JPH0420235U - - Google Patents
Info
- Publication number
- JPH0420235U JPH0420235U JP1990062518U JP6251890U JPH0420235U JP H0420235 U JPH0420235 U JP H0420235U JP 1990062518 U JP1990062518 U JP 1990062518U JP 6251890 U JP6251890 U JP 6251890U JP H0420235 U JPH0420235 U JP H0420235U
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- bonding pad
- integrated circuit
- substrate
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/50—
-
- H10W72/07551—
-
- H10W72/5363—
-
- H10W72/5434—
-
- H10W72/5524—
-
- H10W72/59—
-
- H10W72/884—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990062518U JPH0420235U (enExample) | 1990-06-12 | 1990-06-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990062518U JPH0420235U (enExample) | 1990-06-12 | 1990-06-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0420235U true JPH0420235U (enExample) | 1992-02-20 |
Family
ID=31591742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990062518U Pending JPH0420235U (enExample) | 1990-06-12 | 1990-06-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0420235U (enExample) |
-
1990
- 1990-06-12 JP JP1990062518U patent/JPH0420235U/ja active Pending
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