JPH04177611A - Production of thin film magnetic head - Google Patents
Production of thin film magnetic headInfo
- Publication number
- JPH04177611A JPH04177611A JP30526290A JP30526290A JPH04177611A JP H04177611 A JPH04177611 A JP H04177611A JP 30526290 A JP30526290 A JP 30526290A JP 30526290 A JP30526290 A JP 30526290A JP H04177611 A JPH04177611 A JP H04177611A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- thin film
- magnetic head
- terminal pad
- film magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000010409 thin film Substances 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims abstract description 5
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 239000010408 film Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 3
- 229910001174 tin-lead alloy Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 abstract description 13
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 8
- 230000001681 protective effect Effects 0.000 abstract description 5
- 238000004544 sputter deposition Methods 0.000 abstract description 5
- 238000002844 melting Methods 0.000 abstract description 4
- 230000008018 melting Effects 0.000 abstract description 4
- 238000000992 sputter etching Methods 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 239000012790 adhesive layer Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Magnetic Heads (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は薄膜磁気ヘッドの製造方法に関し、特に磁気デ
ィスク装置用薄膜磁気ヘッドの端子パッドの製造方法に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a thin film magnetic head, and more particularly to a method of manufacturing a terminal pad of a thin film magnetic head for a magnetic disk device.
従来、この種の薄膜ヘッドの端子パッドの形成は、パタ
ーンめっき法が多く用いられている（例えば、特公昭５
７−３３７０７）。このパターンめっき法は第２図（ａ
）及び同図（ｂ）に示すように、スパッタ法などで形成
されためっき下地３の上にパターニングされたフォトレ
ジストマスクを通して電気めっきすることにより行なわ
れる。Conventionally, pattern plating methods have often been used to form terminal pads for this type of thin film head (for example,
7-33707). This pattern plating method is shown in Figure 2 (a
) and (b), electroplating is carried out by electroplating through a patterned photoresist mask on a plating base 3 formed by sputtering or the like.
上述した従来の端子パッド形成方法には次の欠点がある
。まず、第２図（ａ）に示すように、めっき厚さがフォ
トレジスト厚さより小さい場合は、端子パッド１の側壁
全体がほぼ垂直に形成され、また、第２図（ｂ）に示す
ように、めっき厚さがフォトレジスト厚さより大きい場
合は、端子パッド１ａがオーバーハングを持ち、且つ、
側壁には垂直部分を持つ。そして、端子パッド１を形成
後、電磁変換素子を機械的衝撃などから保護するために
、アルミナ等の絶縁用保護膜（図示せず）がスパッタ法
などで形成される。しかしながら、端子パッドの側壁が
上述したように垂直な部分を持っていると、保護膜が端
子を均一に覆うようにスパッタリングすることは困難で
ある。The conventional terminal pad forming method described above has the following drawbacks. First, as shown in FIG. 2(a), when the plating thickness is smaller than the photoresist thickness, the entire side wall of the terminal pad 1 is formed almost vertically, and as shown in FIG. 2(b), , if the plating thickness is greater than the photoresist thickness, the terminal pad 1a has an overhang, and
The side walls have vertical sections. After forming the terminal pad 1, an insulating protective film (not shown) made of alumina or the like is formed by sputtering or the like in order to protect the electromagnetic transducer from mechanical shock. However, if the side wall of the terminal pad has a vertical portion as described above, it is difficult to sputter the protective film so as to uniformly cover the terminal.
本発明は、基板上に電磁変換素子と、前記電磁変換素子
を外部電気回路に接続する端子とを形成する薄膜磁気ヘ
ッドの製造方法において、前記端子の少なくとも一部を
電気めっき法により金属膜を形成する第１の工程と、前
記端子の前記金属膜を加熱して変形させる第２の工程と
、変形させた前記金属膜をはんだ付け法により前記外部
電気回路に接続する第３の工程とからなっている。また
、前記金属膜が錫鉛合金であってもよい。The present invention provides a method for manufacturing a thin film magnetic head in which an electromagnetic transducer and a terminal for connecting the electromagnetic transducer to an external electric circuit are formed on a substrate, in which at least a portion of the terminal is coated with a metal film by electroplating. a first step of forming the terminal, a second step of heating and deforming the metal film of the terminal, and a third step of connecting the deformed metal film to the external electric circuit by a soldering method. It has become. Moreover, the metal film may be a tin-lead alloy.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ）〜第１図（ｄ）は本発明の一実施例をそれ
ぞれ示す断面図である。従来の製造方法と同様にめっき
下地３をスパッタで１００ＯＡ〜５μｍ程度の厚さで付
着した後、フォトレジストパターン２を形成する。この
とき、めっき下地の材料をＣｕにした場合には、基板（
図示しない）との密着力を増すために、Ｃｒ＋ Ｔ エ
などの密着層５を１００〜５００Ａ程度の厚さで設けて
おくのが好ましい。そして、フォトレジストパターン２
を通して、まず、第１図（ａ）に示すように端子パッド
４を電気めっきで形成する。FIGS. 1(a) to 1(d) are sectional views showing one embodiment of the present invention, respectively. Similar to the conventional manufacturing method, a plating base 3 is deposited by sputtering to a thickness of about 100 OA to 5 μm, and then a photoresist pattern 2 is formed. At this time, if the plating base material is Cu, the substrate (
In order to increase the adhesion with the substrate (not shown), it is preferable to provide an adhesion layer 5 such as Cr+T with a thickness of about 100 to 500A. And photoresist pattern 2
First, terminal pads 4 are formed by electroplating as shown in FIG. 1(a).
