JPH04221030A - Copper alloy for die for plastic molding - Google Patents
Copper alloy for die for plastic moldingInfo
- Publication number
- JPH04221030A JPH04221030A JP41330290A JP41330290A JPH04221030A JP H04221030 A JPH04221030 A JP H04221030A JP 41330290 A JP41330290 A JP 41330290A JP 41330290 A JP41330290 A JP 41330290A JP H04221030 A JPH04221030 A JP H04221030A
- Authority
- JP
- Japan
- Prior art keywords
- plastic molding
- copper alloy
- die
- strength
- thermal conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 9
- 238000010137 moulding (plastic) Methods 0.000 title claims abstract description 8
- 229910052742 iron Inorganic materials 0.000 claims abstract description 6
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims abstract description 4
- 229910052735 hafnium Inorganic materials 0.000 claims abstract description 4
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 4
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 229910052718 tin Inorganic materials 0.000 claims abstract description 4
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 4
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 4
- 239000012535 impurity Substances 0.000 claims abstract description 3
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 8
- 239000000956 alloy Substances 0.000 abstract description 8
- 229910052804 chromium Inorganic materials 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 229910000765 intermetallic Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 229910000599 Cr alloy Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は強度が高く、熱伝導度が
優れたプラスチック成形金型用銅合金に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper alloy for plastic molds which has high strength and excellent thermal conductivity.
【０００２】0002
【従来の技術】従来、プラスチック成形金型用の材料と
しては、機械構造用の炭素鋼や熱間工具用鋼等の鉄系の
合金が多く使用されていた。これらの材料は高温強度が
優れているものの熱伝導性が低いため金型の内外側での
温度勾配が大きく金型が割れ易く、寿命が短い欠点があ
った。BACKGROUND OF THE INVENTION Conventionally, iron-based alloys such as carbon steel for machine structures and steel for hot work tools have often been used as materials for plastic molds. Although these materials have excellent high-temperature strength, they have low thermal conductivity, resulting in a large temperature gradient between the inside and outside of the mold, making the mold easily cracked and having a short lifespan.
【０００３】また、熱伝導率の高い材料としては、Ｃｕ
−Ｃｒ合金が公知であるが、これは材料の高温強度が低
いので、あまり使用されていない。[0003] Also, as a material with high thermal conductivity, Cu
-Cr alloys are known, but are not widely used due to the low high temperature strength of the material.
【０００４】しかし、生産性を向上させるため製品の成
形サイクルをいかにして短縮するかが課題であり、その
ためには熱伝導率の高い金型用材料が望まれている。However, the problem is how to shorten the molding cycle of products in order to improve productivity, and for this purpose there is a need for mold materials with high thermal conductivity.
【０００５】[0005]
【発明が解決しようとする課題】プラスチック成形金型
用の材料に要求される特性値は高温強度に優れ、かつ熱
伝導率に優れていることである。本発明はかかる点に鑑
みなされたものであり、製造性が良好で、かつ高温強度
が高く、しかも熱伝導率に優れた材料を提供するもので
ある。[Problems to be Solved by the Invention] Characteristic values required of materials for plastic molds are excellent high-temperature strength and excellent thermal conductivity. The present invention has been made in view of these points, and it is an object to provide a material that has good manufacturability, high high-temperature strength, and excellent thermal conductivity.
【０００６】[0006]
【課題を解決するための手段】本発明に係るプラスチッ
ク成形金型用銅合金は、上記の目的を達成するためにＣ
ｒ：０．０５〜１．０ｗｔ％，Ｔｉ：０．０２〜０．６
ｗｔ％、Ｆｅ：０．０５〜１．５ｗｔ％を含有し、副成
分としてＡｌ，Ｂｅ，Ｃｏ，Ｈｆ，Ｍｇ，Ｍｎ，Ｎｉ，
Ｓｎ，Ｚｎ，Ｚｒからなる群の１種または２種以上を０
．００１〜２．０ｗｔ％含有し、残部Ｃｕおよび不可避
的不純物からなることを特徴としている。[Means for Solving the Problems] The copper alloy for plastic molding molds according to the present invention has a carbon
r: 0.05-1.0wt%, Ti: 0.02-0.6
wt%, Fe: 0.05 to 1.5 wt%, and subcomponents include Al, Be, Co, Hf, Mg, Mn, Ni,
0 of one or more of the group consisting of Sn, Zn, and Zr
．． 001 to 2.0 wt%, with the remainder consisting of Cu and unavoidable impurities.
