JPH0419818Y2 - - Google Patents
Info
- Publication number
- JPH0419818Y2 JPH0419818Y2 JP1986066628U JP6662886U JPH0419818Y2 JP H0419818 Y2 JPH0419818 Y2 JP H0419818Y2 JP 1986066628 U JP1986066628 U JP 1986066628U JP 6662886 U JP6662886 U JP 6662886U JP H0419818 Y2 JPH0419818 Y2 JP H0419818Y2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- diode
- diodes
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000001681 protective effect Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986066628U JPH0419818Y2 (zh) | 1986-04-30 | 1986-04-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986066628U JPH0419818Y2 (zh) | 1986-04-30 | 1986-04-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62178551U JPS62178551U (zh) | 1987-11-12 |
JPH0419818Y2 true JPH0419818Y2 (zh) | 1992-05-06 |
Family
ID=30904811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986066628U Expired JPH0419818Y2 (zh) | 1986-04-30 | 1986-04-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0419818Y2 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2694702Y (zh) * | 2004-04-02 | 2005-04-20 | 张哲铭 | 饰灯及饰灯灯串 |
JP2005101660A (ja) * | 2004-12-24 | 2005-04-14 | Sanyo Electric Co Ltd | 発光ダイオードランプ |
KR100968843B1 (ko) * | 2005-12-16 | 2010-07-09 | 서울옵토디바이스주식회사 | 다수의 발광셀이 어레이된 발광소자 |
TWM320181U (en) * | 2007-01-11 | 2007-10-01 | Everlight Electronics Co Ltd | Altenating current light emitting diode device |
US8111001B2 (en) * | 2007-07-17 | 2012-02-07 | Cree, Inc. | LED with integrated constant current driver |
JP2009099627A (ja) * | 2007-10-12 | 2009-05-07 | Panasonic Electric Works Co Ltd | Led照明器具 |
-
1986
- 1986-04-30 JP JP1986066628U patent/JPH0419818Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS62178551U (zh) | 1987-11-12 |
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