel-like lumps during melt kneading and melt molding are excellent. become. Here, the hindered phenolic compound (C) is an organic compound containing at least one phenol group, and the aromatic moiety thereof is at least one directly adjacent to a carbon having a phenolic hydroxyl group as a substituent. Means an organic compound that is substituted at one position, preferably both positions. The substituent adjacent to the hydroxyl group is an alkyl radical appropriately selected from an alkyl group having 1 to 10 carbon atoms, preferably a tertiary butyl group.
ヒンダードフェノール系化合物(C)の融点は40℃以上であることが好ましい。ブリードアウトを抑制する目的から、ヒンダードフェノール系化合物(C)の融点又は軟化温度は、50℃以上が好ましく、60℃以上がより好ましく、70℃以上がさらに好ましい。同様の理由から、ヒンダードフェノールの分子量は、200以上が好ましく、400以上がより好ましく、600以上がさらに好ましい。また、EVOH(A)との混合を容易にする目的から、ヒンダードフェノール系化合物(C)の融点又は軟化温度は、200℃以下が好ましく、190℃以下がより好ましく、180℃以下がさらに好ましい。 The melting point of the hindered phenolic compound (C) is preferably 40 ° C. or higher. For the purpose of suppressing bleed-out, the melting point or softening temperature of the hindered phenolic compound (C) is preferably 50 ° C. or higher, more preferably 60 ° C. or higher, still more preferably 70 ° C. or higher. For the same reason, the molecular weight of hindered phenol is preferably 200 or more, more preferably 400 or more, still more preferably 600 or more. Further, for the purpose of facilitating mixing with EVOH (A), the melting point or softening temperature of the hindered phenol compound (C) is preferably 200 ° C. or lower, more preferably 190 ° C. or lower, still more preferably 180 ° C. or lower. ..
ヒンダードフェノール系化合物(C)はアミド結合を有することが好ましい。ヒンダードフェノール系化合物(C)がアミド結合を有することで、EVOH(A)に対する粘度の安定化効果、溶融混練や溶融成形時のゲル状ブツの発生防止効果が特に優れたものになる。 The hindered phenolic compound (C) preferably has an amide bond. Since the hindered phenolic compound (C) has an amide bond, the effect of stabilizing the viscosity with respect to EVOH (A) and the effect of preventing the generation of gel-like lumps during melt kneading and melt molding are particularly excellent.
ヒンダードフェノール系化合物(C)の具体的な構造としては、例えば、
・BASF社からからイルガノックス1010として市販されているペンタエリトリトールテトラキス[3-(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロピオナート]
・イルガノックス1076として市販されている3-(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロピオン酸ステアリル
・イルガノックス1035として市販されている2,2'-チオジエチルビス[3-(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロピオナート]
・イルガノックス1135として市販されている3-(3,5-ジ-
1514280176025_0
-4-ヒドロキシフェニル)
1514280176025_1
オクタデシル
・イルガノックス245として市販されているビス(3-tert-ブチル-4-ヒドロキシ-5-メチルベンゼンプロパン酸)エチレンビス(オキシエチレン)
・イルガノックス259として市販されている1,6-ヘキサンジオールビス[3-(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロピオナート]
・イルガノックス1098として市販されているN,N'-ヘキサメチレンビス[3-(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロパンアミド]
が挙げられ、これらの中でも、アミド結合を有することから、イルガノックス1098として市販されているN,N'-ヘキサメチレンビス[3-(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロパンアミド]が好ましい。Specific structures of the hindered phenolic compound (C) include, for example,
-Pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] marketed as Irganox 1010 from BASF.
Stearyl 3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate marketed as Irganox 1076 ・ 2,2'-thiodiethylbis [3- (3,5-di-thiodiethylbis) marketed as Irganox 1035 (3,5-di-tert-butyl-4-hydroxyphenyl) propionate]
-Commercially available as Irganox 1135 3- (3,5-di-)
1514280176025_0
-4-Hydroxyphenyl)
1514280176025_1
Ethylene bis (oxyethylene) commercially available as octadecyl ilganox 245 bis (3-tert-butyl-4-hydroxy-5-methylbenzenepropanoic acid)
1,6-Hexanediol bis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] marketed as Irganox 259]
N, N'-hexamethylenebis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propanamide] commercially available as Irganox 1098]
Among these, N, N'-hexamethylenebis [3- (3,5-di-tert-butyl-4-hydroxyphenyl), which is commercially available as Irganox 1098 because it has an amide bond. Propanamide] is preferred.
本発明の樹脂組成物におけるヒンダードフェノール系化合物(C)の使用量としては、溶融混練や溶融成形時の条件に応じて決めればよく、その下限は、EVOH(A)100質量部に対して0.05質量部が好ましく、0.2質量部がより好ましく、0.4質量部がさらに好ましい。その上限は、EVOH(A)100質量部に対して10質量部が好ましく、5質量部がより好ましく、3質量部がさらに好ましい。ヒンダードフェノール系化合物(C)の使用量を上記範囲とすることで、溶融混練や溶融成形時に架橋剤(B)に起因する過度な架橋を防止することができ、長時間にわたって安定した粘度を維持することができる。さらに、溶融混練や溶融成形時のゲル状ブツの発生を防止できるため、外観に優れた架橋物を製造することができる。 The amount of the hindered phenolic compound (C) used in the resin composition of the present invention may be determined according to the conditions at the time of melt kneading and melt molding, and the lower limit thereof is with respect to 100 parts by mass of EVOH (A). 0.05 parts by mass is preferable, 0.2 parts by mass is more preferable, and 0.4 parts by mass is further preferable. The upper limit is preferably 10 parts by mass, more preferably 5 parts by mass, and even more preferably 3 parts by mass with respect to 100 parts by mass of EVOH (A). By setting the amount of the hindered phenol compound (C) to be in the above range, it is possible to prevent excessive cross-linking due to the cross-linking agent (B) during melt kneading and melt molding, and to maintain a stable viscosity for a long period of time. Can be maintained. Further, since it is possible to prevent the generation of gel-like lumps during melt kneading and melt molding, it is possible to produce a crosslinked product having an excellent appearance.
<その他の成分>
本発明の樹脂組成物には、本発明の効果を損なわない範囲でその他の成分を含有していてもよい。その他の成分としては、例えばホウ素化合物、アルカリ金属塩、リン酸化合物、酸化され得る物質、その他の重合体、酸化促進剤、その他の添加剤等が挙げられる。<Other ingredients>
The resin composition of the present invention may contain other components as long as the effects of the present invention are not impaired. Examples of other components include boron compounds, alkali metal salts, phosphoric acid compounds, substances that can be oxidized, other polymers, oxidation accelerators, and other additives.
<ホウ素化合物>
本発明の樹脂組成物にホウ素化合物が添加されている場合、EVOHの溶融粘性が改善され、均質な共押出成形体又は共射出成形体が得られる点で有効である。上記ホウ素化合物としては、例えば、ホウ酸類、ホウ酸エステル、ホウ酸塩、水素化ホウ素類等が挙げられる。具体的には、ホウ酸類としては、オルトホウ酸(以下、単に「ホウ酸」ともいう)、メタホウ酸、四ホウ酸等が挙げられ、ホウ酸エステルとしてはホウ酸トリエチル、ホウ酸トリメチル等が挙げられ、ホウ酸塩としては上記の各種ホウ酸類のアルカリ金属塩、アルカリ土類金属塩、ホウ砂等が挙げられる。これらの化合物のうちでもオルトホウ酸が好ましい。<Boron compound>
When a boron compound is added to the resin composition of the present invention, it is effective in that the melt viscosity of EVOH is improved and a homogeneous coextruded or co-injected molded product can be obtained. Examples of the boron compound include boric acids, borate esters, borates, and boron hydrides. Specifically, examples of boric acids include orthoboric acid (hereinafter, also simply referred to as "boric acid"), metaboric acid, tetraboric acid and the like, and examples of boric acid esters include triethyl borate, trimethyl borate and the like. Examples of the borate include alkali metal salts of the above-mentioned various boric acids, alkaline earth metal salts, boric acid and the like. Among these compounds, orthoboric acid is preferable.
