JPH041739Y2 - - Google Patents
Info
- Publication number
- JPH041739Y2 JPH041739Y2 JP1982039168U JP3916882U JPH041739Y2 JP H041739 Y2 JPH041739 Y2 JP H041739Y2 JP 1982039168 U JP1982039168 U JP 1982039168U JP 3916882 U JP3916882 U JP 3916882U JP H041739 Y2 JPH041739 Y2 JP H041739Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- strips
- pieces
- connection
- spacing piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 238000007789 sealing Methods 0.000 description 6
- 230000008602 contraction Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【考案の詳細な説明】
本考案は樹脂封止型半導体装置に用いるリード
フレームの改良に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in lead frames used in resin-sealed semiconductor devices.
従来の樹脂封止型半導体装置に用いるリードフ
レームを第１図に示す。第１図の左側はリードフ
レームの形状を示し、右側は樹脂封止後のものを
示している。従来のリードフレームは平行に離間
して延在する太い２本の連結条体１，１と両連結
条１，１の略中間に位置する半導体素子固着部分
２とこの固着部分２にその先端部分と近接する如
く延在して設けられた複数本の金属リード片３，
３と金属リード片３，３の一端が接続され且つ両
連結条体１，１間を橋絡するリード接続橋体４よ
り各リード単位５が形成され、多数のリード単位
５が両連結条体１，１で連結されてリードフレー
ムを構成していた。しかしながら斯るリードフレ
ームではトランスフアーモールドによる封止樹脂
６が矢印の方向に収縮するために両連結条体１，
１と寸法差を生じて弓形あるいは波形に反り、こ
の変形により後工程でのフレーム切断の際のトラ
ブルの原因となつていた。 FIG. 1 shows a lead frame used in a conventional resin-sealed semiconductor device. The left side of FIG. 1 shows the shape of the lead frame, and the right side shows the shape after resin sealing. A conventional lead frame has two thick connecting strips 1, 1 extending apart from each other in parallel, a semiconductor element fixing portion 2 located approximately in the middle of both the connecting strips 1, 1, and a tip portion of the fixing portion 2. A plurality of metal lead pieces 3 are provided extending so as to be close to each other.
Each lead unit 5 is formed from a lead connecting bridge body 4 which is connected to one end of the metal lead pieces 3 and 3 and bridges between the two connecting strips 1, 1, and a large number of lead units 5 are connected to both the connecting strips 1, 1. They were connected at 1, 1 to form a lead frame. However, in such a lead frame, since the sealing resin 6 formed by the transfer mold contracts in the direction of the arrow, both connecting strips 1,
1 and warped into an arched or wavy shape, and this deformation caused trouble when cutting the frame in the subsequent process.
本考案は斯る欠点に鑑みてなされ、従来の欠点
を除去したリードフレームを提供するものであり
以下に第２図を参照して本考案の一実施例を詳述
する。第２図左側はリードフレームの形状を示し
右側は樹脂封止後のものを示している。 The present invention has been devised in view of these drawbacks and provides a lead frame that eliminates the conventional drawbacks.One embodiment of the present invention will be described in detail below with reference to FIG. 2. The left side of FIG. 2 shows the shape of the lead frame, and the right side shows the shape after resin sealing.
本考案によるリードフレームは第２図に示す如
く、平行に離間して設けられた太い２本の連結条
体１１，１１と、両連結条体１１，１１の略中間
に位置する半導体素子固着部分１２と、固着部分
１２にその先端部分を近接する如く延在して設け
られた複数本の金属リード片１３，１３と、金属
リード片１３，１３の他の先端が接続され且つ両
連結条体１１，１１間を橋絡するリード接続橋体
１４とを備え、リード接続橋体１４と連結条体１
１，１１とで金属リード片１３，１３を囲み各リ
ード単位１５が形成され、多数のリード単位１５
が連結条体１１，１１によつて連結され、更に隣
接する各リード単位１５のリード接続橋体１４間
に間隔片１６を設け、各間隔片１６に切断面１７
を設けて構成される。 As shown in FIG. 2, the lead frame according to the present invention has two thick connecting strips 11, 11 spaced apart from each other in parallel, and a semiconductor element fixing portion located approximately in the middle of both the connecting strips 11, 11. 12, a plurality of metal lead pieces 13, 13, which are provided so that their tips extend close to the fixed portion 12, and the other tips of the metal lead pieces 13, 13 are connected, and both connecting strips are connected. 11, 11, the lead connection bridge body 14 and the connecting strip body 1.
1 and 11 surround the metal lead pieces 13 and 13 to form each lead unit 15, and a large number of lead units 15
are connected by the connecting strips 11, 11, and a spacing piece 16 is provided between the lead connection bridge bodies 14 of each adjacent lead unit 15, and a cut surface 17 is provided on each spacing piece 16.
It is configured by providing.
