JPH03283378A - Electrical connecting member and manufacture thereof - Google Patents
Electrical connecting member and manufacture thereofInfo
- Publication number
- JPH03283378A JPH03283378A JP8541990A JP8541990A JPH03283378A JP H03283378 A JPH03283378 A JP H03283378A JP 8541990 A JP8541990 A JP 8541990A JP 8541990 A JP8541990 A JP 8541990A JP H03283378 A JPH03283378 A JP H03283378A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- conductive material
- holder
- electrical connection
- connection member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000004020 conductor Substances 0.000 claims abstract description 45
- 238000000034 method Methods 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 9
- 239000012777 electrically insulating material Substances 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 32
- 239000010931 gold Substances 0.000 abstract description 21
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 18
- 229910052737 gold Inorganic materials 0.000 abstract description 18
- 229910052759 nickel Inorganic materials 0.000 abstract description 15
- 229920001721 polyimide Polymers 0.000 description 16
- 239000009719 polyimide resin Substances 0.000 description 16
- 239000010949 copper Substances 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000002788 crimping Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 101100348017 Drosophila melanogaster Nazo gene Proteins 0.000 description 1
- 229910001455 Ni+ Inorganic materials 0.000 description 1
- -1 Ta1ls Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Wire Bonding (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電気回路部品同士を電気的に接続する際に用
いられる電気的接続部材及びその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electrical connection member used for electrically connecting electrical circuit components to each other, and a method for manufacturing the same.
電気回路部品同士を電気的に接続する方法としては、ワ
イヤボンディング方法、TAB(Tape Auto−
sated Bonding)法等が従来より知られて
いる。ところがこれらの方法にあっては、両電気回路部
品間の接続点数の増加に対応できない、コスト高である
等の難点があった。このような難点を解決すべく、絶縁
性の保持体中に複数の導電部材を互いに絶縁して備えた
構成をなす電気的接続部材を用いて、電気回路部品同士
を電気的に接続することが公知である(特開昭63−2
22437号公報、特開昭63−224235号公報等
)。Wire bonding method, TAB (Tape Auto-
BACKGROUND ART Conventionally, methods such as sated bonding (sated bonding) and the like have been known. However, these methods have drawbacks such as being unable to cope with an increase in the number of connection points between both electric circuit components and being costly. In order to solve these difficulties, it is possible to electrically connect electrical circuit components to each other using an electrical connection member that has a structure in which a plurality of conductive members are insulated from each other in an insulating holder. It is publicly known (Japanese Unexamined Patent Publication No. 63-2
22437, JP-A-63-224235, etc.).
第4図は、このような電気的接続部材及びこれを用いた
電気回路部品間の電気的接続を示す模式図であり、図中
31は電気的接続部材、32.33は接続すべき電気回
路部品を示す。電気的接続部材31は、金属または合金
からなる複数の導電部材34を、夫々の導電部材34同
士を、電気的に絶縁して電気的絶縁材料からなる保持体
35中に備えて構成されており、導電部材34の一端部
38を一方の電気回路部品32側に突出させ、導電部材
34の他端部39を他方の電気回路部品33側に突出さ
せている(第4図(a))。そして、一方の電気回路部
品32の接続部36に導電部材34の突出する一端部3
8を熱圧着、圧着等により変形させて接合させ、他方の
電気回路部品33の接続部37に導電部材34の突出す
る他端部39を熱圧着、圧着等により変形させて接合さ
せる(第4図(b))。このようにして電気回路部品3
2゜33の対応する接続部36.37同士を接続する。FIG. 4 is a schematic diagram showing such an electrical connection member and the electrical connection between electrical circuit components using the same. In the figure, 31 is an electrical connection member, and 32 and 33 are electrical circuits to be connected. Parts shown. The electrical connection member 31 includes a plurality of conductive members 34 made of metal or alloy, each of which is electrically insulated from each other, and provided in a holder 35 made of an electrically insulating material. , one end 38 of the conductive member 34 protrudes toward one electric circuit component 32, and the other end 39 of the conductive member 34 protrudes toward the other electric circuit component 33 (FIG. 4(a)). One end portion 3 of the conductive member 34 protrudes from the connection portion 36 of one electric circuit component 32.
8 is deformed and joined by thermocompression bonding, crimping, etc., and the protruding other end 39 of the conductive member 34 is deformed and joined by thermocompression bonding, crimping, etc. to the connection portion 37 of the other electric circuit component 33 (fourth Figure (b)). In this way, the electric circuit component 3
Connect the corresponding connecting portions 36 and 37 of 2°33.
このような電気的接続部材においては、以下に示すよう
な利点がある。Such an electrical connection member has the following advantages.
■ 導電部材の大きさを微細にすることにより、電気回
路部品の接続部を小型化し、またそのため接続点数を増
加させることができ、よって電気回路部品同士のより高
密度な接続が可能である。(2) By reducing the size of the conductive member, it is possible to miniaturize the connecting parts of electrical circuit components and increase the number of connection points, thereby enabling higher-density connections between electrical circuit components.
