JPH04196382A - Printed board provided with reinforcing plate - Google Patents
Printed board provided with reinforcing plateInfo
- Publication number
- JPH04196382A JPH04196382A JP32301090A JP32301090A JPH04196382A JP H04196382 A JPH04196382 A JP H04196382A JP 32301090 A JP32301090 A JP 32301090A JP 32301090 A JP32301090 A JP 32301090A JP H04196382 A JPH04196382 A JP H04196382A
- Authority
- JP
- Japan
- Prior art keywords
- reinforcing plate
- circuit board
- printed circuit
- electronic component
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003014 reinforcing effect Effects 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 7
- 230000001012 protector Effects 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 abstract description 3
- 238000005336 cracking Methods 0.000 description 10
- 238000005452 bending Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子機器を構成するのに用いるプリント基板
の反りや輸送時の割れなどを防止するため補強板を付加
した補強板付プリント基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed circuit board with a reinforcing plate added thereto to prevent the printed circuit board used for constructing electronic equipment from warping or cracking during transportation. It is something.
従来のプリント基板の補強板は、プラスチック製で作ら
れており、熱変形や後作業の生産性を考慮して、電子部
品を挿入し、はんだ付けした後のプリント基板の組立が
完了する直前の工程で、ねし等を利用してプリント基板
の補強をするのが一般的であった。しかし、電子部品挿
入工程から補強板を取付ける工程までの間でのプリント
基板のそりや割れ、さらに挿入された電子部品リートの
曲がり防止には配慮されていなかった。Conventional printed circuit board reinforcing plates are made of plastic, and in consideration of thermal deformation and post-work productivity, they are used just before the printed circuit board assembly is completed after electronic components are inserted and soldered. During the process, it was common to use screws or the like to reinforce printed circuit boards. However, no consideration was given to preventing warpage and cracking of the printed circuit board during the process from the electronic component insertion process to the process of attaching the reinforcing plate, as well as prevention of bending of the inserted electronic component lead.
上記従来技術は、プリント基板の強度やそり、プリント
基板に挿入された電子部品リートの保護の点について配
慮がされておらず、プリント基板のクランクや割れ並び
に電子部品リードの曲がりや接触の問題があった。また
作業性の点について配慮されておらず、補強板の取り付
は作業に多くの工数を必要とするという問題もあった。The above conventional technology does not take into account the strength and warpage of the printed circuit board and the protection of the electronic component leads inserted into the printed circuit board, resulting in problems such as cranking and cracking of the printed circuit board and bending and contact of electronic component leads. there were. There was also the problem that no consideration was given to workability, and that installing the reinforcing plate required a large number of man-hours.
本発明の目的は、プリント基板のクラックや割れ並びに
該基板に挿入された電子部品リードの曲がりや接触を防
止することができ、かつ作業性にも優れた補強板付プリ
ント基板を提供することにある。An object of the present invention is to provide a printed circuit board with a reinforcing plate that can prevent cracks and breaks in the printed circuit board as well as bending and contact of electronic component leads inserted into the circuit board, and has excellent workability. .
上記目的達成のため、本発明では、四角形状をなすプリ
ント基板の辺に沿って適宜の間隔で孔を開けておき、長
尺状の補強板を前記基板の辺に沿って配置すると共に、
該補強板の側縁部に適宜の間隔を置いて形成しておいた
脚部を前記基板の辺に沿って開けられている前記孔に挿
入して突出させ、該突出部が挿入した孔から抜けないよ
うに仮固定した後、その仮固定部をはんだ付けするよう
にした。In order to achieve the above object, in the present invention, holes are opened at appropriate intervals along the sides of a rectangular printed circuit board, and elongated reinforcing plates are arranged along the sides of the board, and
Legs formed at appropriate intervals on the side edges of the reinforcing plate are inserted into the holes drilled along the sides of the substrate to protrude, and the protrusions are inserted into the holes. After temporarily fixing it so that it would not come off, I soldered the temporarily fixed part.
又、プリント基板に挿入されている電子部品リードの曲
がりや接触を防止するために、はんだ付けした仮固定部
の基板面からの突出長を電子部品リートの突出長よりや
や長くしたものである。Furthermore, in order to prevent the electronic component leads inserted into the printed circuit board from bending or contacting each other, the protrusion length of the soldered temporary fixing portion from the board surface is made slightly longer than the protrusion length of the electronic component lead.
プリント基板の補強板は、プリント基板のそりや割れ、
電子部品リートの曲がりを防止する様に動作する。それ
によって、プリント基板は、補強板の剛性により強度が
増すので、そりや割れがなくなる。又、補強板のはんだ
付けした仮固定部は、電子部品リードより剛性があり、
やや長めのため電子部品リードには、直接外力が加わる
ことがなくなるので、電子部品リートの曲がりがなくな
る。The reinforcing plate of the printed circuit board is used to prevent warping and cracking of the printed circuit board.