更に、第１図（ｂ）に示すように、フォトレジストパタ
ーン２を溶剤などで除去する。次に、基板全体を端子パ
ッド４の融点以上の温度に上げる。この場合、端子パッ
ド４が、例えば、６０％錫−４０％鉛合金めっきで形成
されていると、２００℃まで上げれば十分である。Furthermore, as shown in FIG. 1(b), the photoresist pattern 2 is removed using a solvent or the like. Next, the entire board is raised to a temperature higher than the melting point of the terminal pads 4. In this case, if the terminal pad 4 is formed of, for example, 60% tin-40% lead alloy plating, it is sufficient to raise the temperature to 200°C.
その結果、第１図（ｃ）に示すように、表面張力により
表面の丸い端子パッド４ａができる。As a result, as shown in FIG. 1(c), a terminal pad 4a with a round surface is formed due to surface tension.
ただし、このとき、錫鉛合金めっきの膜厚が、第１図（
ｂ）に示す端子パッド４の底面の大きさに比べて十分小
さくないと、端子パッド４ａは半球状に盛り上がって垂
直部分を持ってしまうので、５０μｍ程度の高さの端子
を得るには端子パッド４の底面の長さは短い箇所でも１
５０μｍ程度以上が必要となる。However, at this time, the film thickness of the tin-lead alloy plating is
If the terminal pad 4a is not sufficiently small compared to the size of the bottom surface of the terminal pad 4 shown in b), the terminal pad 4a will swell into a hemispherical shape and have a vertical portion. The length of the base of 4 is 1 even at short points.
A thickness of about 50 μm or more is required.
次に、イオンミリングにより、第１図（ｄ）に示すよう
に、めっき下地３及び、密着層５を除去して端子パッド
４ａが完成する。なお、端子パッド４ａはめっき下地３
及び密着層５を介して下部の導体パターン（図示せず）
に電気的に接続される。Next, the plating base 3 and the adhesive layer 5 are removed by ion milling to complete the terminal pad 4a, as shown in FIG. 1(d). Note that the terminal pad 4a is attached to the plating base 3.
and a lower conductor pattern (not shown) via the adhesive layer 5.
electrically connected to.
端子形成後、従来例と同様に、アルミナの絶縁用保護膜
（図示せず）をスパッタ法で形成し、更に、ラッピング
を行って端子パッドの一部を露出させ、外部電気回路と
ハンダ付けにより接続可能な端子が形成される。After forming the terminals, as in the conventional example, an alumina insulating protective film (not shown) is formed by sputtering, and the terminal pads are partially exposed by lapping and connected to external electrical circuits by soldering. A connectable terminal is formed.
以上説明したように本発明は、ハンダめっきした端子を
融点以上の温度に加熱することにより、端子の側壁が垂
直に形成されるのを防ぎ、保護膜が端子を均一に覆うよ
うにスパッタリングすることができる。As explained above, the present invention prevents the side walls of the terminal from forming vertically by heating the solder-plated terminal to a temperature above the melting point, and sputters the terminal so that a protective film uniformly covers the terminal. I can do it.
第１図（ａ）〜第１図（ｄ）は本発明の一実施例をそれ
ぞれ示す断面図、第２図（ａ）及び同図（ｂ）は従来の
端子パッドの形状をそれぞれ示す断面図である。
１、ｌａ、４，４ａ・・・端子パッド、２・・・フォト
レジストパターン、３・・・めっき下地、５・・・密着
層。FIGS. 1(a) to 1(d) are cross-sectional views showing an embodiment of the present invention, and FIGS. 2(a) and 1(b) are cross-sectional views showing the shape of a conventional terminal pad, respectively. It is. 1, la, 4, 4a...terminal pad, 2...photoresist pattern, 3...plating base, 5...adhesion layer.
Claims (1)
電気回路に接続する端子とを形成する薄膜磁気ヘッドの
製造方法において、前記端子の少なくとも一部を電気め
っき法により金属膜を形成する第１の工程と、前記端子
の前記金属膜を加熱して変形させる第２の工程と、変形
させた前記金属膜をはんだ付け法により前記外部電気回
路に接続する第３の工程とからなることを特徴とする薄
膜磁気ヘッドの製造方法。 ２、前記金属膜が錫鉛合金であることを特徴とする請求
項１記載の薄膜磁気ヘッドの製造方法。[Claims] 1. A method for manufacturing a thin film magnetic head in which an electromagnetic transducer and a terminal for connecting the electromagnetic transducer to an external electric circuit are formed on a substrate, in which at least a portion of the terminal is formed by electroplating. a second step of heating and deforming the metal film of the terminal; and a third step of connecting the deformed metal film to the external electric circuit by a soldering method. A method of manufacturing a thin film magnetic head, comprising the steps of: 2. The method of manufacturing a thin film magnetic head according to claim 1, wherein the metal film is a tin-lead alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30526290A JPH04177611A (en) | 1990-11-09 | 1990-11-09 | Production of thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30526290A JPH04177611A (en) | 1990-11-09 | 1990-11-09 | Production of thin film magnetic head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04177611A true JPH04177611A (en) | 1992-06-24 |
Family
ID=17942985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30526290A Pending JPH04177611A (en) | 1990-11-09 | 1990-11-09 | Production of thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04177611A (en) |
-
1990
- 1990-11-09 JP JP30526290A patent/JPH04177611A/en active Pending
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