JPH0416262B2 - - Google Patents
Info
- Publication number
- JPH0416262B2 JPH0416262B2 JP60203343A JP20334385A JPH0416262B2 JP H0416262 B2 JPH0416262 B2 JP H0416262B2 JP 60203343 A JP60203343 A JP 60203343A JP 20334385 A JP20334385 A JP 20334385A JP H0416262 B2 JPH0416262 B2 JP H0416262B2
- Authority
- JP
- Japan
- Prior art keywords
- heat transfer
- transfer liquid
- tank
- article
- steam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007788 liquid Substances 0.000 claims description 30
- 238000001816 cooling Methods 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 17
- 230000004927 fusion Effects 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 7
- 238000009835 boiling Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 239000011230 binding agent Substances 0.000 claims 2
- 238000007526 fusion splicing Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 9
- 230000005494 condensation Effects 0.000 description 8
- 238000009833 condensation Methods 0.000 description 8
- 239000007767 bonding agent Substances 0.000 description 6
- 239000000498 cooling water Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 230000008094 contradictory effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000007500 overflow downdraw method Methods 0.000 description 1
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 1
- -1 polyoxypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
- B23K1/015—Vapour-condensation soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60203343A JPS6264473A (ja) | 1985-09-17 | 1985-09-17 | 物品の融着接合装置 |
| CN86104969.1A CN1004680B (zh) | 1985-09-17 | 1986-07-30 | 物品的钎焊装置 |
| EP89201803A EP0349094B1 (en) | 1985-09-17 | 1986-09-16 | Apparatus for soldering printed circuit boards |
| US06/908,025 US4679721A (en) | 1985-09-17 | 1986-09-16 | Apparatus for fuse-bonding articles |
| EP86307129A EP0218391B1 (en) | 1985-09-17 | 1986-09-16 | Apparatus for fuse-bonding articles |
| DE8686307129T DE3672439D1 (de) | 1985-09-17 | 1986-09-16 | Apparat zum schmelz-verbinden von gegenstaenden. |
| DE89201803T DE3689005D1 (de) | 1985-09-17 | 1986-09-16 | Vorrichtung zum Löten von gedruckten Schaltungen. |
| KR2019900006849U KR900007617Y1 (ko) | 1985-09-17 | 1990-05-21 | 납땜 장치 |
| KR2019900007521U KR920005953Y1 (ko) | 1985-09-17 | 1990-05-30 | 납땜장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60203343A JPS6264473A (ja) | 1985-09-17 | 1985-09-17 | 物品の融着接合装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6264473A JPS6264473A (ja) | 1987-03-23 |
| JPH0416262B2 true JPH0416262B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-03-23 |
Family
ID=16472450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60203343A Granted JPS6264473A (ja) | 1985-09-17 | 1985-09-17 | 物品の融着接合装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS6264473A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
| KR (1) | KR900007617Y1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2600886B2 (ja) * | 1989-02-22 | 1997-04-16 | 日本電気株式会社 | バッチ式ベーパーフェーズソルダリング装置 |
| JP5769653B2 (ja) * | 2012-03-12 | 2015-08-26 | 三菱電機株式会社 | 熱処理装置 |
| KR20250015009A (ko) * | 2023-07-24 | 2025-02-03 | 삼성전자주식회사 | 솔더 리플로우 장치 및 이를 이용한 전자 장치의 제조 방법 |
-
1985
- 1985-09-17 JP JP60203343A patent/JPS6264473A/ja active Granted
-
1990
- 1990-05-21 KR KR2019900006849U patent/KR900007617Y1/ko not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| KR900007617Y1 (ko) | 1990-08-23 |
| JPS6264473A (ja) | 1987-03-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |