JPH0419823Y2 - - Google Patents

Info

Publication number
JPH0419823Y2
JPH0419823Y2 JP1984011912U JP1191284U JPH0419823Y2 JP H0419823 Y2 JPH0419823 Y2 JP H0419823Y2 JP 1984011912 U JP1984011912 U JP 1984011912U JP 1191284 U JP1191284 U JP 1191284U JP H0419823 Y2 JPH0419823 Y2 JP H0419823Y2
Authority
JP
Japan
Prior art keywords
contact
fixed contact
portions
pair
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984011912U
Other languages
Japanese (ja)
Other versions
JPS60124059U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1191284U priority Critical patent/JPS60124059U/en
Publication of JPS60124059U publication Critical patent/JPS60124059U/en
Application granted granted Critical
Publication of JPH0419823Y2 publication Critical patent/JPH0419823Y2/ja
Granted legal-status Critical Current

Links

Description

【考案の詳細な説明】 [産業上の利用分野] 本考案は、電子機器のキーボードなどに用いら
れるスイツチ用の固定接点部を備えた印刷回路板
に関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a printed circuit board equipped with a fixed contact portion for a switch used in a keyboard of an electronic device or the like.

[従来の技術] 計算機の端末装置等のキーボードを有する電子
装置においては、絶縁基板上に、対をなす固定接
点部と該固定接点部につながる配線部とを有する
導電回路を銅箔等の金属箔により形成した印刷回
路板を用い、導電ゴム等からなる可動接点を各対
の固定接点部に接離し得るように支持させてスイ
ツチを構成している。固定接点部を金属箔によつ
て構成するのは、カーボン塗料等のみから形成し
た薄膜状の固定接点部と比べて、金属箔の固定接
点部が機械的強度及び耐久性に優れており、スイ
ツチの導電性を確実に確保できるためである。し
かしながら金属箔は露出しておくと表面が酸化し
て表面抵抗が高くなる。そこで、この種の印刷回
路板で、導電回路の固定接点部の酸化を防ぐため
に該固定接点部にカーボン塗料等からなる接点導
電層を被着したものがある。
[Prior Art] In an electronic device having a keyboard such as a computer terminal device, a conductive circuit having a pair of fixed contact portions and a wiring portion connected to the fixed contact portion is formed on an insulating substrate using metal such as copper foil. A switch is constructed by using a printed circuit board made of foil and supporting movable contacts made of conductive rubber or the like so that they can be brought into contact with and separated from each pair of fixed contact parts. The reason why the fixed contact part is made of metal foil is that the fixed contact part made of metal foil has superior mechanical strength and durability compared to a thin film fixed contact part made only of carbon paint, etc. This is because conductivity can be ensured. However, if the metal foil is exposed, the surface will oxidize and the surface resistance will increase. Therefore, in some printed circuit boards of this type, a contact conductive layer made of carbon paint or the like is coated on the fixed contact portions of the conductive circuit in order to prevent the fixed contact portions from oxidizing.

[考案が解決しようとする課題] しかしながら金属箔からなる固定接点部の端縁
部はエツジ状になつているため、その部分では印
刷の際にカーボン等からなる接点導電層が切れた
り、その厚みが薄くなる問題が生じる。また可動
接点によつて反復して衝撃が加えられると、固定
接点部のエツジ状の端縁部の上の接点導電層の部
分から、接点導電層が欠落する問題も生じ、接点
導電層が欠落すると固定接点部の金属箔部分が露
出して酸化されるという欠点があつた。
[Problem to be solved by the invention] However, since the edge of the fixed contact made of metal foil is edge-shaped, the contact conductive layer made of carbon etc. may be cut during printing in that part, or its thickness may be damaged. The problem arises that the color becomes thinner. In addition, if shocks are repeatedly applied by the movable contact, the contact conductive layer may come off from the part of the contact conductive layer above the edge-like edge of the fixed contact. This resulted in the disadvantage that the metal foil portion of the fixed contact was exposed and oxidized.

本考案の目的は、接点導電層の欠落を抑制して
固定接点部の酸化を防止した印刷回路板を提供す
ることにある。
An object of the present invention is to provide a printed circuit board that suppresses chipping of the contact conductive layer and prevents oxidation of the fixed contact portion.

