JPH04170049A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH04170049A JPH04170049A JP2297459A JP29745990A JPH04170049A JP H04170049 A JPH04170049 A JP H04170049A JP 2297459 A JP2297459 A JP 2297459A JP 29745990 A JP29745990 A JP 29745990A JP H04170049 A JPH04170049 A JP H04170049A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- potential
- dummy wiring
- signal
- dummy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置に関し、特に信号用配線層をもつ半
導体集積装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, and particularly to a semiconductor integrated device having a signal wiring layer.
第2図(a)、(b)は従来の半導体装置の一例の模式
回路図および一部断面図である。従来半導体装置のレイ
アウトを行う際、第2図(a)の各論理回路1,3間に
遅延用の論理素子8を設けて接続していた。その際に信
号用配線2には、論理素子8による所定の遅延時間が得
られる。FIGS. 2(a) and 2(b) are a schematic circuit diagram and a partial sectional view of an example of a conventional semiconductor device. Conventionally, when laying out a semiconductor device, a delay logic element 8 was provided and connected between each of the logic circuits 1 and 3 shown in FIG. 2(a). At this time, a predetermined delay time due to the logic element 8 is obtained in the signal wiring 2.
第2図(b)に示すよう(こ信号用配線層6は、半導体
基板10上の絶縁層9の中に設けられている。As shown in FIG. 2(b), the signal wiring layer 6 is provided in the insulating layer 9 on the semiconductor substrate 10.
上述した従来の半導体装置は論理素子により規定の遅延
のみしか与えることができず、半導体装置製造後、遅延
を変更することができないという欠点があった。The conventional semiconductor device described above has the drawback that only a prescribed delay can be provided by the logic element, and the delay cannot be changed after the semiconductor device is manufactured.
本発明の半導体装置は、半導体基板上の絶縁層中に設け
られた信号用配線層に近接して設けられたダミー配線層
と、該ダミー配線に前記信号用配線層の電位と同相又は
逆相の電位レベルを与えるスイッチング素子を有する電
位発生回路とを含んで構成されている。The semiconductor device of the present invention includes a dummy wiring layer provided in close proximity to a signal wiring layer provided in an insulating layer on a semiconductor substrate, and a potential in the dummy wiring that is in phase with or in phase opposite to the potential of the signal wiring layer. and a potential generation circuit having a switching element that provides a potential level of .
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
°第1図<a)は本発明の一実施例の模式回路図である
。論理回路1及び3はそれぞれ入力が決まると出力が1
つ決まる。電位発生回路4はダミー配線5に電位を与え
るための回路である。1<a) is a schematic circuit diagram of an embodiment of the present invention. Logic circuits 1 and 3 each output 1 when the input is determined.
One is decided. The potential generation circuit 4 is a circuit for applying a potential to the dummy wiring 5.
電位発生面N4の出力はフユーズにより選択可能であり
、選択されたフユーズF1〜F3の位置によりダミー配
線5の電位が決まる。ダミー配線5は信号用配線2と同
相で、選択されたフユーズの位置で決まる一定の電位を
持つ配線である。The output of the potential generating surface N4 can be selected by fuses, and the potential of the dummy wiring 5 is determined by the positions of the selected fuses F1 to F3. The dummy wiring 5 is a wiring that is in phase with the signal wiring 2 and has a constant potential determined by the position of the selected fuse.
第1図(b)は、本発明の一部断面図である。FIG. 1(b) is a partial sectional view of the present invention.
信号用配線層6とそれと同層で選択されたフユーズの位
置で決まる一定の電位差を持つダミー配線層7を半導体
基板10上の絶縁層9の中に形成することにより両層配
線層6.7の間に所望の電位差を生じさせて配線層6,
7間の電荷量を可変し、信号用配線2に信号遅延をもた
せることができる。By forming in the insulating layer 9 on the semiconductor substrate 10 a signal wiring layer 6 and a dummy wiring layer 7 having a constant potential difference determined by the position of a fuse selected in the same layer, both wiring layers 6 and 7 are formed. By creating a desired potential difference between the wiring layers 6,
By varying the amount of charge between the signal lines 7 and 7, it is possible to cause the signal wiring 2 to have a signal delay.