【０００７】以下に本発明に係るプラスチック成形金型
用銅合金について詳細に説明する。Ｃｒは時効処理を行
なうことにより母材中に金属Ｃｒを析出させ、強度およ
び耐熱性を向上させるために添加するものであり、その
含有量を０．０５〜１．０ｗｔ％とするのは、Ｃｒの含
有量が０．０５ｗｔ％未満では前述の金属Ｃｒを析出さ
せるなどの効果が期待できないからであり、逆に１．０
ｗｔ％を超えると溶体化処理後においても未溶解のＣｒ
が母材中に残留し、著しい導電率および加工性の低下が
起るからである。[0007] The copper alloy for plastic molds according to the present invention will be explained in detail below. Cr is added to precipitate metal Cr in the base material by aging treatment to improve strength and heat resistance, and the content is set to 0.05 to 1.0 wt% because: This is because if the Cr content is less than 0.05 wt%, the above-mentioned effects such as precipitation of metal Cr cannot be expected;
If it exceeds wt%, undissolved Cr remains even after solution treatment.
remains in the base material, resulting in a significant decrease in electrical conductivity and workability.
【０００８】また、Ｔｉは時効処理を行なうことにより
母材中にＦｅと金属間化合物を形成し、強度、耐熱性、
導電性の向上が図れるためであり、特に導電性はＴｉ−
Ｆｅの金属間化合物を形成させることにより、Ｔｉ単独
添加に比べ著しい改善がみられる。Ｔｉ含有量を０．０
２ｗｔ％〜０．６ｗｔ％とするのは、０．０２ｗｔ％未
満では前述の金属間化合物を形成させるなどの効果が期
待できず、逆に０．６ｗｔ％を超えるとＣｒと同様、溶
体化処理後においても未溶解Ｔｉが母材中に残留し、著
しい導電性および加工性の低下が起るからである。Furthermore, when Ti is subjected to aging treatment, it forms an intermetallic compound with Fe in the base material, improving strength, heat resistance,
This is because the conductivity can be improved, especially the conductivity is Ti-
By forming an intermetallic compound of Fe, a remarkable improvement can be seen compared to the addition of Ti alone. Ti content 0.0
The reason why the content is 2wt% to 0.6wt% is that if it is less than 0.02wt%, the above-mentioned effects such as forming the intermetallic compound cannot be expected, and if it exceeds 0.6wt%, solution treatment is required as in the case of Cr. This is because undissolved Ti remains in the base material even afterwards, resulting in a significant decrease in conductivity and workability.
【０００９】さらに、ＦｅはＴｉと金属間化合物を形成
することにより強度および導電性の向上が図れるためで
あり、その添加量を０．０５ｗｔ％〜１．５ｗｔ％とす
るのは０．０５ｗｔ％未満では前述の金属間化合物を形
成する効果が期待できず、逆に１．５ｗｔ％を超えると
導電性、半だ付け性、酸化膜密着性が劣化するからであ
る。したがって好ましくはＴｉ／Ｆｅ比を０．４〜０．
５程度にすることが推奨される。その上に、副成分とし
てＡｌ，Ｂｅ，Ｃｏ，Ｈｆ，Ｍｇ，Ｍｎ，Ｎｉ，Ｓｎ，
Ｚｎ，Ｚｒからなる群の１種または２種以上を０．００
１〜２．０ｗｔ％添加するのは、導電性を大きく低下さ
せずに、強度を向上させる効果が期待できるからであり
、この添加量が総量で０．０１ｗｔ％未満では前述の導
電性を大きく低下させずに、強度を向上させる効果が期
待できず、逆に２．０ｗｔ％を超えると著しい導電性、
加工性の低下が起るからである。Furthermore, Fe can improve strength and conductivity by forming an intermetallic compound with Ti, and the amount of Fe added is set to 0.05 wt% to 1.5 wt%. If it is less than 1.5 wt%, the effect of forming the above-mentioned intermetallic compound cannot be expected, and on the other hand, if it exceeds 1.5 wt%, the conductivity, solderability, and oxide film adhesion will deteriorate. Therefore, preferably the Ti/Fe ratio is 0.4 to 0.
It is recommended to set it to around 5. In addition, Al, Be, Co, Hf, Mg, Mn, Ni, Sn,
0.00 of one or more of the group consisting of Zn and Zr
The reason for adding 1 to 2.0 wt% is that it can be expected to have the effect of improving the strength without significantly reducing the conductivity. If the total amount of addition is less than 0.01 wt%, the aforementioned conductivity will be greatly increased. It cannot be expected that the strength will be improved without decreasing the strength, and on the other hand, if it exceeds 2.0 wt%, the conductivity will be significant.
This is because workability is reduced.
【００１０】0010
【実施例】次に、本発明に係るプラスチック成形金型用
銅合金を評価した結果について比較合金と併せて説明す
る。[Example] Next, the results of evaluating the copper alloy for plastic molding molds according to the present invention will be explained together with comparative alloys.