■ 厚みが異なる電気回路部品であっても、電気的接続
部材の厚みを変更することにより電気回路部品の高さを
常に一定にすることが可能となり、多層接続が容易に行
え、より高密度な実装が可能である。■ Even if electrical circuit components have different thicknesses, by changing the thickness of the electrical connection member, it is possible to always keep the height of the electrical circuit components constant, making multilayer connections easier and creating higher-density connections. Implementation is possible.
■ 電気回路部品の接続部と接続される導電部材の突出
高さを高くすることにより、電気回路部品の接続部が表
面から落ち込んだものであっても安定した接続を行うこ
とが可能となり、複雑な形状をなす電気回路部品同士で
あっても容易に接続することが可能である。■ By increasing the protruding height of the conductive member connected to the connection part of the electric circuit component, it is possible to make a stable connection even if the connection part of the electric circuit component is dropped from the surface, and it is possible to avoid complicated connections. Even electrical circuit components having different shapes can be easily connected to each other.
■ 電気回路部品から発生する熱が電気的接続部材の保
持体を通して放熱されるため熱による電気特性変動は極
めて小さい。また放熱特性が優れているため熱疲労の影
響が小さく信転性も高い。■ Heat generated from electrical circuit components is radiated through the holder of the electrical connection member, so changes in electrical characteristics due to heat are extremely small. In addition, since it has excellent heat dissipation characteristics, the effect of thermal fatigue is small and reliability is high.
■ 電気回路部品同士の接続における接続長が短くなる
ので、インピーダンスを低減できて電気回路部品の高速
化を図ることが可能である。- Since the length of connection between electrical circuit components is shortened, impedance can be reduced and it is possible to increase the speed of electrical circuit components.
そして、このような電気的接続部材の製造方法としては
、特願昭63−133401号に提案されたものがある
。以下、この製造方法についてその工程を模式的に示す
第5図に基づき簡単に説明する。A method of manufacturing such an electrical connection member is proposed in Japanese Patent Application No. 133401/1983. Hereinafter, this manufacturing method will be briefly explained based on FIG. 5, which schematically shows the steps.
まず、銅板等の金属シートからなる基体51を準備しく
第5図(al)、この基体51上にスピンコータにより
ネガ型感光性樹脂52を塗布して、100℃前後の温度
にてプリベイクを行う(第5図(b))。所定パターン
をなしたフォトマスク(図示せず)を介して光を感光性
樹脂52に照射した(露光した)後、現像を行う。露光
された部分には感光性樹脂52が残存し、露光されない
部分は現像処理により感光性樹脂52が除去されて複数
の穴53が形成される(第5図(C))。200〜40
0℃まで温度を−ヒげて感光性樹脂52の硬化を行った
後、エツチング液中に基体51を浸漬させてエツチング
を行い、穴53に連通ずる凹部54を基体51に形成す
る(第5図(d))。First, a substrate 51 made of a metal sheet such as a copper plate is prepared (FIG. 5(a)), a negative photosensitive resin 52 is applied onto the substrate 51 using a spin coater, and prebaked at a temperature of about 100° C. Figure 5(b)). After the photosensitive resin 52 is irradiated (exposed) with light through a photomask (not shown) having a predetermined pattern, development is performed. The photosensitive resin 52 remains in the exposed portions, and the photosensitive resin 52 is removed in the unexposed portions by development processing to form a plurality of holes 53 (FIG. 5(C)). 200-40
After curing the photosensitive resin 52 by lowering the temperature to 0° C., the substrate 51 is immersed in an etching solution to perform etching to form a recess 54 in the substrate 51 that communicates with the hole 53 (fifth Figure (d)).
次いで、基体51を共通電極として金メツキを施して、
穴53.凹部54に金55を充填し、バンプが形成され
るまで金メツキを続ける(第5図(e))。最後に基体
51をエツチングにより除去して、電気的接続部材31
を製造する(第5図(「))。Next, gold plating is applied using the base 51 as a common electrode,
Hole 53. The recess 54 is filled with gold 55, and gold plating is continued until a bump is formed (FIG. 5(e)). Finally, the base 51 is removed by etching, and the electrical connection member 31 is removed.
(Figure 5 (')).
このようにして製造される電気的接続部材31にあって
は、金55が導電部材34を構成し、感光性樹脂52が
保持体35を構成する。導電部材34は、保持体35内
に埋設されている部分34a(以下柱状部34aという
)と保持体35の両面から突出している部分34b(第
4図における端部3B、 39、以下バンプ部34bと
いう)とから構成されている。なお電気的接続部材31
における各部分の寸法は、保持体35(感光性樹脂52
)の厚さを約10μm、導電部材34(柱状部34a)
の直径を約15μm、ピッチを約40μmとし、導電部
材34の突出量を表裏とも数μm程度とする。In the electrical connection member 31 manufactured in this way, the gold 55 constitutes the conductive member 34 and the photosensitive resin 52 constitutes the holder 35. The conductive member 34 includes a portion 34a buried in the holder 35 (hereinafter referred to as columnar portion 34a) and a portion 34b protruding from both sides of the holder 35 (end portions 3B and 39 in FIG. 4, hereinafter referred to as bump portion 34b). ). Note that the electrical connection member 31
The dimensions of each part in the holder 35 (photosensitive resin 52
) has a thickness of approximately 10 μm, and the conductive member 34 (column portion 34a)
The diameter of the conductive member 34 is approximately 15 μm, the pitch is approximately 40 μm, and the amount of protrusion of the conductive member 34 is approximately several μm on both the front and back sides.
