JPH0422023B2 - - Google Patents

Info

Publication number
JPH0422023B2
JPH0422023B2 JP58241949A JP24194983A JPH0422023B2 JP H0422023 B2 JPH0422023 B2 JP H0422023B2 JP 58241949 A JP58241949 A JP 58241949A JP 24194983 A JP24194983 A JP 24194983A JP H0422023 B2 JPH0422023 B2 JP H0422023B2
Authority
JP
Japan
Prior art keywords
semiconductor chip
heat transfer
bellows
transfer device
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58241949A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60134449A (ja
Inventor
Takatsugu Takenaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58241949A priority Critical patent/JPS60134449A/ja
Publication of JPS60134449A publication Critical patent/JPS60134449A/ja
Publication of JPH0422023B2 publication Critical patent/JPH0422023B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP58241949A 1983-12-23 1983-12-23 伝熱装置 Granted JPS60134449A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58241949A JPS60134449A (ja) 1983-12-23 1983-12-23 伝熱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58241949A JPS60134449A (ja) 1983-12-23 1983-12-23 伝熱装置

Publications (2)

Publication Number Publication Date
JPS60134449A JPS60134449A (ja) 1985-07-17
JPH0422023B2 true JPH0422023B2 (enExample) 1992-04-15

Family

ID=17081963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58241949A Granted JPS60134449A (ja) 1983-12-23 1983-12-23 伝熱装置

Country Status (1)

Country Link
JP (1) JPS60134449A (enExample)

Also Published As

Publication number Publication date
JPS60134449A (ja) 1985-07-17

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