[課題を解決するための手段] 本考案は、絶縁基板と、絶縁基板上に形成され
た金属箔層からなつていて可動接点によつて短絡
される接点パターンを有する対をなす固定接点部
と該固定接点部につながる配線部とを有する導電
回路を備えた印刷回路板を対象とする。本考案に
おいては、対をなす固定接点部の対向部分間に跨
がつて印刷され且つ一部が前記対向部分の端縁部
のうち少なくとも可動接点と対向する部分に重合
されて重合部を形成する下塗り絶縁層を設ける。
そして下塗り絶縁層の重合部と対をなす固定接点
部とをそれぞれ覆うように導電ペーストが印刷さ
れてなる対をなす接点導電層を設ける。
[Means for Solving the Problems] The present invention comprises an insulating substrate, and a pair of fixed contact portions each having a contact pattern made of a metal foil layer formed on the insulating substrate and short-circuited by a movable contact. The present invention is directed to a printed circuit board having a conductive circuit having a wiring section connected to the fixed contact section. In the present invention, the printing is printed across the opposing portions of the pair of fixed contact portions, and a portion is overlapped with at least the portion facing the movable contact among the edge portions of the opposing portions to form an overlapping portion. Provide an undercoat insulating layer.
Then, a pair of contact conductive layers each having a conductive paste printed thereon is provided so as to cover the overlapping portion of the undercoat insulating layer and the pair of fixed contact portions, respectively.

[作用] 本考案では、金属箔からなる対をなす固定接点
部の対向部分間に一部(重合部)が重なるように
跨がつて下塗り絶縁層を設けることにより固定接
点部の対向部分のエツジの尖鋭度を緩和する。そ
の結果、固定接点部の対向部分のエツジにより接
点導電層を印刷する際に、該接点導電層が薄くな
つたり切れたりするのを防ぐことができる。また
接点導電層の可動接点が接触する部分を金属箔か
らなる固定接点部のエツジ上に直接存在しないよ
うに設けることができるので、該接点導電層の接
着強度を高めることができ、スイツチの反復使用
によつて接点導電層が欠落するのを防ぐことがで
きる利点がある上、接点導電層の欠落により固定
接点部が露出するのを防いで、金属箔からなる固
定接点部が酸化するのを防止できる。
[Function] In the present invention, by providing an undercoat insulating layer that spans the opposing portions of a pair of fixed contact portions made of metal foil so that a portion (the overlapping portion) overlaps, the edges of the opposing portions of the fixed contact portions are reduce the sharpness of As a result, when the contact conductive layer is printed by the edges of the opposing portions of the fixed contact portion, it is possible to prevent the contact conductive layer from becoming thin or torn. In addition, since the part of the contact conductive layer that the movable contact comes into contact with can be provided so as not to be directly on the edge of the fixed contact part made of metal foil, the adhesive strength of the contact conductive layer can be increased, and the repeatability of the switch can be increased. Not only does it have the advantage of preventing the contact conductive layer from being missing due to use, but it also prevents the fixed contact part from being exposed due to the contact conductive layer being missing, and prevents the fixed contact part made of metal foil from oxidizing. It can be prevented.

[実施例] 以下本考案の実施例を図面を参照して詳細に説
明する。
[Embodiments] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