ところで、このような電気的接続部材の導電部材を電気
回路部品の接続部に熱圧着、圧着により接合させる際に
、柱状部34aとバンプ部34bの両方が変形するため
バンプ部34bを変形させる余分な力が必要となる。従
って、バンプ部34bを変形させて第4図に示すような
電気回路部品の接続部への導電部材の接合を行うために
は、通常の熱圧着、圧着の2〜10倍の加圧が必要であ
る。このように従来の電気的接続部材では、高荷重を印
加して接合を行わなければならないという難点が残って
おり、更なる改良の余地があった。By the way, when the conductive member of such an electrical connection member is joined to the connection part of the electric circuit component by thermocompression bonding or pressure bonding, both the columnar part 34a and the bump part 34b are deformed, so there is an extra charge to deform the bump part 34b. A great deal of force is required. Therefore, in order to deform the bump part 34b and join the conductive member to the connection part of the electric circuit component as shown in FIG. It is. As described above, the conventional electrical connection members still have the disadvantage that they must be joined by applying a high load, and there is still room for further improvement.
本発明はかかる事情に鑑みてなされたものであり、導電
部材の柱状部とバンプ部とにおいて構成する導電材料を
異ならせ、柱状部を構成する導電材料はバンプ部を構成
する導電材料より硬度を高(しておくことにより、熱圧
着、圧着の際に柱状部はできるだけ変形を少なくし、低
荷重を印加しても電気回路部品の接続部への導電部材の
接合を容易に行なえる電気的接続部材、及びその製造方
法を提供することを目的とする。The present invention has been made in view of the above circumstances, and the conductive materials used in the columnar part and the bump part of the conductive member are different, and the conductive material making up the columnar part has a harder hardness than the conductive material making up the bump part. By keeping the columnar parts as high as possible during thermocompression bonding and crimping, electrical An object of the present invention is to provide a connecting member and a method for manufacturing the same.
本発明に係る電気的接続部材は、電気的絶縁材からなる
保持体と、該保持体中に互いに絶縁状態にて備えられた
複数の導電部材とを有し、前記各導電部材の両端部が前
記保持体の両面において突出している電気的接続部材に
おいて、前記各導電部材は、前記保持体の両面から突出
している1種または2種以上の第1の導電材料と、第1
の導電材料とは異なり前記保持体の少なくとも一部分に
埋設されている1種または2種以上の第2の導電材料と
から構成されており、第2の導電材料が第1の導電材料
より硬度が高いことを特徴とする。An electrical connection member according to the present invention includes a holder made of an electrically insulating material, and a plurality of conductive members provided in the holder in an insulated state, wherein both ends of each of the conductive members are In the electrical connection member protruding from both sides of the holder, each of the conductive members includes one or more first conductive materials protruding from both sides of the holder;
Unlike the conductive material, the holding body is composed of one or more second conductive materials embedded in at least a portion of the holding body, and the second conductive material has a harder hardness than the first conductive material. characterized by high
本発明に係る電気的接続部材の製造方法は、電気的絶縁
材からなる保持体と、該保持体中に互いに絶縁状態にて
備えられた複数の導電部材とを有し、前記各導電部材の
両端部が前記保持体の両面において突出している電気的
接続部材を製造する方法において、前記保持体となる絶
縁層を基体上に設ける工程と、該絶縁層をパターン除去
して複数の穴を形成し、前記基体を露出させる工程と、
露出された前記基体の一部をエツチング除去する工程と
、形成した穴にめっきにより導電材料を前記絶縁層の両
面から突出させて充填し、前記導電部材を形成する工程
と、残存する前記基体を除去する工程とを有し、前記導
電材料を充填して導電部材を形成する工程は、第1の導
電材料を充填する過程、該第1の導電材料より硬度が高
くて別な種類の第2の導電材料を充填する過程、及び前
記第1の導電材料を充填して前記導電部材・を形成する
過程を有することを特徴とする。A method for manufacturing an electrical connection member according to the present invention includes a holder made of an electrically insulating material, and a plurality of conductive members provided in the holder in an insulated state, each of the conductive members A method for manufacturing an electrical connection member in which both ends protrude from both sides of the holder, including the steps of providing an insulating layer that becomes the holder on a base, and removing a pattern from the insulating layer to form a plurality of holes. and exposing the substrate;
a step of etching away a portion of the exposed base; a step of filling the formed hole with a conductive material by plating so as to protrude from both sides of the insulating layer to form the conductive member; and a step of removing the remaining base. The step of filling the conductive material to form the conductive member includes the step of filling the first conductive material, and the step of filling the conductive material with the conductive material, and filling the conductive material with the conductive material. and a step of filling the first conductive material to form the conductive member.
