JPH04168405A - Semiconductor laser device - Google Patents
Semiconductor laser deviceInfo
- Publication number
- JPH04168405A JPH04168405A JP29608590A JP29608590A JPH04168405A JP H04168405 A JPH04168405 A JP H04168405A JP 29608590 A JP29608590 A JP 29608590A JP 29608590 A JP29608590 A JP 29608590A JP H04168405 A JPH04168405 A JP H04168405A
- Authority
- JP
- Japan
- Prior art keywords
- optical fiber
- semiconductor laser
- obliquely polished
- optical
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 239000013307 optical fiber Substances 0.000 claims abstract description 41
- 230000003287 optical effect Effects 0.000 claims abstract description 17
- 238000010276 construction Methods 0.000 abstract description 2
- 239000000835 fiber Substances 0.000 abstract description 2
- 238000004904 shortening Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000009291 secondary effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4207—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、光出力を所定の値に低減した、いわゆる低出
力タイプの光ファイバー付き半導体レーザ装置に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a so-called low output type semiconductor laser device with an optical fiber, in which the optical output is reduced to a predetermined value.
短距離光通信用に光フアイバー出力0.1mWクラスの
半導体レーザが使用されている。通常の光結合方式では
1mWクラスの光フアイバー出力が得られるが、結合調
整を最適位置からずらしたり、減衰させる等の方法で低
い光フアイバー出力を得る方法が行われている。従来の
一例を第4図に示す。半導体レーザ1がヒートシンク2
を介して、放熱板3に取付けられ、レンズ4と光軸を合
わせて固定されている。レンズで集光された光ビーム7
が光ファイバー6に入射するよう光軸調整し、図には示
されていない外囲器に固定され、半導体レーサ、レンズ
とともに一体のモジュールになっている。光ファイバー
6の先端は光軸に直角な面に対して角度θだけ傾けた斜
め研磨仕上げになっており、所望の光フアイバー出力を
得るために角度θを所定の値にすると共に、光軸調整を
最適位置から若干ずらすことによって微調整を行ってか
らパッケージに固定される。Semiconductor lasers with an optical fiber output of 0.1 mW class are used for short-distance optical communications. In a normal optical coupling method, an optical fiber output of 1 mW class can be obtained, but methods are being used to obtain a lower optical fiber output by shifting the coupling adjustment from the optimum position or attenuating it. A conventional example is shown in FIG. Semiconductor laser 1 is heat sink 2
It is attached to the heat dissipation plate 3 via the lens 4, and is fixed with the optical axis aligned with the lens 4. Light beam 7 focused by a lens
The optical axis is adjusted so that the laser beam enters the optical fiber 6, and it is fixed to an envelope (not shown), forming an integrated module together with the semiconductor laser and lens. The tip of the optical fiber 6 has an obliquely polished finish that is tilted by an angle θ with respect to a plane perpendicular to the optical axis.In order to obtain the desired optical fiber output, the angle θ must be set to a predetermined value and the optical axis must be adjusted. Fine adjustments are made by moving it slightly from the optimal position before it is fixed to the package.
所望の光フアイバー出力の値は、用途に応じて変わるの
で従来は、斜め研磨の角度θを変えたものを数種類用意
しておき、用途に合わせて使い分けをしていた。このた
め斜め研磨仕上げの高価な光フアイバ一部品を多数在庫
しておくなどの生産管理上の負担が大きかった。本発明
では、一種類の光ファイバーを用で、多様な用途に応じ
られる光フアイバー出力の調整方法を提供する。Since the desired value of the optical fiber output varies depending on the application, conventionally, several types of optical fibers with different oblique polishing angles θ have been prepared and used depending on the application. For this reason, there was a heavy burden on production management, such as keeping a large number of expensive optical fiber parts with obliquely polished finishes in stock. The present invention provides an optical fiber output adjustment method that uses one type of optical fiber and can be adapted to various uses.
本発明の光ファイバー付き半導体レーザ装置は、半導体
レーザ、レンズ、先端を斜め研磨した光ファイバーおよ
びこれら部品を光学的に位置合せし固定するためのパッ
ケージによって構成され、前記光ファイバーの先端には
光減衰板が接着されていることを特徴とする。The semiconductor laser device with optical fiber of the present invention is composed of a semiconductor laser, a lens, an optical fiber whose tip is obliquely polished, and a package for optically aligning and fixing these components, and an optical attenuation plate is provided at the tip of the optical fiber. It is characterized by being glued.
光フアイバー先端の角度θは反射光が半導体レーザへ戻
って発振モードが乱されるのを防ぐなめに必要な角度に
し、一種類だけ用意する。光減衰板は所望の光フアイバ
ー出力の範囲に応じて、減衰量を変えたものを必要な種
類たけ用意しておき、必要に応じて所望の光減衰板を光
ファイバーの先端に接着すれば、所望の光フアイバー出
力が得られる。The angle θ at the tip of the optical fiber is set to the angle required to prevent reflected light from returning to the semiconductor laser and disturbing the oscillation mode, and only one type is prepared. Prepare as many types of optical attenuation plates as necessary with different attenuation amounts depending on the range of desired optical fiber output, and glue the desired optical attenuation plate to the tip of the optical fiber as needed to achieve the desired result. of optical fiber output can be obtained.
〔実施例〕 次に本発明を実施例に基づいて説明する。〔Example〕 Next, the present invention will be explained based on examples.