埜たその遅延は第1図(a)に示したフユーズF1〜F
、の選択により変更することができる。The delay is caused by fuses F1 to F shown in Figure 1(a).
, can be changed by selecting .
なお、本実施例は信号用配線層6の下にダミー配線層7
を配線する場合について述べたが、ダミー配線層7が上
、右、左もしくはその組み合わせの場合でも同様の効果
が得られる。Note that in this embodiment, a dummy wiring layer 7 is provided under the signal wiring layer 6.
Although the case where the dummy wiring layer 7 is wired is described above, the same effect can be obtained even when the dummy wiring layer 7 is placed on the top, right, left, or a combination thereof.
また、本実施例はフユーズを用いて所望の電位差を得る
場合について述べたが、フユーズ以外の、スイッチング
切り換え素子を用いても同様の効果が得られる。Further, although this embodiment has been described with reference to a case in which a desired potential difference is obtained using a fuse, the same effect can be obtained by using a switching element other than a fuse.
以上説明したように、本発明は、所定の信号用配線に平
行して、該信号用配線に直接接続しない電位的に同相も
しくは逆相で一定の選択可能なダミー配線を配置するこ
とにより、配線層間に発生する電位差により配線層間の
電荷量を可変し所望の遅延をもたらすことができる。こ
の為、半導体装置の信号用配線にとって、最適遅延時間
を得られるという効果がある。As explained above, the present invention enables wiring by arranging a certain selectable dummy wiring in parallel with a predetermined signal wiring, which is not directly connected to the signal wiring and has the same or opposite phase potential. The amount of charge between wiring layers can be varied by the potential difference generated between the layers, thereby providing a desired delay. Therefore, there is an effect that the optimum delay time can be obtained for the signal wiring of the semiconductor device.
第1図(a)、(b)は本発明の模式回路図及び一部断
面図、第2図<a)、(b)は従来の半導体装置−例の
模式回路図及び一部断面図である。
1.3・・・論理回路、2・・・信号用配線、5・・・
ダミー配線、4・・・電位差発生回路、6・・・信号用
配線層、7・・・ダミー配線層、8・・・遅延用論理素
子。FIGS. 1(a) and (b) are a schematic circuit diagram and a partial sectional view of the present invention, and FIGS. 2(a) and (b) are a schematic circuit diagram and a partial sectional view of an example of a conventional semiconductor device. be. 1.3...Logic circuit, 2...Signal wiring, 5...
Dummy wiring, 4... Potential difference generating circuit, 6... Signal wiring layer, 7... Dummy wiring layer, 8... Delay logic element.
Claims (1)
近接して設けられたダミー配線層と、該ダミー配線に前
記信号用配線層の電位と同相又は逆相の電位レベルを与
えるスイッチング素子を有する電位発生回路とを含むこ
とを特徴とする半導体装置。A dummy wiring layer provided in close proximity to a signal wiring layer provided in an insulating layer on a semiconductor substrate, and a switching element that provides the dummy wiring with a potential level that is in phase or in phase with the potential of the signal wiring layer. What is claimed is: 1. A semiconductor device comprising: a potential generation circuit having a potential generation circuit;
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2297459A JPH04170049A (en) | 1990-11-02 | 1990-11-02 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2297459A JPH04170049A (en) | 1990-11-02 | 1990-11-02 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04170049A true JPH04170049A (en) | 1992-06-17 |
Family
ID=17846775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2297459A Pending JPH04170049A (en) | 1990-11-02 | 1990-11-02 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04170049A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007311763A (en) * | 2006-04-18 | 2007-11-29 | Matsushita Electric Ind Co Ltd | Semiconductor integrated circuit system, semiconductor integrated circuit, operating system, and semiconductor integrated circuit control method |
-
1990
- 1990-11-02 JP JP2297459A patent/JPH04170049A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007311763A (en) * | 2006-04-18 | 2007-11-29 | Matsushita Electric Ind Co Ltd | Semiconductor integrated circuit system, semiconductor integrated circuit, operating system, and semiconductor integrated circuit control method |
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