ホウ素化合物が添加される場合には、当該組成物中での含有量はホウ素元素換算で20~2000ppmが好ましく、50~1500ppmがより好ましい。この範囲にあることで加熱溶融時のトルク変動が抑制されたEVOHを得ることができる。20ppm未満ではそのような効果が小さく、一方、2000ppmを超えるとゲル化しやすく、成形性不良となる場合がある。 When a boron compound is added, the content in the composition is preferably 20 to 2000 ppm, more preferably 50 to 1500 ppm in terms of elemental boron. Within this range, it is possible to obtain EVOH in which torque fluctuation during heating and melting is suppressed. If it is less than 20 ppm, such an effect is small, while if it exceeds 2000 ppm, gelation is likely to occur and moldability may be poor.
<アルカリ金属塩>
本発明の樹脂組成物には、アルカリ金属塩をアルカリ金属元素換算で5~5000ppm含むことが好ましく、20~1000ppmがより好ましく、30~500ppmがさらに好ましい。上記範囲でアルカリ金属塩を含むことにより、層間接着性や相溶性を改善することができる。アルカリ金属としては、リチウム、ナトリウム、カリウム等が挙げられ、アルカリ金属塩としては、アルカリ金属の脂肪族カルボン酸塩、芳香族カルボン酸塩、リン酸塩、金属錯体等が挙げられる。例えば、酢酸ナトリウム、酢酸カリウム、リン酸ナトリウム、リン酸リチウム、ステアリン酸ナトリウム、ステアリン酸カリウム、エチレンジアミン四酢酸のナトリウム塩等が挙げられ、これらの中でも酢酸ナトリウム、酢酸カリウム、リン酸ナトリウムが好ましい。<Alkali metal salt>
The resin composition of the present invention preferably contains an alkali metal salt in an alkali metal element equivalent of 5 to 5000 ppm, more preferably 20 to 1000 ppm, still more preferably 30 to 500 ppm. By containing the alkali metal salt in the above range, the interlayer adhesiveness and compatibility can be improved. Examples of the alkali metal include lithium, sodium, potassium and the like, and examples of the alkali metal salt include an aliphatic carboxylate of an alkali metal, an aromatic carboxylate, a phosphate, a metal complex and the like. For example, sodium acetate, potassium acetate, sodium phosphate, lithium phosphate, sodium stearate, potassium stearate, sodium salts of ethylenediamine tetraacetic acid and the like can be mentioned, and among these, sodium acetate, potassium acetate and sodium phosphate are preferable.
<リン酸化合物>
本発明の樹脂組成物には、リン酸化合物をリン酸根換算で1~500ppm含むことが好ましく、5~300ppmがより好ましく、10~200ppmがさらに好ましい。上記範囲でリン酸化合物を配合することにより、EVOHの熱安定性を改善することができる。特に、長時間にわたる溶融成形を行う際のゲル状ブツの発生や着色を抑制することができる。<Phosphoric acid compound>
The resin composition of the present invention preferably contains a phosphoric acid compound at 1 to 500 ppm in terms of phosphoric acid root, more preferably 5 to 300 ppm, still more preferably 10 to 200 ppm. By blending the phosphoric acid compound in the above range, the thermal stability of EVOH can be improved. In particular, it is possible to suppress the generation and coloring of gel-like lumps during long-term melt molding.
本発明の樹脂組成物に添加するリン酸化合物の種類は特に限定されず、例えば、リン酸、亜リン酸等の各種の酸やその塩等を用いることができる。リン酸塩は第1リン酸塩、第2リン酸塩、第3リン酸塩のいずれの形であってもよい。リン酸塩のカチオン種も特に限定されないが、カチオン種がアルカリ金属、アルカリ土類金属であることが好ましい。中でも、リン酸二水素ナトリウム、リン酸二水素カリウム、リン酸水素二ナトリウム、リン酸水素二カリウムの形でリン化合物を添加することが好ましい。 The type of the phosphoric acid compound added to the resin composition of the present invention is not particularly limited, and for example, various acids such as phosphoric acid and phosphorous acid and salts thereof can be used. The phosphate may be in the form of a first phosphate, a second phosphate, or a third phosphate. The cation species of the phosphate is not particularly limited, but it is preferable that the cation species is an alkali metal or an alkaline earth metal. Above all, it is preferable to add the phosphorus compound in the form of sodium dihydrogen phosphate, potassium dihydrogen phosphate, disodium hydrogen phosphate, or dipotassium hydrogen phosphate.
<その他の添加剤>
本発明の樹脂組成物には、本発明の効果が阻害されない範囲内で各種の添加剤を含有させてもよい。このような添加剤の例としては、可塑剤、熱安定剤(溶融安定剤)、光開始剤、脱臭剤、紫外線吸収剤、帯電防止剤、滑剤、着色剤、フィラー、乾燥剤、充填剤、顔料、染料、加工助剤、難燃剤、防曇剤、化合物(C)以外の酸化防止剤等が挙げられる。<Other additives>
The resin composition of the present invention may contain various additives as long as the effects of the present invention are not impaired. Examples of such additives include plasticizers, heat stabilizers (melt stabilizers), photoinitiators, deodorants, UV absorbers, antistatic agents, lubricants, colorants, fillers, desiccants, fillers, etc. Examples thereof include pigments, dyes, processing aids, flame retardants, antifogging agents, antioxidants other than compound (C), and the like.
<樹脂組成物の製造方法>
本発明の樹脂組成物の製造方法は、エチレンとビニルエステルとを共重合してエチレン-ビニルエステル共重合体を得る共重合工程、前記エチレン-ビニルエステル共重合体をけん化してEVOH(A)を得るけん化工程、及びEVOH(A)と架橋剤(B)とを混合して混合物を得る混合工程を含む。<Manufacturing method of resin composition>
The method for producing a resin composition of the present invention is a copolymerization step of copolymerizing ethylene and vinyl ester to obtain an ethylene-vinyl ester copolymer, and saponifying the ethylene-vinyl ester copolymer to make EVOH (A). Includes a saponification step of obtaining a mixture and a mixing step of mixing EVOH (A) and a cross-linking agent (B) to obtain a mixture.
共重合工程は、エチレンとビニルエステルとの共重合の工程に加え、必要に応じて重合禁止剤を添加し、それに続いて未反応エチレン、未反応ビニルエステルを除去してエチレン-ビニルエステル共重合体溶液を得る工程を含む。エチレンとビニルエステルとの共重合方法としては、例えば溶液重合、懸濁重合、乳化重合、バルク重合などの公知の方法が挙げられる。 In the copolymerization step, in addition to the step of copolymerizing ethylene and vinyl ester, a polymerization inhibitor is added as necessary, and then unreacted ethylene and unreacted vinyl ester are removed to remove ethylene-vinyl ester copolymer weight. Includes the step of obtaining a coalesced solution. Examples of the copolymerization method of ethylene and vinyl ester include known methods such as solution polymerization, suspension polymerization, emulsion polymerization and bulk polymerization.