本発明の電気的接続部材にあっては、その各導電部材に
おいて、バンプ部よりも柱状部の方が硬度が高い。この
ような導電部材を電気回路部品の接続部に、熱圧着、圧
着により接合させる場合に、バンプ部の変形が柱状部の
変形より大となる。従って、この場合に印加すべき荷重
は低荷重で良い。In the electrical connection member of the present invention, in each conductive member, the columnar portion has higher hardness than the bump portion. When such a conductive member is bonded to a connecting portion of an electric circuit component by thermocompression bonding or pressure bonding, the deformation of the bump portion is greater than the deformation of the columnar portion. Therefore, a low load may be applied in this case.
更に保持体に加わる力が少なくなり、保持体の損傷が軽
減される。Furthermore, less force is applied to the holder, reducing damage to the holder.
本発明の電気的接続部材の製造方法にあっては、導電部
材となる導電材料をめっきにて充填する際に、より硬度
が高い第2の導電材料を充填して柱状部を形成し、より
硬度が低い第1の導電材料を充填してバンプ部を形成す
る。そうすると、バンプ部に比べて柱状部の硬度が高い
導電部材を備えた電気的接続部材が製造される。In the method for manufacturing an electrical connection member of the present invention, when filling a conductive material to become a conductive member by plating, a second conductive material having higher hardness is filled to form a columnar part, and A bump portion is formed by filling a first conductive material with low hardness. In this way, an electrical connection member including a conductive member in which the columnar portion is harder than the bump portion is manufactured.
以下、本発明をその実施例を示す図面に基づいて具体的
に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below based on drawings showing embodiments thereof.
第1図は本発明に係る電気的接続部材Iの断面図である
。電気的接続部材1は、導電材料からなる複数の導電部
材2と、夫々の導電部材2同士が電気的絶縁状態になる
ように導電部材2を備えた例えばポリイミド樹脂からな
る保持体3とから構成されている。各導電部材2は、そ
の両端部が保持体30両面から突出しており、保持体3
内に埋設された柱状部2aと、保持体3から突出した2
つのバンプ部2b、 2bとからなる。導電部材2を構
成する柱状部2aとバンプ部2bとではその使用されて
いる導電材料が異なっており、柱状部2aはニッケル(
Ni)からなり、バンプ部2b、 2bはNiより硬度
が低い金(Au)からなる。なお、電気的接続部材1に
おける各部分の寸法は、従来のものと略同様であって、
保持体3の厚さが約10μm、導電部材2(柱状部2a
)の直径が約15μm、導電部材2の形成ピッチが約4
0ttm、導電部材2の突出量(各バンプ部2b、 2
bの突出高さ)は約5μmである。FIG. 1 is a sectional view of an electrical connection member I according to the present invention. The electrical connection member 1 is composed of a plurality of conductive members 2 made of a conductive material and a holder 3 made of polyimide resin, for example, and provided with the conductive members 2 so that the respective conductive members 2 are electrically insulated from each other. has been done. Each conductive member 2 has both ends protruding from both sides of the holder 30.
A columnar portion 2a buried therein and a columnar portion 2a protruding from the holding body 3.
It consists of two bump parts 2b, 2b. The conductive materials used in the columnar part 2a and the bump part 2b constituting the conductive member 2 are different, and the columnar part 2a is made of nickel (nickel).
The bump portions 2b and 2b are made of gold (Au), which has a lower hardness than Ni. Note that the dimensions of each part of the electrical connection member 1 are approximately the same as those of the conventional one,
The thickness of the holder 3 is approximately 10 μm, and the conductive member 2 (column portion 2a
) is approximately 15 μm in diameter, and the formation pitch of the conductive members 2 is approximately 4
0ttm, the amount of protrusion of the conductive member 2 (each bump portion 2b, 2
The protrusion height of b) is approximately 5 μm.
次に、このような構成をなす電気的接続部材の製造方法
(本発明に係る電気的接続部材の製造方法)の−例につ
いて、その工程を模式的に示す第2図に基づき説明する
。Next, an example of a method for manufacturing an electrical connection member having such a configuration (a method for manufacturing an electrical connection member according to the present invention) will be described based on FIG. 2, which schematically shows the process.
まず、基体たる銅板11を準備しく第2図(a))、銅
板11の一方の面にネガ型の感光性樹脂のポリイミド樹
脂12を塗布して、100℃前後の温度にてプリベイク
を行う(第2図(b))。なお塗布するポリイミド樹脂
12の膜厚は、硬化収縮による減少を考慮して、製造さ
れる電気的接続部材における保持体の所望の膜厚よりも
厚くしておく。なお、塗布方法はスピンコータ、ロール
コータ等を用いることができ、また均一な膜厚が得られ
る方法であれば任意の方法を採用しても良い。First, prepare a copper plate 11 as a base (FIG. 2(a)), apply a negative photosensitive polyimide resin 12 to one side of the copper plate 11, and pre-bake it at a temperature of around 100°C (Fig. 2(a)). Figure 2(b)). Note that the thickness of the polyimide resin 12 to be applied is set to be thicker than the desired thickness of the holder in the electrical connection member to be manufactured, taking into account reduction due to curing shrinkage. Note that a spin coater, a roll coater, or the like may be used as the coating method, and any method may be used as long as it provides a uniform film thickness.