第1図は本発明の構成を示しており、半導体レーザ1が
ヒートシンク2を介してレンズ4と共に放熱板3上に光
軸を合わせて固定されている。光ファイバー6の先端は
θ=10°に斜め研磨され、先端に光減衰板5が接着さ
れている。FIG. 1 shows the configuration of the present invention, in which a semiconductor laser 1 and a lens 4 are fixed on a heat sink 3 via a heat sink 2 with their optical axes aligned. The tip of the optical fiber 6 is obliquely polished to θ=10°, and a light attenuation plate 5 is bonded to the tip.
第2図は光フアイバー先端部の拡大図であり、光フアイ
バー素線63に内装ガラス管62をかぶせ、更に金属の
外装バイブロ1で保護されている。このファイバー先端
を斜め研磨し、調整前に目的の光フアイバー出力値に応
じた減衰量の光減衰板51を接着して使用する。光減衰
板は厚さ0.5〜1.On+aで減衰量2〜10倍のガ
ラスフィルタを用いればよい。接着は透明エポキシ樹脂
が良い結果を与える。FIG. 2 is an enlarged view of the tip of the optical fiber, in which the optical fiber wire 63 is covered with an inner glass tube 62 and further protected by a metal outer vibro 1. The tip of this fiber is obliquely polished, and before adjustment, an optical attenuation plate 51 having an amount of attenuation corresponding to the target optical fiber output value is adhered and used. The light attenuation plate has a thickness of 0.5 to 1. A glass filter with an attenuation of 2 to 10 times greater than On+a may be used. For adhesion, transparent epoxy resin gives good results.
第3図は本発明の他の実施例を示す光フアイバー先端の
拡大図である。全体の構成は第1図と同様であるか、光
減衰板が透明板52の表面に減衰膜53を形成したもの
で置きかえられている。透明板はガラス板が光ファイバ
ーとの熱膨張率の一致が良いので使い易い。減衰膜はガ
ラス板表面へ金属膜の蒸着やめつき等によって形成する
。膜厚を調整することによって所望の減衰量を得る。膜
の表面には反射防止効果を持たせるため誘電体膜を形成
しておくのが望ましい。FIG. 3 is an enlarged view of the tip of an optical fiber showing another embodiment of the present invention. The overall structure is the same as that shown in FIG. 1, or the light attenuation plate is replaced with one in which an attenuation film 53 is formed on the surface of a transparent plate 52. The transparent plate is easy to use because the glass plate has a good thermal expansion coefficient that matches that of the optical fiber. The attenuation film is formed by depositing or attaching a metal film onto the surface of the glass plate. A desired amount of attenuation is obtained by adjusting the film thickness. It is desirable to form a dielectric film on the surface of the film to provide an antireflection effect.
以上の説明の如く、微小な光減衰板を調整前に選択して
使用することができ、高価な光ファイバーは1種類のみ
でよいので、在庫の削減、工期の短縮等の経済的効果が
大きい。なお副次的効果として5一定角度θの光ファイ
バーを使用するため光軸調整の作業が簡単になり、作業
性の向上と光フアイバー出力の安定性の向上が得られた
。As described above, a small optical attenuation plate can be selected and used before adjustment, and only one type of expensive optical fiber is required, so there are great economic effects such as reduction of inventory and shortening of construction period. As a secondary effect, the use of optical fibers with a fixed angle θ of 5 simplifies the work of adjusting the optical axis, resulting in improved workability and improved stability of the optical fiber output.
第1図は本発明の一実施例を示す構成図であり、第2図
は本発明の特徴を示す部分拡大図である。第3図は本発
明の第2の実施例を示す光フアイバー先端部分拡大図で
ある。第夕図は従来の例を示す構成図である。
1・・・半導体レーザ、2・・・ヒートシンク、3・・
・放熱板、4・・・レンズ、5・・・光減衰板、6・・
・光ファイバー、7・・・光ビーム、51・・・光減衰
板、52・・・透明板、53・・・減衰膜、61・・・
外装パイプ、62・・・内装ガラス管、63・・・光フ
アイバー素線。FIG. 1 is a block diagram showing an embodiment of the present invention, and FIG. 2 is a partially enlarged view showing the features of the present invention. FIG. 3 is an enlarged view of the tip of an optical fiber showing a second embodiment of the present invention. Figure 3 is a configuration diagram showing a conventional example. 1... Semiconductor laser, 2... Heat sink, 3...
・Heat sink, 4...Lens, 5...Light attenuation plate, 6...
- Optical fiber, 7... Light beam, 51... Light attenuation plate, 52... Transparent plate, 53... Attenuation film, 61...
Exterior pipe, 62...Interior glass tube, 63...Optical fiber wire.
Claims (1)
ーを光学的に位置合せして固定し、パッケージに納めた
半導体レーザ装置において、前記光ファイバーの先端に
は、光減衰板が接着されていることを特徴とする半導体
レーザ装置。A semiconductor laser device in which a semiconductor laser, a lens, and an optical fiber whose tip is obliquely polished are optically aligned and fixed and housed in a package, characterized in that an optical attenuation plate is bonded to the tip of the optical fiber. Semiconductor laser equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29608590A JPH04168405A (en) | 1990-10-31 | 1990-10-31 | Semiconductor laser device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29608590A JPH04168405A (en) | 1990-10-31 | 1990-10-31 | Semiconductor laser device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04168405A true JPH04168405A (en) | 1992-06-16 |
Family
ID=17828925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29608590A Pending JPH04168405A (en) | 1990-10-31 | 1990-10-31 | Semiconductor laser device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04168405A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010234554A (en) * | 2009-03-30 | 2010-10-21 | Fujifilm Corp | Method for manufacturing printing plate |
-
1990
- 1990-10-31 JP JP29608590A patent/JPH04168405A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010234554A (en) * | 2009-03-30 | 2010-10-21 | Fujifilm Corp | Method for manufacturing printing plate |
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