JPH0418732A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To manufacture the title semiconductor integrated circuit device in high reliability capable of scattering outer stress in omni-directions to adjacent parts by arranging multiple bump electrodes in concentric circular shape. CONSTITUTION:This hybrid IC is fixed to a heat sink 4 by a screw 7 when assembled into a set. When bumps 2 are arranged on a flip flop IC 1 in concentric circular shape, even if the stress in the screw tightening direction of the heat sink 4 is imposed on the soldered parts of the bumps 2, the stress in the specific direction is evenly imposed on respective bumps 3 since the stress is scattered to adjacent bumps thereby enabling the stress concentration on a specific bump to be avoided.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor integrated circuit device, and particularly to the arrangement of protruding electrodes thereof.

[Conventional technology]

In recent years, high-density packaging technology for electronic circuits has made remarkable progress.
In particular, the focus of increasing the functionality and density of semiconductor application products is
The aim is to increase the scale of monolithic ICs and implement multi-chip implementation. Flip chip ICs having solder protrusion electrodes have been adopted as a means of meeting these high-density packaging requirements.

The objectives of adopting face-down bonding using flip-chip IC as an IC mounting method are: firstly, high-density mounting, secondly, simplifying the assembly process, and thirdly, improving the mechanical strength of the connection part. It will be done. Particularly in the case of hybrid ICs for automobiles, the strength of the connection parts is emphasized due to the requirement for high reliability.

FIG. 2 is a configuration diagram showing the electrode arrangement of a conventionally employed flip-chip IC and an example of its mounting.

FIG. 2 (al) shows the arrangement of protruding electrodes (hereinafter referred to as "humps") 2 of the flip chip ICI, and the bumps 2 are arranged at the outermost periphery where the pattern efficiency is good in terms of IC pattern design.

Fig. 2 fb) is a flip chip ICI shown in (al)
1 is a configuration diagram of a hybrid IC implemented with the following. In the figure, the flip chip ICI is soldered onto a ceramic substrate 3 provided with conductive wiring, and the ceramic substrate 3 is further bonded to a heat sink 4 via an adhesive resin 5 for heat radiation. A case 6 is attached to the heat sink 4. When this hybrid IC is finally assembled into the user's socket, it is tightened by the screws 7, so depending on the flatness and warpage of the heat sink 4, the , stress in the screw tightening direction may be applied inside the hybrid IC.

[Problem to be solved by the invention]

Hybrid IC mounted with conventional flip chip IC
Since the structure is as shown in 2 below, when the stress direction AR due to screw tightening matches the diagonal direction of the mounted flip chip ICI, the soldering of the corner bump 2 of the flip deep ICI near the stress thread 1] However, there was a problem in that stress was concentrated in some parts, leading to wire breakage in actual use.

The present invention has been made in view of the above points, and its purpose is to improve the performance of Frisoftisof.

The purpose of soldering IC corner humps is to disperse the stress concentrated in one part to other humps, eliminate the weakness of conventional products against stress in a specific direction, and provide a highly reliable hybrid IC.

[Failure to solve the problem]

In order to solve this problem, the present invention arranges a plurality of protruding electrodes concentrically.

[Effect]

In the semiconductor integrated circuit device according to the present invention, constant stress distribution can always be achieved against stress from all directions, and reliability can be improved.

〔Example〕

Examples of the present invention will be described below. In FIG. 1, (a+ is a configuration diagram showing the bump arrangement of a flip chip IC as an embodiment of the semiconductor integrated circuit device according to the present invention, and (bl is a flip chip T shown as ta+).
FIG. 1 is a configuration diagram of a hybrid IC equipped with a CI. 1st
In Figure (b), the flip chip IC 1 is soldered onto a ceramic substrate 3 provided with conductive wiring, and the ceramic substrate 3 is further bonded to a heat sink 4 via an adhesive resin 5 for heat radiation. A case 6 is attached to the heat sink 4.

When this hybrid IC is finally assembled into a user's set, it is tightened with screws 7 and used.

As described above, when the bumps 2 are arranged concentrically on the flip chip rC1 as shown by the dotted lines in FIG. Since stress is distributed to adjacent humps, each hump receives an average stress from stress from a specific direction, making it possible to prevent stress from concentrating on a specific hump.

Note that the dotted lines in FIG. 1 are only lines to indicate concentric circles, and such dotted lines are not actually drawn on the flip chip ICI.

〔Effect of the invention〕

As explained above, in the present invention, by arranging a plurality of protruding electrodes concentrically, it is possible to disperse external stress from all directions. This has the effect of providing an integrated circuit device.

[Brief explanation of drawings]

FIG. 1 is a block diagram showing an embodiment of a semiconductor integrated circuit device according to the present invention, and FIG. 2 is a block diagram showing a conventional semiconductor integrated circuit device. 1...Flip chip IC, 2...Bump, 3...
- Ceramic board, 4... Heat sink, 5... Adhesive resin, 6... Case, 7... Screw.

Claims (1)

[Claims] 1. A semiconductor integrated circuit device having a plurality of protruding electrodes, wherein the plurality of protruding electrodes are arranged concentrically.