第1図乃至第6図において、1は例えばフエノ
ール樹脂積層板からなる絶縁基板である。2は絶
縁基板1上に形成された銅等の金属箔層で、この
金属箔層2は固定接点部2a,2a、配線部2
b、端子部2cを有する導電回路を構成してい
る。各固定接点部2aは第2図に示すように配線
部2bの端部に可動接点によつて短絡されるC字
状の接点パターンで形成され、対をなす固定接点
部2a,2aはそれぞれの凹部2dが対向するよ
うに配設されている。3は導電回路の固定接点部
2aおよび端子部2c以外の配線部2bを覆うよ
うに絶縁基板1上に形成された上塗り絶縁層であ
り、この上塗り絶縁層3はフエノール樹脂、エポ
キシ樹脂等からなつている。4は対をなす固定接
点部2a,2aの対向する対向部分(凹部2d,
2dが形成されている端縁部分)間に跨がつて印
刷された下塗り絶縁層である。第5図に示した可
動接点Aとの関係で見ると、この下塗り絶縁層4
は、可動接点Aの接触面A1と対向する領域に設
けられる。そして下塗り絶縁層4の端部は固定接
点部2a,2aの対向部分の端縁部に重合されて
重合部を形成している。この下塗り絶縁層4は、
上塗り絶縁層3と同様に、フエノール樹脂やエポ
キシ樹脂等からなつている。
In FIGS. 1 to 6, reference numeral 1 denotes an insulating substrate made of, for example, a phenolic resin laminate. Reference numeral 2 denotes a metal foil layer made of copper or the like formed on the insulating substrate 1.
b, constitutes a conductive circuit having a terminal portion 2c. As shown in FIG. 2, each fixed contact portion 2a is formed with a C-shaped contact pattern short-circuited by a movable contact at the end of the wiring portion 2b, and the fixed contact portions 2a, 2a forming a pair are connected to each other. The recesses 2d are arranged to face each other. Reference numeral 3 denotes a top insulating layer formed on the insulating substrate 1 so as to cover the fixed contact part 2a of the conductive circuit and the wiring part 2b other than the terminal part 2c, and this top insulating layer 3 is made of phenolic resin, epoxy resin, etc. ing. 4 denotes opposing portions (recessed portions 2d,
This is an undercoat insulating layer printed across the edge portion (where 2d is formed). When viewed in relation to the movable contact A shown in FIG.
is provided in a region facing the contact surface A1 of the movable contact A. The end portions of the undercoat insulating layer 4 are overlapped with the end edges of the opposing portions of the fixed contact portions 2a, 2a to form an overlapping portion. This undercoat insulating layer 4 is
Like the top insulating layer 3, it is made of phenol resin, epoxy resin, or the like.

また各固定接点部2aの上を覆うようにカーボ
ン等の導電ペーストからなる接点導電層5が印刷
されている。第4図に示すように各接点導電層5
は、その一部が上塗り絶縁層3の一部および下塗
り絶縁層4の端縁部(重合部)に重なるように設
けられ、また各接点導電層5の下塗り絶縁層5で
覆われれていない固定接点部2aを覆う部分は固
定接点部2aの端縁部を越えて基板1の表面をも
覆うように設けられている。即ち各接点導電層5
は、上塗り絶縁層3と下塗り層4から露出してい
る金属箔の全域を覆うように設けられている。接
点導電層5と各絶縁層3,4および基板1との接
着強度は高いため、接点導電層5の端部が金属箔
層2の上に位置しないように構成すると、接点導
電層5の剥離強度を高くすることができ、スイツ
チの反復使用により接点導電層5が欠落するのを
防止することができる。
Further, a contact conductive layer 5 made of a conductive paste such as carbon is printed so as to cover each fixed contact portion 2a. Each contact conductive layer 5 as shown in FIG.
are provided so that a part thereof overlaps a part of the top insulating layer 3 and the edge part (overlapping part) of the undercoat insulating layer 4, and each contact conductive layer 5 is provided so that it overlaps with a part of the top insulating layer 3 and the edge part (overlapping part) of the undercoat insulating layer 4. The portion covering the contact portion 2a is provided so as to cover the surface of the substrate 1 beyond the edge portion of the fixed contact portion 2a. That is, each contact conductive layer 5
is provided so as to cover the entire area of the metal foil exposed from the top insulating layer 3 and the undercoat layer 4. Since the adhesive strength between the contact conductive layer 5 and each of the insulating layers 3 and 4 and the substrate 1 is high, if the end of the contact conductive layer 5 is not located on the metal foil layer 2, the contact conductive layer 5 may peel off. The strength can be increased, and the contact conductive layer 5 can be prevented from being chipped due to repeated use of the switch.