次に、所定パターンをなしたフォトマスク(図示せず)
を介して光をポリイミド樹脂12に照射した(露光した
)後、現像を行う。本例では、露光された部分にはポリ
イミド樹脂12が残存し、露光されない部分は現像処理
によりポリイミド樹脂12が除去されて、複数の穴13
がポリイミド樹脂12に形成される(第2図(C))。Next, a photomask with a predetermined pattern (not shown)
After the polyimide resin 12 is irradiated (exposed) with light through the polyimide resin 12, development is performed. In this example, the polyimide resin 12 remains in the exposed areas, and the polyimide resin 12 is removed in the unexposed areas by development processing, forming a plurality of holes 13.
is formed on the polyimide resin 12 (FIG. 2(C)).
その後温度を200〜400°Cまで上げてポリイミド
樹脂12の硬化を行う。Thereafter, the temperature is raised to 200 to 400°C to cure the polyimide resin 12.
次に、このような処理がなされた銅板11をエツチング
液中に浸漬させてエツチングを行う。穴13の近傍の銅
板11の一部をエツチング除去して、穴13に連通する
凹部14を銅板11に形成する(第2図(d))。この
際、形成する凹部14の径は、穴13の径よりは大きく
隣合う穴13の外周までの距離の半分よりは小さいこと
とする。このように、凹部14の大きさを制御してお(
ことにより、隣合う導電部材同士が導通することなくし
かも導電部材の抜は落ちがない電気的接続部材を製造で
きる。Next, the copper plate 11 that has been treated in this manner is immersed in an etching solution to perform etching. A portion of the copper plate 11 near the hole 13 is removed by etching to form a recess 14 in the copper plate 11 that communicates with the hole 13 (FIG. 2(d)). At this time, the diameter of the recess 14 to be formed is larger than the diameter of the hole 13 and smaller than half the distance to the outer periphery of the adjacent hole 13. In this way, the size of the recess 14 is controlled (
By doing so, it is possible to manufacture an electrical connection member in which adjacent conductive members are not electrically connected to each other, and there is no disconnection of conductive members.
次いで銅板11を共通電極とした電解メツキにより、穴
13.凹部14に導電材料を充填する。金めつき液を用
いて凹部14に金15を充填し、次にニッケルめっき液
を用いて穴13にニッケル16を充填し、ニッケル16
が穴13内に充填されて析出面がポリイミド樹脂12の
表面と路面−になると、再び金めつき液を用いてポリイ
ミド樹脂12から所定高さまで突出するように金めつき
を行い、柱状部2aはニッケル16からなり、バンプ部
2b、 2bは金15からなる導電部材2を形成する(
第2図(e))。最後に、銅はエツチングするが金15
.ニッケル16及びポリイミド樹脂12はエツチングし
ないようなエツチング液を用いた金属エツチングにより
銅板11を除去して、第1図に示すような電気的接続部
材1を製造する(第2図(f))。Next, holes 13. The recess 14 is filled with a conductive material. Fill the recess 14 with gold 15 using a gold plating solution, then fill the hole 13 with nickel 16 using a nickel plating solution, and fill the hole 16 with nickel 16.
When the polyimide resin 12 is filled in the hole 13 and the deposited surface becomes the surface of the polyimide resin 12 and the road surface, gold plating is again performed using a gold plating solution so that it protrudes from the polyimide resin 12 to a predetermined height. is made of nickel 16, and the bump portions 2b and 2b form the conductive member 2 made of gold 15 (
Figure 2(e)). Finally, copper is etched, but gold 15
.. The copper plate 11 is removed by metal etching using an etching solution that does not etch the nickel 16 and the polyimide resin 12, thereby producing the electrical connection member 1 as shown in FIG. 1 (FIG. 2(f)).
本実施例では、製造された電気的接続部材lにおいて、
ニッケル16が導電部材2の柱状部2aを構成し、金1
5が導電部材2のバンプ部2b、 2bを構成し、ポリ
イミド樹脂12が保持体3を構成する。そして、柱状部
2aはニッケル16.バンプ部2b、 2hは金15か
らなるので、各導電部材2において、柱状部2aの方が
バンプ部2b、 2bより硬度は高い。In this example, in the manufactured electrical connection member l,
Nickel 16 constitutes the columnar part 2a of the conductive member 2, and gold 1
5 constitutes the bump portions 2b, 2b of the conductive member 2, and the polyimide resin 12 constitutes the holder 3. The columnar portion 2a is made of nickel 16. Since the bump portions 2b and 2h are made of gold 15, the columnar portion 2a of each conductive member 2 has a higher hardness than the bump portions 2b and 2b.