重合に用いられる代表的なビニルエステルとして酢酸ビニルが挙げられるが、その他の脂肪族ビニルエステル、例えばプロピオン酸ビニルやピバリン酸ビニルも使用できる。他にも、共重合し得る単量体を少量共重合させることができる。 Vinyl acetate is mentioned as a typical vinyl ester used for polymerization, but other aliphatic vinyl esters such as vinyl propionate and vinyl pivalate can also be used. In addition, a small amount of copolymerizable monomers can be copolymerized.
重合温度としては、20~90℃が好ましく、40~70℃がより好ましい。重合時間としては、2~15時間が好ましく、3~11時間がより好ましい。重合率は、仕込みのビニルエステルに対して10~90%が好ましく、30~80%がより好ましい。重合後の溶液中の樹脂分は、5~85質量%が好ましく、20~70質量%がより好ましい。 The polymerization temperature is preferably 20 to 90 ° C, more preferably 40 to 70 ° C. The polymerization time is preferably 2 to 15 hours, more preferably 3 to 11 hours. The polymerization rate is preferably 10 to 90%, more preferably 30 to 80% with respect to the charged vinyl ester. The resin content in the solution after the polymerization is preferably 5 to 85% by mass, more preferably 20 to 70% by mass.
けん化工程では、エチレン-ビニルエステル共重合体溶液にアルカリ触媒を添加し、溶液中の共重合体をけん化する。けん化方法は、連続式、回分式のいずれも可能である。このアルカリ触媒としては、例えば水酸化ナトリウム、水酸化カリウム、アルカリ金属アルコラートが挙げられる。 In the saponification step, an alkaline catalyst is added to the ethylene-vinyl ester copolymer solution to saponify the copolymer in the solution. The saponification method can be either continuous or batch. Examples of the alkali catalyst include sodium hydroxide, potassium hydroxide, and alkali metal alcoholate.
混合工程では、EVOH(A)及び架橋剤(B)、必要に応じてヒンダードフェノール系化合物(C)を添加してから溶融混練することが好ましい。この際、ニーダールーダー、押出機、ミキシングロール、バンバリーミキサーなどの既知の混合装置または混練装置を使用して行うことができる。溶融混練時の温度は、通常、110~300℃である。ヒンダードフェノール系化合物(C)は、予めEVOH(A)や架橋剤(B)に含有されていてもよい。 In the mixing step, it is preferable to add EVOH (A), a cross-linking agent (B), and if necessary, a hindered phenolic compound (C), and then melt-knead. At this time, it can be carried out by using a known mixing device or kneading device such as a kneader ruder, an extruder, a mixing roll, and a Banbury mixer. The temperature at the time of melt-kneading is usually 110 to 300 ° C. The hindered phenolic compound (C) may be contained in EVOH (A) or a cross-linking agent (B) in advance.
<架橋物の製造方法>
前記混合物は、外部からのエネルギー付与により、EVOH(A)が架橋剤(B)により架橋される(架橋工程)。この架橋は、電子線、X線、γ線、紫外線及び可視光線からなる群より選ばれる少なくとも1種の活性エネルギー線を照射するか、加熱を行うことにより行うことが好ましい。これらの中でも、活性エネルギー線を照射する場合には、活性エネルギー線の照射を行うだけで架橋することができるので、特殊な押出機等が不要となり、簡便にかつ低コストで架橋物を製造することができる。活性エネルギー線の中でも、架橋スピード及び架橋効率の点から、上記電子線により架橋を行うことが好ましい。これにより、低ブリードアウト性、良好な耐熱水性、耐熱溶剤性及び層間接着性を兼ね備える架橋物を効率的に製造することができる。<Manufacturing method of crosslinked product>
In the mixture, EVOH (A) is cross-linked by the cross-linking agent (B) by applying energy from the outside (cross-linking step). This cross-linking is preferably carried out by irradiating or heating at least one active energy ray selected from the group consisting of electron beams, X-rays, γ-rays, ultraviolet rays and visible rays. Among these, when irradiating with active energy rays, cross-linking can be performed only by irradiating with active energy rays, so that a special extruder or the like is not required, and a cross-linked product can be manufactured easily and at low cost. be able to. Among the active energy rays, it is preferable to carry out cross-linking with the above-mentioned electron beam from the viewpoint of cross-linking speed and cross-linking efficiency. This makes it possible to efficiently produce a crosslinked product having low bleed-out property, good heat resistance and water resistance, heat resistance solvent property, and interlayer adhesion.
電子線、X線又はγ線を用いる場合、吸収線量が1kGy以上が好ましく、1kGy~1MGyがより好ましく、5kGy~500kGyがさらに好ましく、10kGy~200kGyが特に好ましい。吸収線量が1kGyより小さい場合は架橋度が向上せず、耐熱水性や耐熱溶剤性等の目的の性能が得られないことがある。また、吸収線量が1MGyより大きい場合はEVOH等の分解が生じるおそれがあり、架橋物をフィルムにした際の機械強度の低下や、着色等の問題が生じることがある。 When electron beam, X-ray or γ-ray is used, the absorbed dose is preferably 1 kGy or more, more preferably 1 kGy to 1 MGy, further preferably 5 kGy to 500 kGy, and particularly preferably 10 kGy to 200 kGy. If the absorbed dose is less than 1 kHz, the degree of cross-linking does not improve, and the desired performance such as heat resistant water and heat resistant solvent may not be obtained. Further, when the absorbed dose is larger than 1 MGy, decomposition of EVOH or the like may occur, and problems such as deterioration of mechanical strength and coloring when the crosslinked product is made into a film may occur.
光照射を用いる場合、照射時間は架橋物の厚さ、光源の種類、その他の諸条件に影響されるが、高圧水銀灯、低圧水銀灯、カーボンアーク灯、キセノン灯、メタルハライドランプ、LED等を用い、長くて数分、通常1分以内、場合によっては1秒以下でもよい。 When light irradiation is used, the irradiation time is affected by the thickness of the crosslinked product, the type of light source, and other conditions, but high-pressure mercury lamps, low-pressure mercury lamps, carbon arc lamps, xenon lamps, metal halide lamps, LEDs, etc. are used. It may be as long as several minutes, usually within one minute, and in some cases less than one second.
なお、本発明の樹脂組成物の架橋工程は、目的とする成形物の性状に合わせて決めればよく、成形前であっても成形後であってもよい。特に、樹脂組成物を成形する際の自由度を考慮すると、成形後に架橋を行うことが好ましい。 The cross-linking step of the resin composition of the present invention may be determined according to the properties of the target molded product, and may be before or after molding. In particular, considering the degree of freedom in molding the resin composition, it is preferable to carry out cross-linking after molding.
<架橋物の成形方法>
本発明の樹脂組成物を成形するに当たっては、成形方法を適宜採用することにより、種々の成形物、例えば、フィルム、シート、容器その他の包装材等に成形することができる。このとき、樹脂組成物を一旦ペレットとしてから成形に供してもよいし、樹脂組成物の各成分をドライブレンドして、直接成形に供してもよい。<Molding method for crosslinked products>
In molding the resin composition of the present invention, various molded products such as films, sheets, containers and other packaging materials can be molded by appropriately adopting a molding method. At this time, the resin composition may be once pelletized and then subjected to molding, or each component of the resin composition may be dry-blended and subjected to direct molding.
