JPH0639476Y2 - Multilayer printed wiring board - Google Patents
Multilayer printed wiring boardInfo
- Publication number
- JPH0639476Y2 JPH0639476Y2 JP1988132936U JP13293688U JPH0639476Y2 JP H0639476 Y2 JPH0639476 Y2 JP H0639476Y2 JP 1988132936 U JP1988132936 U JP 1988132936U JP 13293688 U JP13293688 U JP 13293688U JP H0639476 Y2 JPH0639476 Y2 JP H0639476Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- multilayer printed
- recognition mark
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は多層印刷配線板に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a multilayer printed wiring board.
近年、電気部品の表面実装化が進み、それらを実装する
多層印刷配線板においても、電気部品実装用のパッドを
有する多層印刷配線板が増加している。In recent years, surface mounting of electric components has progressed, and even in multilayer printed wiring boards for mounting them, the number of multilayer printed wiring boards having pads for mounting electric components is increasing.
第４図及び第５図に示すように、従来、この種の多層印
刷配線板１には、電気部品をロボットで自動実装する際
に、その位置決めを行うための銅箔による一対の認識マ
ーク２が設けられている。As shown in FIG. 4 and FIG. 5, conventionally, a multilayer printed wiring board 1 of this type has a pair of recognition marks 2 made of copper foil for positioning the electric components when they are automatically mounted by a robot. Is provided.
これらの認識マーク２は、電気部品実装後には不要とな
るため、第４図に示すように、部品実装後に切断削除す
る両端の板端部分７に設けられる場合が多い。Since these recognition marks 2 are unnecessary after mounting the electric components, they are often provided on the plate end portions 7 at both ends to be cut and removed after the mounting of the components, as shown in FIG.
この切断削除する板端部分７は、印刷配線板としての電
気的な機能はないため、第６図に示すように、内層に銅
箔部分は設けられておらず、外層面のみに認識マーク２
としての銅箔が設けられていた。Since the board end portion 7 to be cut and removed does not have an electrical function as a printed wiring board, a copper foil portion is not provided on the inner layer and the recognition mark 2 is provided only on the outer layer surface as shown in FIG.
Was provided with a copper foil.
前述した従来の多層印刷配線板は、自動実装用の認識マ
ーク位置に対応する内層に銅箔部分を設けておらず、認
識マークの背景が基材の乳白色となっているため、光学
的にマークを認識する際に、マーク周囲が反射してマー
クを認識しにくいという欠点がある。The conventional multilayer printed wiring board described above does not have a copper foil part in the inner layer corresponding to the position of the recognition mark for automatic mounting, and the background of the recognition mark is the milky white of the substrate, so the optical mark When recognizing a mark, there is a drawback that the mark periphery is reflected and it is difficult to recognize the mark.
本考案の目的は、認識マークを認識し易いようにした多
層印刷配線板を提供することにある。An object of the present invention is to provide a multi-layer printed wiring board in which a recognition mark can be easily recognized.
本考案の構成は、自動実装用の位置決め認識マークを一
表面に備えた多層印刷配線板において、前記一表面と、
この面の反対側の他表面との間の内層の部分で、かつ前
記認識マークに対応した位置に、銅箔を設けたことを特
徴とする。The structure of the present invention is a multilayer printed wiring board having a positioning recognition mark for automatic mounting on one surface,
It is characterized in that a copper foil is provided in a portion of the inner layer between the other surface opposite to this surface and at a position corresponding to the recognition mark.
次に、本考案について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図、及び第２図はそれぞれ本考案の第１の実施例の
多層印刷配線板の平面図、及びA-A′線断面図である。
第１図及び第２図に示すように、本実施例の多層印刷配
線板１は、この表面に設けられた認識マーク２の位置に
対応する内層部分に長方形の内層銅箔３を設けている。
銅箔３と認識マーク２との間に絶縁層が介在している。1 and 2 are a plan view and a sectional view taken along the line AA 'of a multilayer printed wiring board according to a first embodiment of the present invention, respectively.
As shown in FIGS. 1 and 2, the multilayer printed wiring board 1 of this embodiment is provided with a rectangular inner layer copper foil 3 in the inner layer portion corresponding to the position of the recognition mark 2 provided on this surface. .
An insulating layer is interposed between the copper foil 3 and the recognition mark 2.
第３図は本考案の第２の実施例の多層印刷配線板の平面
図である。FIG. 3 is a plan view of a multilayer printed wiring board according to a second embodiment of the present invention.
第３図に示すように、本実施例では、多層印刷配線板１
の表面に設けられた認識マーク２の位置に対応する内層
部分に、認識マーク２と同様形状の三角形の内層銅箔３
を設けている。As shown in FIG. 3, in this embodiment, the multilayer printed wiring board 1 is used.
On the inner layer portion corresponding to the position of the recognition mark 2 provided on the surface of the inner layer copper foil 3 having a triangular shape similar to that of the recognition mark 2.
Is provided.
前記第１、第２の実施例の多層印刷配線板では、認識マ
ーク２の位置に対応する内層部に銅箔部を設けるため、
認識マークの背景が暗色となりマークの認識が容易にな
る。In the multilayer printed wiring boards of the first and second embodiments, since the copper foil portion is provided in the inner layer portion corresponding to the position of the recognition mark 2,
The background of the recognition mark becomes dark and the mark can be easily recognized.
以上説明したように、本考案は、特に自動実装用の認識
マークを有する多層印刷配線板において、認識マーク位
置に対応する内層部に銅箔部を設けることにより、認識
マークの背景が暗色となってマーク周囲の反射がなくな
り、マークの認識を容易にできる効果があるだけでな
く、内装部分に銅箔を設けることにより、表面の信号配
線の配線率を損なうことがないという効果もある。As described above, according to the present invention, particularly in a multilayer printed wiring board having a recognition mark for automatic mounting, the background of the recognition mark becomes dark by providing the copper foil portion in the inner layer portion corresponding to the recognition mark position. As a result, reflection around the mark is eliminated, and the mark can be easily recognized. Further, the provision of the copper foil in the interior portion has an effect that the wiring rate of the signal wiring on the surface is not impaired.
第１図は本考案の第１の実施例の多層印刷配線板の平面
図、第２図は第１図のA-A′線に沿って切断して見た断
面図、第３図は本考案の第２の実施例の多層印刷配線板
の平面図、第４図は従来の多層印刷配線板の平面図、第
５図は第４図の配線板の部分の平面図、第６図は第５図
のB-B′線に沿って切断して見た断面図である。 １……多層印刷配線板、２……認識マーク、３……内層
の銅箔、７……板端部分。FIG. 1 is a plan view of a multilayer printed wiring board according to a first embodiment of the present invention, FIG. 2 is a sectional view taken along the line AA 'of FIG. 1, and FIG. A plan view of a multilayer printed wiring board according to a second embodiment, FIG. 4 is a plan view of a conventional multilayer printed wiring board, FIG. 5 is a plan view of a portion of the wiring board of FIG. 4, and FIG. FIG. 6 is a cross-sectional view taken along the line BB ′ of the figure. 1 ... Multilayer printed wiring board, 2 ... recognition mark, 3 ... inner copper foil, 7 ... board edge.
Claims (1)
に備えた多層印刷配線板において、前記一表面と、この
面の反対側の他表面との間の内層の部分で、かつ前記認
識マークに対応した位置に、銅箔を設けたことを特徴と
する多層印刷配線板。1. A multilayer printed wiring board having a positioning recognition mark for automatic mounting on one surface, wherein the recognition mark is an inner layer portion between the one surface and the other surface opposite to this surface. A multilayer printed wiring board characterized in that a copper foil is provided at a position corresponding to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988132936U JPH0639476Y2 (en) | 1988-10-11 | 1988-10-11 | Multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988132936U JPH0639476Y2 (en) | 1988-10-11 | 1988-10-11 | Multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0254266U JPH0254266U (en) | 1990-04-19 |
| JPH0639476Y2 true JPH0639476Y2 (en) | 1994-10-12 |
Family
ID=31390355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988132936U Expired - Lifetime JPH0639476Y2 (en) | 1988-10-11 | 1988-10-11 | Multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0639476Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018155089A1 (en) * | 2017-02-23 | 2018-08-30 | 株式会社村田製作所 | Electronic component, electronic apparatus, and method for mounting electronic component |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5810387U (en) * | 1981-07-14 | 1983-01-22 | 而至歯科工業株式会社 | fluorescent light holder |
| JPH0716087B2 (en) * | 1988-08-29 | 1995-02-22 | 富士写真光機株式会社 | Double sided printed circuit board |
-
1988
- 1988-10-11 JP JP1988132936U patent/JPH0639476Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0254266U (en) | 1990-04-19 |
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