第1図(b)、 (c)、 (d)は他の実施例を示す
ものである。第1図(b)は柱状部2aの導電材料がバ
ンプ部2bの一部まで存在する場合を示し、第1図(c
)、 (d)はバンプ部2bの導電材料が柱状部2aに
まで存在する場合を示す。FIGS. 1(b), (c), and (d) show other embodiments. FIG. 1(b) shows a case where the conductive material of the columnar part 2a exists up to a part of the bump part 2b, and FIG.
) and (d) show the case where the conductive material of the bump portion 2b is present even in the columnar portion 2a.
上述した実施例では導電部材2の柱状部2a+バンプ部
2b、 2bの材料として、ニッケル、金を使用したが
、柱状部2aがバンプ部2b、 2bより相対的に硬度
が高い材料であれば良く、柱状部2aとしては金(Au
)の他にAg、 はんだ等を、バンプ部2b、 2bと
しではニッケル(Ni)の他にCr+ Fe、 Co、
Cu等を使用できる。なお導電部材2の断面形状は、
円形、四角形その他の形状とすることができるが、応力
の過度の集中を避けるためには角がない形状が望ましい
。また、導電部材2は保持体3中に垂直に配する必要は
なく、保持体3の一方の面側から保持体3の他方の面倒
に斜行していてもよい。In the above-described embodiment, nickel and gold were used as the material for the columnar portion 2a + bump portions 2b, 2b of the conductive member 2, but the material for the columnar portion 2a may be as long as it is harder than the bump portions 2b, 2b. , the columnar portion 2a is made of gold (Au
) in addition to Ag, solder, etc., and in addition to nickel (Ni), Cr+ Fe, Co,
Cu etc. can be used. The cross-sectional shape of the conductive member 2 is as follows:
It can be circular, square, or other shapes, but a shape without corners is preferred to avoid excessive concentration of stress. Further, the conductive member 2 does not need to be disposed vertically in the holder 3, and may be inclined from one side of the holder 3 to the other side of the holder 3.
第3図は本発明の電気的接続部材の別の実施例を示す断
面図である。この実施例では、導電部材2の柱状部2a
が2種の導電材料からなっている。FIG. 3 is a sectional view showing another embodiment of the electrical connection member of the present invention. In this embodiment, the columnar portion 2a of the conductive member 2
is made of two types of conductive materials.
柱状部2aの中央部20aはニッケル(Ni )から構
成され、その辺縁部21a、 21aは銅(Cu)から
構成されている。なお、導電部材2のバンプ部2h、
2bは、前述の実施例と同様に金(Au)から構成され
ている。この実施例では、各導電部材2において、中央
部から辺縁部にかけて3段階の硬度変化がある。The central portion 20a of the columnar portion 2a is made of nickel (Ni), and the peripheral portions 21a, 21a are made of copper (Cu). Note that the bump portion 2h of the conductive member 2,
2b is made of gold (Au) as in the previous embodiment. In this embodiment, each conductive member 2 has three levels of hardness change from the center to the edge.
なお、上述した実施例は一例であり、導電部材2が異種
金属の複合構成からなり、その柱状部2aがバンプ部2
b、 2bより硬度が相対的に高くなる場合には、任意
の構成をなしていても良い。Note that the above-mentioned embodiment is an example, and the conductive member 2 is made of a composite structure of different metals, and the columnar part 2a is the bump part 2.
If the hardness is relatively higher than that of b and 2b, any configuration may be used.
また本実施例では保持体3としてポリイミド樹脂12を
用いたが、特に限定されない。露光、現像処理により穴
13を形成する場合には、感光性の樹脂である必要はあ
るが、もし露光、現像処理ではなくて例えば高エネルギ
ビームの照射により穴13を形成する場合には、感光性
の樹脂である必要もない。また樹脂中に、粉体、繊維、
板状体、棒状体1球状体等の所望の形状をなした、無機
材料。Further, in this embodiment, polyimide resin 12 is used as the holder 3, but there is no particular limitation. When the holes 13 are formed by exposure and development, it is necessary to use a photosensitive resin, but if the holes 13 are formed by, for example, irradiation with a high-energy beam instead of exposure and development, the resin must be photosensitive. It does not need to be a synthetic resin. In addition, powder, fiber,
An inorganic material in a desired shape such as a plate, a rod, a sphere, etc.
金属材料9合金材料の一種または複数種が、分散して含
有せしめてもよい。含有される金属材料。One or more types of metal materials 9 alloy materials may be contained in a dispersed manner. Contained metal materials.
合金材料として具体的には、篩、八g+ CJ^I、
Re+Ca、 Mg、 Mo、 Fe、 Ni+ Co
、 Mn、 W、 Cr、 Nb、 Zr。Specifically, the alloy materials include sieve, 8g+CJ^I,
Re+Ca, Mg, Mo, Fe, Ni+ Co
, Mn, W, Cr, Nb, Zr.