It operates to prevent the electronic component lead from bending. This increases the strength of the printed circuit board due to the rigidity of the reinforcing plate, eliminating warping and cracking. In addition, the soldered temporary fixing part of the reinforcing plate is more rigid than the electronic component lead.
Since the electronic component lead is somewhat long, no external force is directly applied to the electronic component lead, so the electronic component lead is not bent.
換言すれば、補強板のはんだ付けされた仮固定部として
の脚部に半田付けすることでプリント基板と補強板が一
体となり、半田槽を通した時の熱によるプリント基板の
反りはおさえられる。また、プリント基板端部を補強板
で保持する為、輸送時の振動などによるプリント基板の
変形がなくなりプリント基板割れが防げる。In other words, by soldering the reinforcing plate to the temporarily soldered legs of the reinforcing plate, the printed circuit board and the reinforcing plate are integrated, and the warping of the printed circuit board due to the heat generated when passing through the solder bath can be suppressed. In addition, since the ends of the printed circuit board are held by reinforcing plates, the printed circuit board is not deformed due to vibrations during transportation, and cracking of the printed circuit board can be prevented.
以下、本発明の一実施例を第1図、第2図により説明す
る。第1図は本発明の一実施例を示す斜視図であり、第
2図は第1図のA−A’線断面図である。An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line AA' in FIG.
第1図、第2図を参照する。プリント基板1に予め孔2
を明けておき、その後に補強板3の脚部4を挿入し、電
子部品リート保護部ともなる該脚部4をひねり、プリン
ト基板1を補強板3とで仮固定する。Please refer to FIGS. 1 and 2. Hole 2 is pre-drilled in printed circuit board 1.
After that, the legs 4 of the reinforcing plate 3 are inserted, and the legs 4, which also serve as electronic component REIT protection parts, are twisted to temporarily fix the printed circuit board 1 to the reinforcing plate 3.
そして、電子部品5を挿入してはんだ付けし、補強板3
の脚部4とプリント基板1とをはんだ6で固定する。Then, the electronic components 5 are inserted and soldered, and the reinforcing plate 3
The legs 4 and the printed circuit board 1 are fixed with solder 6.
本実施例によれば、プリント基板1のそりや割れを防止
でき、又、脚部4を電子部品リート7より長くしておく
ことで、該リード7の曲がりや電子部品5の破損を防止
する効果がある。According to this embodiment, warpage and cracking of the printed circuit board 1 can be prevented, and by making the leg portions 4 longer than the electronic component leads 7, bending of the leads 7 and damage to the electronic components 5 can be prevented. effective.
第3図は本発明の他の実施例を示す平面図、第4図はそ
の右側面図、第5図は第4図のA部の拡大図、第6図は
第5図に示したA部の分解図、第7図は第5図のB−B
断面図、である。3 is a plan view showing another embodiment of the present invention, FIG. 4 is a right side view thereof, FIG. 5 is an enlarged view of section A in FIG. 4, and FIG. 6 is an enlarged view of section A shown in FIG. Exploded view of the part, Figure 7 is B-B of Figure 5.
It is a sectional view.
これらの図を参照する。プリント基板11の繊維方向と
直角でプリント基板11の両端部に補強板12を設け、
プリント基板11を保持する保持部12bと傾斜部12
cとの距離tを、プリント基板11の板厚Tより小さく
(シラT−0,2)mm設定した脚部12dをプリント
基板の嵌合穴11aに挿入し、第5図のように矢印方向
に補強板12をスライドし仮固定した後、半田槽を通し
て、脚部12dを半田13付けし固定する。See these figures. Reinforcing plates 12 are provided at both ends of the printed circuit board 11 at right angles to the fiber direction of the printed circuit board 11,
Holding part 12b and inclined part 12 that hold printed circuit board 11
Insert the leg part 12d whose distance t from the printed circuit board 11 is smaller than the thickness T of the printed circuit board 11 (T - 0,2 mm) into the fitting hole 11a of the printed circuit board, and move it in the direction of the arrow as shown in FIG. After sliding the reinforcing plate 12 and temporarily fixing it, the leg part 12d is soldered 13 through a solder tank and fixed.
本実施例によれば、半田槽を通した時のプリント基板の
凸反り防止ができ、また、テレビセットの輸送途中での
プリント基板割れ防止の効果がある。According to this embodiment, it is possible to prevent the printed circuit board from warping when it passes through the solder bath, and it is also effective in preventing the printed circuit board from cracking during transportation of the television set.
本発明によれば、プリント基板は、補強板とその脚部(
電子部品リート保護部)のひねりによって、はぼ水平に
固定できるので、はんだ付は工程の熱変形によるそりや
修正等の後作業時の割れを補強板の剛性で防止できる効
果がある。According to the present invention, the printed circuit board includes a reinforcing plate and its legs (
By twisting the electronic component lead protector), it can be fixed horizontally, so the rigidity of the reinforcing plate can prevent warping due to thermal deformation during soldering and cracking during post-work such as correction.