また上記のように対をなす固定接点部2a,2
aの対向部分間に跨がつて下塗り絶縁層4を設け
て下塗り絶縁層4の重合部の上に接点導電層5を
重ね合せると、下塗り絶縁層4により固定接点部
2a,2aのエツジの尖鋭度を緩和することがで
きるので、固定接点部2aのエツジ部で接点導電
層5に切れが生じるのを防ぐことができる。尚こ
の下塗り絶縁層4による効果を高めるためには、
スイツチを構成する際に固定接点部2aに接離す
るように設けられる可動接点Aの接触面A1を下
塗り絶縁層4が設けられた領域からはみださない
大きさに形成するのが好ましい。
Further, as described above, the fixed contact portions 2a, 2 forming a pair
When an undercoat insulating layer 4 is provided spanning between the opposing portions of a, and a contact conductive layer 5 is overlaid on the overlapping portion of the undercoat insulating layer 4, the undercoat insulating layer 4 makes the edges of the fixed contact portions 2a, 2a sharp. Since the degree of damage can be reduced, it is possible to prevent the contact conductive layer 5 from being cut at the edge portion of the fixed contact portion 2a. In order to enhance the effect of this undercoat insulating layer 4,
When constructing the switch, it is preferable that the contact surface A1 of the movable contact A, which is provided so as to come into contact with and separate from the fixed contact portion 2a, is formed in a size that does not protrude from the area where the undercoat insulating layer 4 is provided.

第7図は本考案の他の実施例を示したもので、
この実施例においては、上記実施例と同様な対を
なす固定接点部2a,2aの対向部分の全域に亘
つて下塗り絶縁層4′が形成され、且つ接点導電
層5′,5′が上塗り絶縁層3の固定接点部2a,
2aに対向する端縁部3aの略全域に亘つて被着
されている。このように構成すると、対をなす固
定接点部2a,2aの対向部分のエツジ部に可動
接点が押圧された場合に、その部分の接点導電層
5′,5′が切断されるのを防止することができ
る。尚この実施例において下塗り絶縁層4′と上
塗り絶縁層3とは連結して構成されている。
FIG. 7 shows another embodiment of the present invention.
In this embodiment, an undercoat insulating layer 4' is formed over the entire opposing portions of fixed contact portions 2a, 2a forming a pair similar to the above embodiment, and contact conductive layers 5', 5' are overcoated insulating layers. Fixed contact part 2a of layer 3,
Approximately the entire area of the edge portion 3a facing the end portion 2a is coated. With this configuration, when the movable contact is pressed against the edge portion of the opposing portion of the pair of fixed contact portions 2a, 2a, the contact conductive layers 5', 5' at that portion are prevented from being cut. be able to. In this embodiment, the undercoat insulating layer 4' and the top insulating layer 3 are connected to each other.

第7図に示す実施例では対向する接点導電層
5′,5′が湿気をおびない下塗り絶縁層4′上に
形成されているの、銀含有導電ペーストで形成さ
れた対をなす接点導電層5′,5′間ではマイグレ
ーシヨンの発生を有効に防止することができる。
In the embodiment shown in FIG. 7, the opposing contact conductive layers 5', 5' are formed on a moisture-proof undercoat insulating layer 4', and the paired contact conductive layers are formed of a silver-containing conductive paste. Migration can be effectively prevented from occurring between 5' and 5'.