【００１１】表１の成分の合金を不活性雰囲気にて１０
０ｍｍ厚さのインゴットを溶解鋳造し、９５０℃に加熱
後熱間鍛造し、鍛造終了温度を７００℃とし１５ｍｍの
厚さにした後、１℃／秒以上の速度で冷却した。そして
４５０℃にて２時間時効処理を施した。[0011] An alloy having the components shown in Table 1 was heated to 10% in an inert atmosphere.
An ingot with a thickness of 0 mm was melted and cast, heated to 950°C, hot forged, finished at a forging temperature of 700°C to a thickness of 15 mm, and cooled at a rate of 1°C/sec or more. Then, aging treatment was performed at 450°C for 2 hours.
【００１２】こうして得られた材料から引張試験、シャ
ルピー衝撃試験および熱伝導率測定用の試験片を採取し
た。そして、各合金について２０℃および３００℃にお
ける特性値を測定した結果を表１に示す。Test pieces for tensile tests, Charpy impact tests and thermal conductivity measurements were taken from the material thus obtained. Table 1 shows the results of measuring the characteristic values of each alloy at 20°C and 300°C.
【００１３】[0013]
【表１】[Table 1]
【００１４】表１の実験結果によれば、本発明合金がい
ずれも良好な高温強度、熱伝導性、耐衝撃性を有してい
るのに対し、比較合金はＮｏ．９，Ｎｏ．１０及びＮｏ
．１４はそれぞれＣｒ，Ｔｉ，Ｆｅが低く強度、耐衝撃
性が不足である。また、Ｎｏ．１１，Ｎｏ．１２及びＮ
ｏ．１３はそれぞれＣｒ，Ｔｉ，Ｆｅが多すぎて熱伝導
率が低い結果を示している。なお、Ｎｏ．１５はＣｕ−
Ｃｒ合金であるが耐衝撃性が低い。According to the experimental results shown in Table 1, the alloys of the present invention all have good high-temperature strength, thermal conductivity, and impact resistance, while the comparative alloy No. 9, No. 10 and No.
．． No. 14 has low Cr, Ti, and Fe content, and is insufficient in strength and impact resistance. Also, No. 11, No. 12 and N
o. No. 13 shows results in which the thermal conductivity is low due to too much Cr, Ti, and Fe, respectively. In addition, No. 15 is Cu-
Although it is a Cr alloy, it has low impact resistance.
【００１５】[0015]
【発明の効果】以上説明したように本発明合金は、非常
に良好なプラスチック成形金型用銅合金として高温強度
に優れ、耐衝撃性も優れている。また熱伝導率も高いた
めプラスチック成形の所要時間が大幅に短縮でき生産性
が期待できる効果は大きい。As explained above, the alloy of the present invention has excellent high temperature strength and impact resistance as a very good copper alloy for plastic molds. Furthermore, since it has high thermal conductivity, the time required for plastic molding can be significantly shortened and productivity can be expected to be greatly improved.
Claims (1)
：０．０２〜０．６ｗｔ％，Ｆｅ：０．０５〜１．５ｗ
ｔ％を含有し、副成分としてＡｌ，Ｂｅ，Ｃｏ，Ｈｆ，
Ｍｇ，Ｍｎ，Ｎｉ，Ｓｎ，Ｚｎ，Ｚｒからなる群の１種
または２種以上を０．００１〜２．０ｗｔ％含有し、残
部Ｃｕおよび不可避的不純物からなることを特徴とする
プラスチック成形金型用銅合金。[Claim 1] Cr: 0.05 to 1.0 wt%, Ti
:0.02~0.6wt%, Fe:0.05~1.5w
t%, and contains Al, Be, Co, Hf, as subcomponents.
A plastic molding mold containing 0.001 to 2.0 wt% of one or more of the group consisting of Mg, Mn, Ni, Sn, Zn, and Zr, with the balance consisting of Cu and inevitable impurities. Copper alloy for use.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP41330290A JPH04221030A (en) | 1990-12-21 | 1990-12-21 | Copper alloy for die for plastic molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP41330290A JPH04221030A (en) | 1990-12-21 | 1990-12-21 | Copper alloy for die for plastic molding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04221030A true JPH04221030A (en) | 1992-08-11 |
Family
ID=18521974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP41330290A Pending JPH04221030A (en) | 1990-12-21 | 1990-12-21 | Copper alloy for die for plastic molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04221030A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7510615B2 (en) * | 2001-11-21 | 2009-03-31 | Kme Germany Ag & Co. Kg | Age-hardening copper alloy as material for producing casting molds |
-
1990
- 1990-12-21 JP JP41330290A patent/JPH04221030A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7510615B2 (en) * | 2001-11-21 | 2009-03-31 | Kme Germany Ag & Co. Kg | Age-hardening copper alloy as material for producing casting molds |
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