また、脚部(電子部品リート保護部)は、電子部品リー
トよりやや長いので、電子部品リートの曲がりを防止で
きる効果もある。Further, since the leg portions (electronic component leat protection portions) are slightly longer than the electronic component leat, there is also an effect of preventing the electronic component leat from bending.
更に、プリント基板繊維方向に直角に補強板を設ける為
、半田槽を通す時のプリント基板の反り及び輸送時の割
れを防止でき、作業性も良くコスト安の効果もある。Furthermore, since the reinforcing plate is provided perpendicularly to the fiber direction of the printed circuit board, it is possible to prevent the printed circuit board from warping when passing through a solder bath and from cracking during transportation, resulting in good workability and low cost.
第1図は本発明の一実施例を示す斜視図、第2図は第1
図のA−A’線断面図、第3図は本発明の他の実施例を
示す平面図、第4図はその右側面図、第5図は第4図の
A部の拡大図、第6図は第5図に示したA部の分解図、
第7図は第5図のB−B断面図、である。
1・・・プリント基板、 2・・孔。
3・・・補強板。
4・・脚部(電子部品リード保護部)。
5・・・電子部品、 6・・・はんだ。
7・・・電子部品リート、11・・・プリント基板。
11a・・・嵌合穴、12・・・補強金具。
12a・・・絞り部、 12b・・・保持
部。
12c・・・傾斜部、12d・・・脚部。
13・・・半田。FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG. 2 is a perspective view showing one embodiment of the present invention.
3 is a plan view showing another embodiment of the present invention, FIG. 4 is a right side view thereof, and FIG. 5 is an enlarged view of section A in FIG. Figure 6 is an exploded view of part A shown in Figure 5.
FIG. 7 is a sectional view taken along line BB in FIG. 5. 1...Printed circuit board, 2...hole. 3... Reinforcement plate. 4. Legs (electronic component lead protection part). 5...Electronic parts, 6...Solder. 7...Electronic component REIT, 11...Printed circuit board. 11a... Fitting hole, 12... Reinforcement fitting. 12a... Aperture part, 12b... Holding part. 12c... Slope portion, 12d... Leg portion. 13...Solder.
Claims (1)
隔で孔を開けておき、長尺状の補強板を前記基板の辺に
沿って配置すると共に、該補強板の側縁部に適宜の間隔
を置いて形成しておいた脚部を前記基板の辺に沿って開
けられている前記孔に挿入して突出させ、該突出部が挿
入した孔から抜けないように仮固定した後、その仮固定
部をはんだ付けして成ることを特徴とする補強板付プリ
ント基板。1. Holes are drilled at appropriate intervals along the sides of a rectangular printed circuit board, and a long reinforcing plate is placed along the side of the board, and at appropriate intervals on the side edges of the reinforcing plate. The leg portions formed by placing the base plate are inserted into the holes drilled along the sides of the substrate so that they protrude, and the protruding portions are temporarily fixed so that they do not come out of the inserted holes. A printed circuit board with a reinforcing plate, characterized in that the fixing part is soldered.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2323010A JP2753390B2 (en) | 1990-11-28 | 1990-11-28 | Printed circuit board with reinforcing plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2323010A JP2753390B2 (en) | 1990-11-28 | 1990-11-28 | Printed circuit board with reinforcing plate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04196382A true JPH04196382A (en) | 1992-07-16 |
JP2753390B2 JP2753390B2 (en) | 1998-05-20 |
Family
ID=18150128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2323010A Expired - Lifetime JP2753390B2 (en) | 1990-11-28 | 1990-11-28 | Printed circuit board with reinforcing plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2753390B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100751321B1 (en) * | 2004-12-01 | 2007-08-22 | 삼성에스디아이 주식회사 | Chassis base assembly and plasma display panel assembly using the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6082849U (en) * | 1983-10-12 | 1985-06-08 | 松下電器産業株式会社 | Outer lid attachment device |
JPH01169060U (en) * | 1988-05-17 | 1989-11-29 | ||
JPH02137060U (en) * | 1989-04-14 | 1990-11-15 |
-
1990
- 1990-11-28 JP JP2323010A patent/JP2753390B2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6082849U (en) * | 1983-10-12 | 1985-06-08 | 松下電器産業株式会社 | Outer lid attachment device |
JPH01169060U (en) * | 1988-05-17 | 1989-11-29 | ||
JPH02137060U (en) * | 1989-04-14 | 1990-11-15 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100751321B1 (en) * | 2004-12-01 | 2007-08-22 | 삼성에스디아이 주식회사 | Chassis base assembly and plasma display panel assembly using the same |
Also Published As
Publication number | Publication date |
---|---|
JP2753390B2 (en) | 1998-05-20 |
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