[考案の効果] 以上のように本考案によれば、金属箔からなる
対をなす固定接点部の対向部分間に一部が重なる
ように跨がつて下塗り絶縁層を設けることにより
固定接点部の対向部分のエツジの尖鋭度を緩和す
るため、固定接点部の対向部分のエツジにより接
点導電層を印刷する際に、該接点導電層が薄くな
つたり切れたりするのを防ぐことができる利点が
ある。また接点導電層の可動接点が接触する部分
を金属箔からなる固定接点部のエツジ上に直接存
在しないように設けることができるので、該接点
導電層の接着強度を高めることができ、スイツチ
の反復使用によつて接点導電層が欠落するのを防
ぐことができる利点がある上、接点導電層の欠落
により固定接点部が露出するのを防いで、金属箔
からなる固定接点部が酸化するのを防止できる。
[Effects of the invention] As described above, according to the invention, by providing an undercoat insulating layer that partially overlaps the opposing portions of a pair of fixed contact portions made of metal foil, the fixed contact portions can be improved. In order to reduce the sharpness of the edges of the opposing portions, there is an advantage that when printing the contact conductive layer using the edges of the opposing portion of the fixed contact portion, it is possible to prevent the contact conductive layer from becoming thin or being cut. . In addition, since the part of the contact conductive layer that the movable contact comes into contact with can be provided so as not to be directly on the edge of the fixed contact part made of metal foil, the adhesive strength of the contact conductive layer can be increased, and the repeatability of the switch can be increased. Not only does it have the advantage of preventing the contact conductive layer from being missing due to use, but it also prevents the fixed contact part from being exposed due to the contact conductive layer being missing, and prevents the fixed contact part made of metal foil from oxidizing. It can be prevented.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案が適用されている印刷回路板の
斜視図、第2図は金属箔層の固定接点部を示す平
面図、第3図は基板に上塗り絶縁層と下塗り絶縁
が被着された状態を示す斜視図、第4図は基板に
接点導電層が被覆された状態を示す平面図、第5
図は対をなす接点導電層に対向する可動接点と該
接点導電層との対向位置を示す説明図、第6図は
第1図の−線断面図、第7図は本考案の他の
実施例を示す要部平面図である。 1……絶縁基板、2……金属箔属、2a……固
定接点部、2b……配線部、4,4′……下塗り
絶縁部、5,5′……接点導電層。
Fig. 1 is a perspective view of a printed circuit board to which the present invention is applied, Fig. 2 is a plan view showing the fixed contact portion of the metal foil layer, and Fig. 3 is a top insulating layer and an insulating undercoat coated on the board. FIG. 4 is a perspective view showing the state in which the contact conductive layer is coated on the substrate, and FIG.
The figure is an explanatory diagram showing the facing position of a movable contact facing a pair of contact conductive layers and the contact conductive layer, FIG. 6 is a sectional view taken along the line - - of FIG. 1, and FIG. 7 is another embodiment of the present invention. FIG. 3 is a plan view of main parts showing an example. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Metallic foil, 2a... Fixed contact portion, 2b... Wiring portion, 4, 4'... Undercoat insulating portion, 5, 5'... Contact conductive layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板と、前記絶縁基板上に形成された金属
箔層からなつていて可動接点によつて短絡される
接点パターンを有する対をなす固定接点部と該固
定接点部につながる配線部とを有する導電回路を
備えた印刷回路板において、前記対をなす固定接
点部の対向部分間に跨がつて印刷され且つ一部が
前記対向部分の端縁部のうち少なくとも前記可動
接点と対向する部分に重合されて重合部を形成す
る下塗り絶縁層と、前記下塗り絶縁層の前記重合
部と前記対をなす固定接点部とをそれぞれ覆うよ
うに導電ペーストが印刷されてなる対をなす接点
導電層とを具備したことを特徴とする印刷回路
板。
A conductive device comprising an insulating substrate, a pair of fixed contact portions each having a contact pattern formed of a metal foil layer formed on the insulating substrate and short-circuited by a movable contact, and a wiring portion connected to the fixed contact portion. In a printed circuit board equipped with a circuit, the printed circuit board is printed across opposing portions of the pair of fixed contact portions, and a portion thereof overlaps with at least a portion of the edge portion of the opposing portion facing the movable contact portion. an undercoat insulating layer forming an overlapping part, and a pair of contact conductive layers each having a conductive paste printed so as to respectively cover the overlapping part of the undercoat insulating layer and the pair of fixed contact parts. A printed circuit board characterized by:
JP1191284U 1984-01-31 1984-01-31 printed circuit board Granted JPS60124059U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1191284U JPS60124059U (en) 1984-01-31 1984-01-31 printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1191284U JPS60124059U (en) 1984-01-31 1984-01-31 printed circuit board

Publications (2)

Publication Number Publication Date
JPS60124059U JPS60124059U (en) 1985-08-21
JPH0419823Y2 true JPH0419823Y2 (en) 1992-05-06

Family

ID=30494475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1191284U Granted JPS60124059U (en) 1984-01-31 1984-01-31 printed circuit board

Country Status (1)

Country Link
JP (1) JPS60124059U (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59145056U (en) * 1983-03-18 1984-09-28 カシオ計算機株式会社 printed wiring board

Also Published As

Publication number Publication date
JPS60124059U (en) 1985-08-21

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