JPH0418169Y2 - - Google Patents

Info

Publication number

JPH0418169Y2

JPH0418169Y2 JP1986026647U JP2664786U JPH0418169Y2 JP H0418169 Y2 JPH0418169 Y2 JP H0418169Y2 JP 1986026647 U JP1986026647 U JP 1986026647U JP 2664786 U JP2664786 U JP 2664786U JP H0418169 Y2 JPH0418169 Y2 JP H0418169Y2

Authority

JP

Japan

Prior art keywords

door

cover plate

wire harness

door frame

flat conductor

Prior art date

1986-02-27

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• 239000004020 conductor Substances 0.000 claims description 25
• 238000004519 manufacturing process Methods 0.000 description 4
• 238000000034 method Methods 0.000 description 4
• 238000003466 welding Methods 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 238000005452 bending Methods 0.000 description 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 238000009413 insulation Methods 0.000 description 1
• 230000002265 prevention Effects 0.000 description 1
• 238000004080 punching Methods 0.000 description 1
• 238000007789 sealing Methods 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1
• 238000003860 storage Methods 0.000 description 1
• 229920003002 synthetic resin Polymers 0.000 description 1
• 239000000057 synthetic resin Substances 0.000 description 1