Ti、 Ta+ Zn、 sn、 Ph−5n等があげ
られ、含有される無機材料として、5jOz+ BzO
++ 八IJ:+、 NazO+ KzO+Cab、
ZnO,Bad、 PbO,sb、o3. 八5
20ff+ Lawn、、、 Zr0z+P2O5
I Ti0z+ MgO+ StC+ Bed
、 BP+ BN+ 八IN、 B、C。Examples include Ti, Ta + Zn, sn, Ph-5n, etc., and the contained inorganic materials include 5jOz + BzO
++ 8IJ:+, NazO+ KzO+Cab,
ZnO, Bad, PbO, sb, o3. 85
20ff+ Lawn, Zr0z+P2O5
I Ti0z+ MgO+ StC+ Bed
, BP+ BN+ 8 IN, B, C.
TaC,TiBz、CrRz+ TiN+ 5t3Nn
+ Ta1ls等のセラミック、ダイヤモンド、ガラス
、カーボン、ボロン等があげられる。TaC, TiBz, CrRz+ TiN+ 5t3Nn
+ Ceramics such as Ta1ls, diamond, glass, carbon, boron, etc.
また本実施例では基体として銅板11を用いたが、これ
に限らず、^u、 Ag+ Fle、 Ca、 Mg+
Mo、 Ni、 W。Further, in this embodiment, the copper plate 11 was used as the substrate, but the substrate is not limited to this, and ^u, Ag+ Fle, Ca, Mg+
Mo, Ni, W.
Fe、 Ti+ In、 Ta+ Zn+ AI+ S
n、 Pb−5n等の金属または合金の薄板を使用でき
る。但し、最終工程において基体のみを選択的にエツチ
ング除去するので、導電部材2の材料と基体に用いる材
料とは異ならせておく必要がある。Fe, Ti+ In, Ta+ Zn+ AI+ S
A thin plate of metal or alloy such as Pb-5n or Pb-5n can be used. However, since only the base is selectively etched away in the final step, the material of the conductive member 2 and the material used for the base must be different.
以上詳述した如く、本発明の電気的接続部材では、その
導電部材において柱状部はバンプ部に比べて硬度が高い
導電材料から構成されているので、このような導電部材
を電気回路部品の接続部に熱圧着、圧着した際に、柱状
部に比ベバンプ部が要領良く変形し、導電部材の電気回
路部品の接続部への接合を低荷重にて行うことが可能で
ある。また、従来では導電部材の数が多い場合に一括接
合では極めて大きな荷重を印加する必要があったが、本
発明の電気的接続部材では変形部分がバンプ部に集中す
ることになるので、大きな荷重を印加することなしに多
数の導電部材の電気回路部品の接続部への一括接合が可
能である。更に、加える荷重はバンプ部を変形させる荷
重となり、バンプ部の変形量コントロールが容易となる
ために高密度な接合が可能となる。As detailed above, in the electrical connection member of the present invention, the columnar portion of the conductive member is made of a conductive material having higher hardness than the bump portion, so that such a conductive member can be used to connect electrical circuit components. When the conductive member is thermally compressed and crimped to the columnar part, the bump part deforms in a good manner compared to the columnar part, and it is possible to join the conductive member to the connection part of the electric circuit component with a low load. Additionally, in the past, when there were a large number of conductive members, it was necessary to apply an extremely large load when joining them all at once, but with the electrical connection member of the present invention, the deformed portion is concentrated on the bump portion, so a large load is applied. It is possible to connect a large number of conductive members to the connection portion of an electric circuit component at once without applying any pressure. Furthermore, the applied load becomes a load that deforms the bump portion, and the amount of deformation of the bump portion can be easily controlled, allowing high-density bonding.
第1図は本発明に係る電気的接続部材の断面図、第2図
は本発明に係る製造方法の一実施例の工程を示す模式的
断面図、第3図は本発明の電気的接続部材の別の実施例
の断面図、第4図は電気的接続部材の使用例を示す模式
図、第5図は従来の製造方法の工程を示す模式的断面図
である。
1・・・電気的接続部材 2・・・導電部材 2a・・
・柱状部 2h・・・バンプ部 3・・・保持体 11
・・・銅板12・・・ポリイミド樹脂 13・・・穴
14・・・凹部15・・・金16・・・ニッケルFIG. 1 is a cross-sectional view of an electrical connection member according to the present invention, FIG. 2 is a schematic cross-sectional view showing steps of an embodiment of a manufacturing method according to the present invention, and FIG. 3 is a cross-sectional view of an electrical connection member according to the present invention. FIG. 4 is a schematic diagram showing an example of the use of the electrical connection member, and FIG. 5 is a schematic cross-sectional diagram showing steps of a conventional manufacturing method. 1... Electrical connection member 2... Conductive member 2a...