本考案の特徴は間隔片１６の切断面１７にあ
る。即ち切断溝１７を設けない従来のリードフレ
ームでは、前述の如く樹脂の収縮によるフレーム
の変形が必ず発生している。そこで間隔片１６を
最初から設けないとするとこのフレームの変形は
防止できるはずである。しかしながら間隔片１６
を除去すると封止樹脂１８の圧入時に各金属リー
ド片が外側に押し出されて変形する危惧がある。
ところが本考案のフレームは封止樹脂１８の圧入
時には間隔片１６は一体として働くので、圧入に
よる変形は防止でき、封止樹脂１８の収縮時には
切断面１７で間隔片１６は離間するので収縮によ
る変形を防止できるのである。 A feature of the present invention is the cut surface 17 of the spacing piece 16. That is, in conventional lead frames without the cutting grooves 17, deformation of the frame due to resin contraction always occurs as described above. Therefore, if the spacing piece 16 were not provided from the beginning, this deformation of the frame could be prevented. However, the spacing piece 16
If these are removed, there is a risk that each metal lead piece will be pushed outward and deformed when the sealing resin 18 is press-fitted.
However, in the frame of the present invention, when the sealing resin 18 is press-fitted, the spacing pieces 16 work as one unit, so deformation due to press-fitting can be prevented.When the sealing resin 18 contracts, the spacing pieces 16 are separated at the cut surface 17, so that deformation due to contraction is prevented. It is possible to prevent this.
以上に詳述した如く本考案に依れば間隔片１６
に切断面１７を設けるのみでリードフレームの変
形を完全に防止でき、後工程でのリードフレーム
の切断時のトラブルを未然に防止できる。 As detailed above, according to the present invention, the spacing piece 16
By simply providing the cut surface 17 on the lead frame, deformation of the lead frame can be completely prevented, and troubles when cutting the lead frame in a subsequent process can be prevented.
第１図および第２図は、従来および本考案を説
明するための上面図である。
主な図番の説明、１１は連結条体、１２は半導
体素子固着部分、１３は金属リード片、１４はリ
ード接続橋体、１６は間隔片、１７は切断面であ
る。
FIGS. 1 and 2 are top views for explaining the conventional technology and the present invention. Explanation of the main drawing numbers: 11 is a connecting strip, 12 is a semiconductor element fixing portion, 13 is a metal lead piece, 14 is a lead connection bridge body, 16 is a spacing piece, and 17 is a cut surface.
Claims (1)
両連結条体のほぼ中間に設けられた半導体素子固
着部分と該固着部分にその先端部分を近接する如
く延在して設けられた複数本の金属リード片と該
金属リード片の一端が接続され、且つ前記連結条
体を橋絡するリード接続橋体とを備え、前記両連
結条体とリード接続橋体により各リード単位を囲
み、且該リード単位を複数個連結したリードフレ
ームにおいて、隣接する前記各リード単位のリー
ド接続橋体を離間し、且つ接続する間隔片を設
け、該間隔片を２つに分離する切断面を設け力の
加わらないかぎりこの切断面は一体となつている
ことを特徴とするリードフレーム。 two connecting strips spaced apart from each other in parallel; a semiconductor element fixing portion provided approximately midway between the two coupling strips; and a tip portion extending so as to be close to the fixing portion. A plurality of metal lead pieces and a lead connection bridge body to which one end of the metal lead pieces are connected and bridge the connection strips, and each lead unit is surrounded by both the connection strips and the lead connection bridge body. , and in a lead frame in which a plurality of lead units are connected, a spacing piece is provided that separates and connects the lead connection bridge bodies of each adjacent lead unit, and a cutting surface is provided that separates the spacing piece into two. A lead frame characterized in that the cut surfaces remain integral unless force is applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3916882U JPS58142937U (en) | 1982-03-18 | 1982-03-18 | lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3916882U JPS58142937U (en) | 1982-03-18 | 1982-03-18 | lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58142937U JPS58142937U (en) | 1983-09-27 |
| JPH041739Y2 true JPH041739Y2 (en) | 1992-01-21 |
Family
ID=30050470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3916882U Granted JPS58142937U (en) | 1982-03-18 | 1982-03-18 | lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58142937U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60141146U (en) * | 1984-02-27 | 1985-09-18 | 三洋電機株式会社 | lead frame |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5294074A (en) * | 1976-02-04 | 1977-08-08 | Hitachi Ltd | Leading-in frame |
| JPS5651850A (en) * | 1979-10-05 | 1981-05-09 | Nec Corp | Lead frame |
-
1982
- 1982-03-18 JP JP3916882U patent/JPS58142937U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5294074A (en) * | 1976-02-04 | 1977-08-08 | Hitachi Ltd | Leading-in frame |
| JPS5651850A (en) * | 1979-10-05 | 1981-05-09 | Nec Corp | Lead frame |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58142937U (en) | 1983-09-27 |
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