成形方法及び成形物としては、例えば、溶融押出成形によりフィルム、シート、パイプ等に、射出成形により容器形状に、また中空成形によりボトル状等の中空容器に成形することができる。中空成形としては、押出成形によりパリソンを成形し、これをブローして成形を行う押出中空成形と、射出成形によりプリフォームを成形し、これをブローして成形を行う射出中空成形を挙げることができる。これらのうちレトルト用包装材には、溶融押出成形によって多層フィルム等の包装材を成形する方法、溶融押出成形によって成形した多層シートを熱成形して容器状の包装材にする方法が好ましい。また、用途によっては押出成形によってパリソンを形成し、これをブロー成形して比較的柔軟な多層容器状の包装材とする方法も好ましい。 As the molding method and the molded product, for example, it can be molded into a film, a sheet, a pipe or the like by melt extrusion molding, into a container shape by injection molding, or into a hollow container such as a bottle by hollow molding. Examples of hollow molding include extrusion hollow molding in which a parison is formed by extrusion molding and then blown to form the preform, and injection hollow molding in which a preform is formed by injection molding and then blown to form the preform. can. Of these, as the packaging material for retort pouches, a method of forming a packaging material such as a multilayer film by melt extrusion molding and a method of thermoforming a multilayer sheet formed by melt extrusion molding into a container-shaped packaging material are preferable. Further, depending on the application, a method of forming a parison by extrusion molding and blow molding the parison to form a relatively flexible multi-layer container-shaped packaging material is also preferable.
<多層構造体>
前記架橋物の用途は多岐に亘る。例えば、押出成形品、フィルム又はシート(特に延伸フィルム又は熱収縮フィルム)、熱成形品、壁紙又は化粧板、パイプ又はホース、異形成形品、押出ブロー成形品、射出成形品、フレキシブル包装材、容器(特にレトルト容器)等が好適なものとして例示される。成形品が多層構造体である場合には、共押出フィルム又は共押出シート、熱収縮フィルム、容器(特に共押出ブロー成形容器、共射出成形容器、レトルト容器)、パイプ(特に燃料パイプ又は温水循環用パイプ)、ホース(特に燃料ホース)等が好ましい。<Multi-layer structure>
The crosslinked product has a wide range of uses. For example, extruded products, films or sheets (especially stretched films or heat shrink films), heat molded products, wallpaper or veneer, pipes or hoses, profiled products, extruded blow molded products, injection molded products, flexible packaging materials, containers. (Especially a retort container) and the like are exemplified as suitable ones. When the molded product is a multi-layer structure, co-extruded film or co-extruded sheet, heat-shrinkable film, container (especially co-extruded blow molded container, co-injection molded container, retort container), pipe (especially fuel pipe or hot water circulation). Pipes), hoses (particularly fuel hoses) and the like are preferred.
前記多層構造体は、上記成形により得られる架橋物の層と他の層とを積層して得られる。 The multilayer structure is obtained by laminating a layer of a crosslinked product obtained by the above molding and another layer.
多層構造体の層構成としては、本発明の樹脂組成物以外の重合体からなる層をx層、本発明の樹脂組成物層をy層、接着性重合体層をz層とすると、x/y、x/y/x、x/z/y、x/z/y/z/x、x/y/x/y/x、x/z/y/z/x/z/y/z/x等が例示される。複数のx層を設ける場合は、その種類は同じであっても異なっていてもよい。また、成形時に発生するトリム等のスクラップからなる回収重合体を用いた層を別途設けてもよいし、回収重合体を他の重合体からなる層にブレンドしてもよい。当該多層構造体の各層の厚さ構成は、特に限定されるものではないが、成形性及びコスト等の観点から、全層厚さに対するy層の厚さ比は2~20%が好ましい。 As the layer structure of the multilayer structure, when the layer made of a polymer other than the resin composition of the present invention is the x layer, the resin composition layer of the present invention is the y layer, and the adhesive polymer layer is the z layer, x / y, x / y / x, x / z / y, x / z / y / z / x, x / y / x / y / x, x / z / y / z / x / z / y / z / X and the like are exemplified. When a plurality of x layers are provided, the types may be the same or different. Further, a layer using a recovered polymer made of scrap such as trim generated during molding may be separately provided, or the recovered polymer may be blended with a layer made of another polymer. The thickness composition of each layer of the multilayer structure is not particularly limited, but the thickness ratio of the y layer to the total layer thickness is preferably 2 to 20% from the viewpoint of moldability and cost.
上記のx層に使用される重合体としては、加工性等の観点から熱可塑性重合体が好ましい。かかる熱可塑性重合体としては、例えば次の重合体が挙げられる。
・ポリエチレン、ポリプロピレン、エチレン-プロピレン共重合体、エチレン又はプロピレン共重合体(エチレン又はプロピレンと次の単量体の少なくとも1種との共重合体:1-ブテン、イソブテン、4-メチル-1-ペンテン、1-ヘキセン、1-オクテン等のα-オレフィン;イタコン酸、メタクリル酸、アクリル酸、無水マレイン酸等の不飽和カルボン酸、その塩、その部分又は完全エステル、そのニトリル、そのアミド、その無水物;ギ酸ビニル、酢酸ビニル、プロピオン酸ビニル、ビニルブチレート、ビニルオクタノエート、ビニルドデカノエート、ビニルステアレート、ビニルアラキドネート等のカルボン酸ビニルエステル類;ビニルトリメトキシシラン等のビニルシラン系化合物;不飽和スルホン酸又はその塩;アルキルチオール類;ビニルピロリドン類等);
・ポリ4-メチル-1-ペンテン、ポリ1-ブテン等のポリオレフィン;
・ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート等のポリエステル;
・ポリε-カプロラクタム、ポリヘキサメチレンアジパミド、ポリメタキシリレンアジパミド等のポリアミド;
・ポリ塩化ビニリデン、ポリ塩化ビニル、ポリスチレン、ポリアクリロニトリル、ポリカーボネート、ポリアクリレート等。
かかる熱可塑性重合体層は無延伸のものであってもよいし、一軸もしくは二軸に延伸又は圧延されているものであっても構わない。これらの重合体のうち、レトルト容器に用いられる場合には、食品等を包装して包装体とした際の外層側がポリアミド、ポリエステル、またはポリプロピレンであることが好ましい。内層側はポリプロピレンであることが好ましい。また、y層を中間層に有する産業用パイプに用いられる場合には、内層側、外層側ともにポリエチレンまたはポリピロピレンであることが好ましい。As the polymer used for the x-layer, a thermoplastic polymer is preferable from the viewpoint of processability and the like. Examples of such thermoplastic polymers include the following polymers.
-Polymer, polypropylene, ethylene-propylene copolymer, ethylene or propylene copolymer (polymer of ethylene or propylene and at least one of the following monomers: 1-butene, isobutene, 4-methyl-1- Α-olefins such as penten, 1-hexene and 1-octene; unsaturated carboxylic acids such as itaconic acid, methacrylic acid, acrylic acid and maleic anhydride, salts thereof, partial or complete esters thereof, nitriles thereof, amides thereof, and amides thereof. Anhydrous: Carboxylic acid vinyl esters such as vinyl formate, vinyl acetate, vinyl propionate, vinyl butyrate, vinyl octanoate, vinyl dodecanoate, vinyl stearate, vinyl arachidonate; vinyl silanes such as vinyl trimethoxysilane Compounds; unsaturated sulfonic acids or salts thereof; alkylthiols; vinylpyrrolidones, etc.);
-Polyolefins such as poly4-methyl-1-pentene and poly1-butene;
-Polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate;
-Polyamides such as polyε-caprolactam, polyhexamethylene adipamide, polymethoxylylen adipamide;
-Polyvinylidene chloride, polyvinyl chloride, polystyrene, polyacrylonitrile, polycarbonate, polyacrylate, etc.