・Column part 2h...Bump part 3...Holding body 11
...Copper plate 12...Polyimide resin 13...Hole
14... Concavity 15... Gold 16... Nickel
Claims (1)
に絶縁状態にて備えられた複数の導電部材とを有し、前
記各導電部材の両端部が前記保持体の両面において突出
している電気的接続部材において、 前記各導電部材は、前記保持体の両面から 突出している1種または2種以上の第1の導電材料と、
第1の導電材料とは異なり前記保持体の少なくとも一部
分に埋設されている1種または2種以上の第2の導電材
料とから構成されており、第2の導電材料が第1の導電
材料より硬度が高いことを特徴とする電気的接続部材。 2、電気的絶縁材からなる保持体と、該保持体中に互い
に絶縁状態にて備えられた複数の導電部材とを有し、前
記各導電部材の両端部が前記保持体の両面において突出
している電気的接続部材を製造する方法において、 前記保持体となる絶縁層を基体上に設ける 工程と、該絶縁層をパターン除去して複数の穴を形成し
、前記基体を露出させる工程と、露出された前記基体の
一部をエッチング除去する工程と、形成した穴にめっき
により導電材料を前記絶縁層の両面から突出させて充填
し、前記導電部材を形成する工程と、残存する前記基体
を除去する工程とを有し、前記導電材料を充填して導電
部材を形成する工程は、第1の導電材料を充填する過程
、該第1の導電材料より硬度が高くて別な種類の第2の
導電材料を充填する過程、及び前記第1の導電材料を充
填して前記導電部材を形成する過程を有することを特徴
とする電気的接続部材の製造方法。[Claims] 1. A holding body made of an electrically insulating material, and a plurality of conductive members provided in the holding body insulated from each other, wherein both ends of each of the conductive members are connected to the holding body. In an electrical connection member protruding from both sides of the body, each of the conductive members includes one or more types of first conductive material protruding from both sides of the holder;
Unlike the first conductive material, it is composed of one or more types of second conductive material buried in at least a portion of the holding body, and the second conductive material is stronger than the first conductive material. An electrical connection member characterized by high hardness. 2. It has a holder made of an electrically insulating material, and a plurality of conductive members provided in the holder insulated from each other, and both ends of each of the conductive members protrude from both sides of the holder. A method for manufacturing an electrical connection member, comprising: providing an insulating layer to serve as the holder on a base; removing a pattern of the insulating layer to form a plurality of holes to expose the base; a step of etching away a portion of the base that has been removed; a step of filling the formed hole with a conductive material by plating so as to protrude from both sides of the insulating layer to form the conductive member; and removing the remaining base. The step of filling the conductive material to form the conductive member includes the step of filling the first conductive material, and the step of filling the conductive material with the first conductive material, and the step of filling the conductive material with the conductive material. A method for manufacturing an electrical connection member, comprising the steps of: filling a conductive material; and filling the first conductive material to form the conductive member.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8541990A JP2961221B2 (en) | 1990-03-30 | 1990-03-30 | Electrical connection members |
US07/623,521 US5135606A (en) | 1989-12-08 | 1990-12-07 | Process for preparing electrical connecting member |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8541990A JP2961221B2 (en) | 1990-03-30 | 1990-03-30 | Electrical connection members |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03283378A true JPH03283378A (en) | 1991-12-13 |
JP2961221B2 JP2961221B2 (en) | 1999-10-12 |
Family
ID=13858296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8541990A Expired - Lifetime JP2961221B2 (en) | 1989-12-08 | 1990-03-30 | Electrical connection members |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2961221B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998004000A1 (en) * | 1996-07-22 | 1998-01-29 | Honda Giken Kogyo Kabushiki Kaisha | Plug-in type electronic control unit, connecting structure between wiring board and plug member, connecting unit between electronic parts and wiring board, and electronic parts mounting method |
JP2009164016A (en) * | 2008-01-08 | 2009-07-23 | Fujitsu Ltd | Terminal sheet, manufacturing method of terminal sheet, and semiconductor device |
WO2018066540A1 (en) * | 2016-10-06 | 2018-04-12 | 日東電工株式会社 | Anisotropic conductive sheet |
JP2018186062A (en) * | 2016-10-06 | 2018-11-22 | 日東電工株式会社 | Anisotropic Conductive Sheet |
-
1990
- 1990-03-30 JP JP8541990A patent/JP2961221B2/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998004000A1 (en) * | 1996-07-22 | 1998-01-29 | Honda Giken Kogyo Kabushiki Kaisha | Plug-in type electronic control unit, connecting structure between wiring board and plug member, connecting unit between electronic parts and wiring board, and electronic parts mounting method |
US6720500B1 (en) * | 1996-07-22 | 2004-04-13 | Honda Giken Kogyo Kabushiki Kaisha | Plug-in type electronic control unit, structure of connection of wiring board with plug member, unit of connection of electronic part with wiring board, and process for mounting electronic part |
JP2009164016A (en) * | 2008-01-08 | 2009-07-23 | Fujitsu Ltd | Terminal sheet, manufacturing method of terminal sheet, and semiconductor device |
WO2018066540A1 (en) * | 2016-10-06 | 2018-04-12 | 日東電工株式会社 | Anisotropic conductive sheet |
JP2018186062A (en) * | 2016-10-06 | 2018-11-22 | 日東電工株式会社 | Anisotropic Conductive Sheet |
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