JPS602060A - Manufacture of laminated flat coil - Google Patents

Abstract

PURPOSE:To facilitate the manufacture of a laminated flat coil by laminating an electrode metal layer on an insulating substrate, forming a mask pattern with a resist thereon, plating the electrode metal as an electrode, and then removing the mask pattern and the metal layer. CONSTITUTION:In order to improve the bondability of an insulating substrate 11 such as SiO2, an electrode metal layer 12 is deposited, for example, with Cr, and an electrode metal layer 13 is deposited, for example, with Cu thereon. Then, the desired coil pattern is formed thereon with the resist 14 as a mask, a conductor layer 15 is formed on the portion which is not masked by the resist 14 by a plating method, a protective layer 16 is formed, and the resist of the portion which is not masked with the resist 14 and the layers 12, 13 under the resist are removed. In this manner, a thin and strong flat coil can be manufactured. Holes are opened at the substrate 11, the coils provided on both side surfaces are connected, and the inductance can be further increased.

Description

[Detailed Description of the Invention] This invention relates to a planar coil, for example, a digital audio
It relates to the manufacture of moving coils for two-axis disk actuators, planar motor coil substrates for artificial satellites, etc.

Conventional planar coils are made by winding a conductive wire (1) into a cylindrical shape through a bobbin and then flattening it, as shown in Figure 1, or by using copper for electric circuits as shown in Figure 2. There was one in which a conductor pattern was formed using copper foil on nine surfaces using a foil-covered printed circuit board. In the figure, (2) is copper foil, (3
) is an epoxy layer, and a copper foil (2) is bonded to the surface of the epoxy layer (3). Such a planar coil is required to have a thin coil thickness and a finer conductor pattern, but the planar coil shown in FIG. 1 has a limit to its planarization. In addition, in the planar coil shown in Fig. 2,
As the conductor pattern becomes finer, the adhesive force between the epoxy layer (3) and the copper foil (2) decreases in proportion, causing the copper foil (2) to peel off. Generally, a pattern width of 80 microns or less is not practical. In addition, if the copper foil (2) is made thicker, side edges will occur, causing problems in pattern miniaturization.On the other hand, if the copper foil (2) is made thinner, the electrical resistance will increase, resulting in inferior heat resistance and performance as a planar coil. There was a drawback.

This invention was made in order to eliminate the drawbacks of the conventional ones as described above, and includes a step of laminating an electrode metal layer on an insulating substrate, a step of forming a mask pattern with a resist on this electrode metal layer, and a step of forming a mask pattern with a resist on the electrode metal layer. A step of forming a conductor pattern made of a conductive metal layer on the uncovered electrode metal layer of the mask pattern by a plating method using the electrode metal layer as an electrode.

The present invention aims to provide a method for manufacturing a laminated planar coil that has a fine and precise pattern and allows the thickness of the conductor to be arbitrarily selected by performing a step of removing the resist and the electrode metal layer at the portion where the resist contacts. It is something to do.

In order to improve the adhesion with the insulating substrate αB, a first electrode metal layer θ29, for example, Or, is laminated on the surface of the substrate by a vapor deposition method or the like. Next 9. On this first electrode metal layer α2, a second electrode metal layer 03 is provided to improve conductivity.
1. For example, Ou is laminated by a vapor deposition method. Thereafter, a mask pattern of an arbitrary conductor pattern is formed on the second electrode metal layer aJ using a resist α4 using, for example, a photolithography method or a printing method. Next, as shown in FIG.
3, a 1st degree second electrode metal layer α2. A conductive metal layer 9, for example, a conductor layer Q9, is laminated by plating using the α edge as an electrode.

Furthermore, a protective metal layer αe is laminated on the upper layer of the conductor layer (15) to prevent surface oxidation of the conductor layer a9.Next, resist 0
Dissolve the second mask pattern, and then dissolve the first mask pattern in the area where the resist came into contact. Second electrode metal layer Q3.

By removing the conductor pattern by, for example, partial etching, and making adjacent metal patterns electrically independent, it becomes possible to form fine pattern widths as shown in Figure 5, without peeling (and with precision conductor patterns). A laminated planar coil having the following characteristics is obtained.Also, the thickness of the conductor layer a9 is also determined.

It can be arbitrarily selected by controlling the thickness of the mask pattern of resist 04, and a uniform conductor layer α9 is laminated by a plating method using the electrode metal layer (16, Q3 as an electrode). Regarding α heating, it will be possible to select the material depending on the purpose and use of the planar coil.In addition, although the processing process is complicated, it will be possible to obtain a large number of laminated planar coils at the same time, allowing mass production. suitable for

In the above embodiment, the first and second electrode metal layers α and α are laminated as the electrode metal layer, but depending on the material of the insulating substrate αD, a single metal may be used as the electrode metal layer. good.

In addition, the protective metal layer a0 has the effect of protecting the surface of the conductor layer α90 during partial etching when removing the electrode metal layers α3, (I3), but it is also possible to remove the electrode metal layers (I3.α) using other methods. As another example, a through hole is first formed on the insulating substrate Qυ by a physical or chemical processing method, and then similar or independent conductor patterns are laminated on both sides of the insulating substrate αυ. By connecting the conductor patterns on nine sides, a laminated planar coil that can be used more widely can be obtained.

As described above, according to the present invention, there are a step of laminating an electrode metal layer on an insulating substrate, and a step of forming a mask pattern with a resist on the electrode metal layer.

forming a conductor pattern made of a conductive metal layer on the uncovered electrode metal layer of the mask pattern by a plating method using the electrode metal layer as an electrode, and the electrode metal layer in a portion where the resist contacts with the resist; From K.

It is possible to form a highly precise conductor pattern on a substrate with good adhesion, and it has the effect of providing a method for manufacturing a laminated planar coil with excellent heat resistance and electrical resistance.

FIG. 2 is a cross-sectional view showing a planar coil made from a conventional printed circuit board, and FIGS. 3 to 5 are cross-sectional views showing the manufacturing process of an embodiment of the present invention. The figure shows a cross-sectional view of a resist mask pattern laminated on an electrode metal layer, Figure 4 is a cross-sectional view of a conductive metal layer and a protective metal layer laminated, and Figure 5 is a cross-sectional view of a manufactured laminated planar coil. It is.

In the figure, aυ...insulating substrate, C2, C1S...
- Electrode metal layer, (14)... Resist mask pattern, C9... Conductive metal layer, tte... Protective metal layer.

In addition, in FIG. 9, the same reference numerals indicate the same or corresponding parts.

Agent Masuo Oiwa Figure 1 Route 2 map

Claims (3)

[Claims] (1) Step of laminating an electrode metal layer on an insulating substrate. A step of forming a mask pattern with a resist on this electrode metal layer, and a step of forming a conductor pattern made of a conductive metal layer on the uncoated electrode metal layer of the mask pattern by a plating method using the electrode metal layer as an electrode. , and a method for manufacturing a laminated planar coil, which includes a step of removing the resist and the electrode metal layer at the portion where the resist contacts. (2) After the step of forming a conductor pattern made of a conductive metal layer, a step of laminating a protective metal layer on the conductive metal layer is performed, and then the resist and the electrode metal layer are removed at the portions where this resist is in contact. A method for manufacturing a laminated planar coil according to claim 1, which comprises the step of: (3) A method for manufacturing a laminated planar coil according to claim 1 or 2, which comprises providing a through hole in an insulating substrate and then laminating electrode metal layers on both sides of the insulating substrate. .