The thermoplastic polymer layer may be unstretched, or may be uniaxially or biaxially stretched or rolled. Among these polymers, when used in a retort container, it is preferable that the outer layer side of the package when food or the like is packaged is polyamide, polyester, or polypropylene. The inner layer side is preferably polypropylene. Further, when it is used for an industrial pipe having a y layer as an intermediate layer, it is preferable that both the inner layer side and the outer layer side are polyethylene or polypropylene.
これらの熱可塑性重合体のうち、ポリオレフィンは耐湿性、機械的特性、経済性、ヒートシール性等の点で、また、ポリアミドやポリエステルは機械的特性、耐熱性等の点で好ましい。 Among these thermoplastic polymers, polyolefin is preferable in terms of moisture resistance, mechanical properties, economy, heat sealability, etc., and polyamide and polyester are preferable in terms of mechanical properties, heat resistance, and the like.
一方、z層に使用される接着性重合体としては、各層間を接着できるものであればよく、ポリウレタン系又はポリエステル系の一液型又は二液型硬化性接着剤、カルボン酸変性ポリオレフィン重合体等が好ましい。カルボン酸変性ポリオレフィン重合体は、不飽和カルボン酸又はその無水物(無水マレイン酸等)を共重合成分として含むオレフィン系重合体又は共重合体;又は不飽和カルボン酸又はその無水物をオレフィン系重合体又は共重合体にグラフトさせて得られるグラフト共重合体である。 On the other hand, the adhesive polymer used for the z layer may be any adhesive polymer capable of adhering between the layers, and is a polyurethane-based or polyester-based one-component or two-component curable adhesive, or a carboxylic acid-modified polyolefin polymer. Etc. are preferable. The carboxylic acid-modified polyolefin polymer is an olefin-based polymer or copolymer containing an unsaturated carboxylic acid or an anhydride thereof (maleic anhydride, etc.) as a copolymer; or an unsaturated carboxylic acid or an anhydride thereof in an olefin-based weight. It is a graft copolymer obtained by grafting on a coalescence or a copolymer.
共射出成形法や共押出成形法等で多層構造体を製造する場合は、カルボン酸変性ポリオレフィン重合体がより好ましい。特に、x層がポリオレフィン重合体である場合、y層との接着性が良好となる。かかるカルボン酸変性ポリオレフィン重合体を構成するポリオレフィン重合体としては、例えば、低密度ポリエチレン(LDPE)、直鎖状低密度ポリエチレン(LLDPE)、超低密度ポリエチレン(VLDPE)等のポリエチレン;ポリプロピレン;共重合ポリプロピレン;エチレン-酢酸ビニル共重合体;エチレン-(メタ)アクリル酸エステル(メチルエステル又はエチルエステル)共重合体等が挙げられる。一方、ドライラミネート法で多層構造体を製造する場合には、ポリウレタン系の二液型硬化性接着剤がより好ましい。この場合、x層に多様な重合体を用いることができるため、多層構造体の機能をより高度なものにすることができる。 When a multilayer structure is produced by a co-injection molding method, a co-extrusion molding method, or the like, a carboxylic acid-modified polyolefin polymer is more preferable. In particular, when the x layer is a polyolefin polymer, the adhesiveness with the y layer is good. Examples of the polyolefin polymer constituting such a carboxylic acid-modified polyolefin polymer include polyethylene such as low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), and ultra-low-density polyethylene (VLDPE); polypropylene; copolymerization. Polypropylene; ethylene-vinyl acetate copolymer; ethylene- (meth) acrylic acid ester (methyl ester or ethyl ester) copolymer and the like can be mentioned. On the other hand, when a multilayer structure is produced by the dry laminating method, a polyurethane-based two-component curable adhesive is more preferable. In this case, since various polymers can be used for the x layer, the function of the multilayer structure can be further enhanced.
本発明の多層構造体を得る方法としては、例えば押出ラミネート法、ドライラミネート法、共射出成形法、共押出成形法等が挙げられる。共押出成形法としては、共押出ラミネート法、共押出シート成形法、共押出パイプ成形法、共押出チューブ成形法、共押出インフレーション成形法、共押出ブロー成形法等を挙げられる。 Examples of the method for obtaining the multilayer structure of the present invention include an extrusion laminating method, a dry laminating method, a co-injection molding method, a co-extrusion molding method and the like. Examples of the co-extrusion molding method include a co-extrusion laminating method, a co-extrusion sheet molding method, a co-extrusion pipe molding method, a co-extrusion tube molding method, a co-extrusion inflation molding method, a co-extrusion blow molding method and the like.
このようにして得られた本発明の多層構造体のシート、フィルム、パリソン等を、含有される重合体の融点以下の温度で再加熱し、絞り成形等の熱成形法、ロール延伸法、パンタグラフ式延伸法、インフレーション延伸法、ブロー成形法等により一軸又は二軸延伸して、延伸された成形物を得ることもできる。 The sheet, film, parison, etc. of the multilayer structure of the present invention thus obtained are reheated at a temperature equal to or lower than the melting point of the contained polymer, and are subjected to a thermoforming method such as draw molding, a roll stretching method, and a pantograph. It is also possible to obtain a stretched molded product by uniaxially or biaxially stretching by a formula stretching method, an inflation stretching method, a blow molding method or the like.
本発明の多層構造体は種々の用途に応用することができ、例えば、上述の架橋物において例示したような用途に用いることができる。中でも、多層構造体の架橋剤の低ブリードアウト性、良好な耐熱水性、耐熱溶剤性及び層間接着性という利点を活かせるため、レトルト容器やパイプに用いることが好ましい。また、化学的に活性な化学品や農薬などの容器としても好適に応用することができる。以下、本発明の多層構造体をレトルト容器として利用した態様について説明する。 The multilayer structure of the present invention can be applied to various uses, for example, it can be used for the uses exemplified in the above-mentioned crosslinked product. Above all, it is preferable to use it for a retort container or a pipe in order to take advantage of the low bleed-out property of the cross-linking agent of the multilayer structure, good heat resistance and water resistance, heat resistant solvent property and interlayer adhesion. It can also be suitably applied as a container for chemically active chemicals and pesticides. Hereinafter, an embodiment in which the multilayer structure of the present invention is used as a retort container will be described.
本発明の多層構造体を用いることにより、全層の合計の厚さ(以下、単に「全層厚さ」ともいう)が300μm以下である薄い多層構造体からなるフレキシブルなレトルト容器とすることができる。通常、このようなフレキシブルなレトルト容器は、パウチ等の形態に加工されている。この容器は酸素バリア性、耐熱水性及び層間接着性に優れ、かつ製造が簡便であるので、酸素に対し感受性が高く劣化し易い製品の包装に有用である。 By using the multi-layer structure of the present invention, it is possible to obtain a flexible retort container made of a thin multi-layer structure having a total thickness of all layers (hereinafter, also simply referred to as “total layer thickness”) of 300 μm or less. can. Usually, such a flexible retort container is processed into a pouch or the like. This container is excellent in oxygen barrier property, heat resistance and water resistance, and easy to manufacture, and is therefore useful for packaging products that are highly sensitive to oxygen and easily deteriorate.
