JPH0419573Y2 - - Google Patents

Info

Publication number

JPH0419573Y2

JPH0419573Y2 JP2351486U JP2351486U JPH0419573Y2 JP H0419573 Y2 JPH0419573 Y2 JP H0419573Y2 JP 2351486 U JP2351486 U JP 2351486U JP 2351486 U JP2351486 U JP 2351486U JP H0419573 Y2 JPH0419573 Y2 JP H0419573Y2

Authority

JP

Japan

Prior art keywords

liquid crystal

crystal display

circuit board

display panel

mold

Prior art date

1986-02-20

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• 239000004973 liquid crystal related substance Substances 0.000 claims description 43
• 229920005989 resin Polymers 0.000 claims description 10
• 239000011347 resin Substances 0.000 claims description 10
• 239000002184 metal Substances 0.000 description 18
• 229910052751 metal Inorganic materials 0.000 description 18
• 241000283070 Equus zebra Species 0.000 description 17
• 239000000758 substrate Substances 0.000 description 11
• 125000006850 spacer group Chemical group 0.000 description 8
• 238000004382 potting Methods 0.000 description 7
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
• 239000000463 material Substances 0.000 description 6
• 230000002093 peripheral effect Effects 0.000 description 5
• XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
• 239000000853 adhesive Substances 0.000 description 3
• 230000001070 adhesive effect Effects 0.000 description 3
• 239000011521 glass Substances 0.000 description 3
• 230000006835 compression Effects 0.000 description 2
• 238000007906 compression Methods 0.000 description 2
• 230000000694 effects Effects 0.000 description 2
• 230000012447 hatching Effects 0.000 description 2
• 229910052742 iron Inorganic materials 0.000 description 2
• 239000004809 Teflon Substances 0.000 description 1
• 229920006362 Teflon® Polymers 0.000 description 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 239000000470 constituent Substances 0.000 description 1
• 230000007547 defect Effects 0.000 description 1
• 238000005401 electroluminescence Methods 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• 239000011810 insulating material Substances 0.000 description 1
• 239000011159 matrix material Substances 0.000 description 1
• 238000000465 moulding Methods 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1
• 229920000642 polymer Polymers 0.000 description 1
• 230000001681 protective effect Effects 0.000 description 1
• 229920002050 silicone resin Polymers 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1