このような多層フィルムの全層厚さは、フレキシブル性を維持するという観点から、その上限は300μmが好ましく、250μmがより好ましく、200μmさらに好ましい。一方、容器としての機械的特性を考慮すると、全層厚さの下限は10μmが好ましく、20μmがより好ましく、30μmがさらに好ましい。 From the viewpoint of maintaining flexibility, the upper limit of the total layer thickness of such a multilayer film is preferably 300 μm, more preferably 250 μm, and even more preferably 200 μm. On the other hand, considering the mechanical properties of the container, the lower limit of the total layer thickness is preferably 10 μm, more preferably 20 μm, and even more preferably 30 μm.
上記全層厚さが300μm以下の多層フィルムからなるレトルト容器は、例えば本発明の樹脂組成物からなる層と熱可塑性樹脂層とをドライラミネート、共押出ラミネート等の方法で積層することによって得られる多層フィルムから製造することができる。 The retort container made of a multilayer film having a total layer thickness of 300 μm or less can be obtained, for example, by laminating a layer made of the resin composition of the present invention and a thermoplastic resin layer by a method such as dry laminating or coextrusion laminating. It can be manufactured from a multilayer film.
ドライラミネートすることで得られる多層フィルムから製造する場合には、多層フィルムとして、無延伸フィルム、一軸延伸フィルム、二軸延伸フィルム、圧延フィルム等が使用可能である。これらの中でも、二軸延伸ポリプロピレンフィルム、二軸延伸ポリエステルフィルム、二軸延伸ポリアミドフィルムが、機械的強度や耐熱性の観点から好ましい。無延伸フィルム又は一軸延伸フィルムを使用する場合、積層した後に多層フィルムを再加熱し、絞り成形等の熱成形法、ロール延伸法、パンタグラフ式延伸法、インフレーション延伸法等により一軸又は二軸延伸することによって、延伸された多層フィルムを得ることもできる。 In the case of producing from a multilayer film obtained by dry laminating, a non-stretched film, a uniaxially stretched film, a biaxially stretched film, a rolled film and the like can be used as the multilayer film. Among these, biaxially stretched polypropylene film, biaxially stretched polyester film, and biaxially stretched polyamide film are preferable from the viewpoint of mechanical strength and heat resistance. When a non-stretched film or a uniaxially stretched film is used, the multilayer film is reheated after laminating and uniaxially or biaxially stretched by a thermoforming method such as draw forming, a roll stretching method, a pantograph stretching method, an inflation stretching method, or the like. Thereby, a stretched multilayer film can also be obtained.
得られるレトルト容器を密封するために、多層フィルムの製造段階において、少なくとも一方の最外層表面にヒートシール可能な樹脂からなる層を設けることも好ましい。かかる樹脂としては、ポリエチレン、ポリプロピレン等のポリオレフィンを挙げることができる。 In order to seal the obtained retort container, it is also preferable to provide a layer made of a heat-sealable resin on the surface of at least one of the outermost layers in the manufacturing stage of the multilayer film. Examples of such a resin include polyolefins such as polyethylene and polypropylene.
こうして得られるレトルト容器は、安全性に優れ、フレキシブルで簡便であり、かつ酸素バリア性に優れるので、酸素の存在により劣化しやすい内容物、特に食品やペットフード、医薬品等の包装に有用である。 The retort container thus obtained is excellent in safety, flexible and convenient, and has excellent oxygen barrier properties, and is therefore useful for packaging contents that are easily deteriorated by the presence of oxygen, especially foods, pet foods, pharmaceuticals, and the like. ..
以下、実施例を挙げて、本発明の実施の形態をさらに具体的に説明する。但し、本発明は、これらの実施例に何ら制約されるものではない。ここで、量的関係については、特記しない限り質量基準である。実施例及び比較例における各測定・評価は、下記の要領で行った。 Hereinafter, embodiments of the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples. Here, the quantitative relationship is based on mass unless otherwise specified. Each measurement / evaluation in Examples and Comparative Examples was performed as follows.
(1)ゲル分率
以下の実施例及び比較例で得られた樹脂組成物のペレットを20mmφ一軸押出機(210℃)に通して、コートハンガーダイより溶融押出を行い、厚さ20μmの単層フィルムを得た。得られた単層フィルムを電子線照射装置に導入して、加速電圧250kVにて電子線を照射して架橋を行い、照射単層フィルムを得た。次いで、得られた照射単層フィルムを20cm四方に切り出した。水(15質量%)-フェノール(85質量%)の混合溶剤100質量部に前記照射単層フィルム1質量部を浸し、60℃で12時間加熱溶解させた後、ろ過し、ろ液を蒸発乾固することで固形分残分(%)を算出し、これをゲル分率とした。(1) Gel fraction The pellets of the resin composition obtained in the following examples and comparative examples are passed through a 20 mmφ uniaxial extruder (210 ° C.) and melt-extruded from a coated hanger die to obtain a single layer having a thickness of 20 μm. I got a film. The obtained single-layer film was introduced into an electron beam irradiation device and irradiated with an electron beam at an acceleration voltage of 250 kV for cross-linking to obtain an irradiated single-layer film. Next, the obtained irradiated single-layer film was cut out in a 20 cm square. 1 part by mass of the irradiated single layer film is immersed in 100 parts by mass of a mixed solvent of water (15% by mass) and phenol (85% by mass), heated and dissolved at 60 ° C. for 12 hours, filtered, and the filtrate is evaporated to dryness. The solid content residue (%) was calculated by solidification, and this was used as the gel content.
(2)耐熱水性(単層フィルムの評価)
上記(1)と同様にして得た照射単層フィルムを10cm四方に切り出し、12cm四方のパウチに水100mlと共に封入し、135℃、60分間レトルト処理した後のフィルムの外観を目視にて観察した。そのときのフィルムの外観を以下の基準で評価した。
A:全体的にフィルムの溶解がなかった。
B:一部フィルムの溶解がみられた。
C:全体的にフィルムが溶解し、原形をとどめていなかった。(2) Heat-resistant water (evaluation of single-layer film)
The irradiated single-layer film obtained in the same manner as in (1) above was cut into 10 cm squares, sealed in a 12 cm square pouch with 100 ml of water, and retort-treated at 135 ° C. for 60 minutes, and the appearance of the film was visually observed. .. The appearance of the film at that time was evaluated according to the following criteria.
A: Overall, the film did not dissolve.
B: Part of the film was dissolved.
C: The film was melted as a whole and did not retain its original shape.
(3)耐熱水性(多層フィルムの評価)
延伸ポリアミドフィルム(ON)及び無延伸ポリプロピレンフィルム(CPP)を、上記(1)と同様にして得た単層フィルム(電子線照射前)の両側に、三井化学株式会社製タケラックA-520及びタケネートA-50からなる、ポリウレタン系二液型硬化性接着剤(Ad)を介してラミネートすることにより、多層フィルム((外層)ON 15μm/Ad/EVOH層(単層フィルム) 20μm/Ad/CPP 50μm(内層))を得た。得られた多層フィルムを電子線照射装置に導入して、加速電圧250kVにて電子線を照射して架橋を行い、照射多層フィルムを得た。得られた照射多層フィルムを用いて、10cm四方のパウチを作製し、その中に水80mlを注ぎ込んで、135℃で60分間レトルト処理した後のパウチの外観を目視にて観察した。そのときのパウチの外観を以下の基準で評価した。
A:EVOH層と内外層の剥離は確認されず、EVOH層の透明性は保たれていた。
B:EVOH層と内外層の一部に剥離が見られた、又は、EVOH層に軽微な白化が見られた。
C:EVOH層と内外層の大部分に剥離が見られた、又は、EVOH層に顕著な白化が見られた。(3) Heat-resistant water-based (evaluation of multilayer film)
Takelac A-520 and Takenate manufactured by Mitsui Chemicals, Inc. on both sides of a single-layer film (before electron beam irradiation) obtained by forming a stretched polyamide film (ON) and a non-stretched polypropylene film (CPP) in the same manner as in (1) above. By laminating via a polyurethane-based two-component curable adhesive (Ad) made of A-50, a multilayer film ((outer layer) ON 15 μm / Ad / EVOH layer (single layer film) 20 μm / Ad / CPP 50 μm) (Inner layer)) was obtained. The obtained multilayer film was introduced into an electron beam irradiator and irradiated with an electron beam at an acceleration voltage of 250 kV for cross-linking to obtain an irradiated multilayer film. Using the obtained irradiation multilayer film, a 10 cm square pouch was prepared, 80 ml of water was poured into the pouch, and the pouch was visually observed after being retorted at 135 ° C. for 60 minutes. The appearance of the pouch at that time was evaluated according to the following criteria.
A: No peeling between the EVOH layer and the inner and outer layers was confirmed, and the transparency of the EVOH layer was maintained.
B: Peeling was observed between the EVOH layer and a part of the inner and outer layers, or slight whitening was observed in the EVOH layer.
C: Peeling was observed in most of the EVOH layer and the inner and outer layers, or remarkable whitening was observed in the EVOH layer.
(4)耐熱溶剤性
上記(1)と同様にして得た照射単層フィルム上にグリセロール1mlを滴下し、フィルムを折りたたんでグリセロールを挟み、その上に1kgの荷重をかけた。この状態で100℃、30分間の加熱処理を行った。室温まで冷却した後、フィルムの膠着度及び外観(白化又は白化ムラ)を目視にて観察した。そのときのフィルムの膠着度及び外観を以下の基準で評価した。
A:膠着及び外観変化は見られなかった。
B:わずかに膠着及び外観変化が見られた。
C:やや膠着及び外観変化が見られた。(4) Heat-resistant solvent resistance 1 ml of glycerol was dropped onto the irradiated single-layer film obtained in the same manner as in (1) above, the film was folded to sandwich the glycerol, and a load of 1 kg was applied thereto. In this state, heat treatment was performed at 100 ° C. for 30 minutes. After cooling to room temperature, the degree of stickiness and appearance (whitening or uneven whitening) of the film were visually observed. The degree of stickiness and appearance of the film at that time were evaluated according to the following criteria.
A: No stalemate or change in appearance was observed.
B: Slight stalemate and change in appearance were observed.
C: Slight stalemate and change in appearance were observed.
(5)OTR(酸素透過速度;レトルト前)
上記(3)と同様にして得た照射多層フィルムを用いて、下記の条件でOTRを測定した。
条件:20℃、(外)65%RH/(内)100%RH(5) OTR (oxygen permeation rate; before retort)
Using the irradiation multilayer film obtained in the same manner as in (3) above, OTR was measured under the following conditions.
Conditions: 20 ° C, (outside) 65% RH / (inside) 100% RH
(6)OTR(酸素透過速度;レトルト後)
上記(3)と同様にして得た照射多層フィルムを用いてパウチを作製し、その中に水を注ぎ込んで、135℃で60分間レトルト処理した後のOTRを、下記の条件で測定した。
条件:20℃、(外)65%RH/(内)100%RH、レトルト1日後(6) OTR (oxygen permeation rate; after retort)
An irradiation multilayer film obtained in the same manner as in (3) above was used to prepare a pouch, water was poured into the pouch, and the OTR was retorted at 135 ° C. for 60 minutes, and then the OTR was measured under the following conditions.
Conditions: 20 ° C, (outside) 65% RH / (inside) 100% RH, 1 day after retort
(7)層間接着性
上記(1)と同様にして得た照射単層フィルムを40℃、90%RH条件下にて3ヶ月保管した後、ポリウレタン系の二液型硬化性接着剤を用いてCPPフィルム(50μm)とラミネートした。これを40℃、2日間エージング処理した後に接着性を評価した。
A:接着性は良好であり、力を入れても剥離しない。
B:良好に接着しているが、力を入れると剥離する場合がある。
C:通常の使用では剥離は見られないが、力を入れると剥離する。(7) Laminate Adhesiveness The irradiated single-layer film obtained in the same manner as in (1) above is stored at 40 ° C. and 90% RH for 3 months, and then a polyurethane-based two-component curable adhesive is used. It was laminated with a CPP film (50 μm). After aging this at 40 ° C. for 2 days, the adhesiveness was evaluated.
A: Adhesiveness is good, and it does not peel off even if force is applied.
B: Adhesive is good, but it may peel off when force is applied.
C: No peeling is seen in normal use, but peeling occurs when force is applied.
(8)外観特性
上記(1)と同様にして得た照射単層フィルムのゲル及びブツの発生量と白化ムラを目視で確認し、下記のA~Dの基準で評価することで外観特性の指標とした。基準Cが実使用に耐えられるボーダーレベルである。
A :ほとんどゲル、ブツ及び白化ムラが見られない
B :わずかにゲル、ブツ及び白化ムラが見られる
C :ややゲル、ブツ及び白化ムラが見られる
D :かなりゲル、ブツ及び白化ムラが見られる(8) Appearance characteristics The appearance characteristics are evaluated by visually confirming the amount of gel and lumps generated and the uneven whitening of the irradiated single-layer film obtained in the same manner as in (1) above, and evaluating them according to the following criteria A to D. It was used as an index. Criterion C is a border level that can withstand actual use.
A: Almost no gel, lumps and uneven whitening B: Slight gel, lumps and uneven whitening C: Slightly gel, lumps and uneven whitening D: Significant gel, lumps and uneven whitening
各実施例等で使用したエチレン-ビニルアルコール共重合体(A)、架橋剤(B)及びヒンダードフェノール系化合物(C)を以下に示す。
<エチレン-ビニルアルコール共重合体(A)>
(EVOH-1)エチレン単位含有量:27モル%、けん化度:99.8%
(EVOH-2)エチレン単位含有量:44モル%、けん化度:99.8%The ethylene-vinyl alcohol copolymer (A), the cross-linking agent (B) and the hindered phenolic compound (C) used in each example are shown below.
<Ethylene-vinyl alcohol copolymer (A)>
(EVOH-1) Ethylene unit content: 27 mol%, saponification degree: 99.8%
(EVOH-2) Ethylene unit content: 44 mol%, saponification degree: 99.8%
<架橋剤(B)>
(架橋剤1)日本化成株式会社製タイクプレポリマー トリアリルイソシアヌレート重合体:200℃で融解も軟化もせず、熱分解が始まった。
(架橋剤2)トリメタリルイソシアヌレート:融点84℃
(架橋剤3)トリアリルシアヌレート:融点27℃
(架橋剤4)トリアリルイソシアヌレート:融点25℃
(架橋剤5)トリメチロールプロパントリメタクリレート(トリアジン誘導体以外の架橋剤):融点-14℃
(架橋剤6)ペンタエリスリトールトリアリルエーテル(トリアジン誘導体以外の架橋剤):融点約-20℃<Crosslinking agent (B)>
(Crosslinking agent 1) Tyke prepolymer manufactured by Nihon Kasei Co., Ltd. Triallyl isocyanurate polymer: Pyrolysis started at 200 ° C without melting or softening.
(Crosslinking agent 2) Trimetharyl isocyanurate: Melting point 84 ° C.
(Crosslinking agent 3) Triallyl cyanurate: Melting point 27 ° C.
(Crosslinking agent 4) Triallyl isocyanurate: Melting point 25 ° C.
(Crosslinking agent 5) Trimethylolpropane Trimethacrylate (crosslinking agent other than triazine derivative): Melting point -14 ° C.
(Crosslinking agent 6) Pentaerythritol triallyl ether (crosslinking agent other than triazine derivative): melting point of about -20 ° C.
<ヒンダードフェノール系化合物(C)>
(ヒンダードフェノール系化合物1)BASF社製イルガノックス1010 ペンタエリトリトールテトラキス[3-(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロピオナート]
(ヒンダードフェノール系化合物2)BASF社製イルガノックス1098 N,N'-ヘキサメチレンビス[3-(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロパンアミド]<Hindered phenolic compound (C)>
(Hinderd Phenol Compound 1) BASF's Irganox 1010 Pentaerythritol Tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate]
(Hindered Phenol Compound 2) BASF's Irganox 1098 N, N'-hexamethylenebis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propanamide]
(実施例1~10及び比較例1~8)
25mmφ二軸押出機を用いて、210℃にて上述のEVOH、架橋剤及びヒンダードフェノール系化合物を表1に示した割合で溶融混練することにより、架橋性樹脂組成物のペレットを調製した。各測定・評価における電子線の照射線量は、実施例9は10kGy、比較例1は照射なし、その他の実施例及び比較例においては100kGyである。評価結果を表2に示す。(Examples 1 to 10 and Comparative Examples 1 to 8)
A pellet of a crosslinkable resin composition was prepared by melt-kneading the above-mentioned EVOH, a cross-linking agent and a hindered phenol-based compound at 210 ° C. using a 25 mmφ twin-screw extruder at the ratios shown in Table 1. The irradiation dose of the electron beam in each measurement / evaluation is 10 kGy in Example 9, no irradiation in Comparative Example 1, and 100 kGy in the other Examples and Comparative Examples. The evaluation results are shown in Table 2.
表2の結果からも明らかなように、実施例の樹脂組成物を用いて得られた各フィルムでは、ゲル分率が高く十分に架橋が進行していた。これにより、実施例の各フィルムは、耐熱水性と耐熱溶剤性に優れ、OTRも低い値となったと共に、良好な層間接着性を維持した。これに対し、比較例の樹脂組成物を用いて得られたフィルムでは、耐熱水性、耐熱溶剤性、OTR、層間接着性及び外観特性のいずれかに劣る結果となった。また、ヒンダードフェノール系化合物を適切に添加した実施例では、溶融混練や溶融成形時の粘度が安定しており、得られる架橋物の外観も良好であった。特に、アミド結合を有するヒンダードフェノール系化合物を用いた実施例では、得られる架橋物の外観特性が優れていた。 As is clear from the results in Table 2, in each film obtained by using the resin composition of the example, the gel fraction was high and the cross-linking proceeded sufficiently. As a result, each film of the example was excellent in heat-resistant water-resistant and heat-resistant solvent resistance, had a low OTR value, and maintained good interlayer adhesiveness. On the other hand, the film obtained by using the resin composition of the comparative example was inferior in any of heat-resistant water-resistant, heat-resistant solvent resistance, OTR, interlayer adhesiveness, and appearance characteristics. Further, in the examples in which the hindered phenolic compound was appropriately added, the viscosity at the time of melt kneading and melt molding was stable, and the appearance of the obtained crosslinked product was also good. In particular, in the examples using the hindered phenolic compound having an amide bond, the appearance characteristics of the obtained crosslinked product were excellent.
本発明の樹脂組成物は、架橋物からの架橋剤のブリードアウトを十分抑制することができ、耐熱水性、耐熱溶剤性及び層間接着性に優れかつ衛生的な架橋物を実現することができることから、食品包装材料その他の包装材料や産業用パイプの製造に好適に用いることができる。また、使用されるEVOH(A)に特に制限はないため、多様な架橋物を形成することが可能である。 The resin composition of the present invention can sufficiently suppress the bleed-out of the cross-linking agent from the cross-linked product, and can realize a cross-linked product having excellent heat-resistant water-resistant, heat-resistant solvent resistance and interlayer adhesion and being hygienic. , Food packaging materials and other packaging materials and industrial pipes can be suitably used. Further, since the EVOH (A) used is not particularly limited, it is possible to form various crosslinked products.
Claims (11)
前記エチレン-ビニルエステル共重合体をけん化してエチレン-ビニルアルコール共重合体(A)を得るけん化工程、及び
エチレン-ビニルアルコール共重合体(A)と架橋剤(B)とを混合して混合物を得る混合工程を含む、
請求項1~4のいずれか1項に記載の樹脂組成物の製造方法。 Copolymerization step of copolymerizing ethylene and vinyl ester to obtain an ethylene-vinyl ester copolymer,
A saponification step of saponifying the ethylene-vinyl ester copolymer to obtain an ethylene-vinyl alcohol copolymer (A), and a mixture of the ethylene-vinyl alcohol copolymer (A) and a cross-linking agent (B). Including the mixing step to obtain,
The method for producing a resin composition according to any one of claims 1 to 4 .
前記エチレン-ビニルエステル共重合体をけん化してエチレン-ビニルアルコール共重合体(A)を得るけん化工程、
エチレン-ビニルアルコール共重合体(A)と架橋剤(B)とを混合して混合物を得る混合工程、及び
前記混合工程で得られた前記混合物に活性エネルギー線を照射する架橋工程を含む、請求項5に記載の架橋物の製造方法。 Copolymerization step of copolymerizing ethylene and vinyl ester to obtain an ethylene-vinyl ester copolymer,
A saponification step of saponifying the ethylene-vinyl ester copolymer to obtain an ethylene-vinyl alcohol copolymer (A).
A claim comprising a mixing step of mixing an ethylene-vinyl alcohol copolymer (A) and a crosslinking agent (B) to obtain a mixture, and a crosslinking step of irradiating the mixture obtained in the mixing step with active energy rays. Item 5. The method for producing a crosslinked product according to Item 5.
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JP2009185231A (en) | 2008-02-08 | 2009-08-20 | Fuji Electric Fa Components & Systems Co Ltd | Arc-extinguishing resin processed article and circuit breaker using the same |
WO2011125736A1 (en) | 2010-03-31 | 2011-10-13 | 株式会社クラレ | Resin composition, molded article, multilayered pipe and method for producing the same |
JP2012179915A (en) | 2005-03-23 | 2012-09-20 | Nippon Zeon Co Ltd | Oxygen absorbing gas barrier multilayer structure |
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JP2009185231A (en) | 2008-02-08 | 2009-08-20 | Fuji Electric Fa Components & Systems Co Ltd | Arc-extinguishing resin processed article and circuit breaker using the same |
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