JPH04162514A - Exfoliation apparatus for resist - Google Patents

Abstract

PURPOSE:To obtain an apparatus which prevents troubles that an exfoliation residue is produced in the case of a dissolution reaction using an organic solvent, that a resist adheres again, that a stain is produced and the like by providing a spinner head, a spinner, a waste-liquid port, an ultraviolet-ray irradiation device, a nozzle discharging an alkaline developing splution and the like which are respectively specific. CONSTITUTION:The following are provided: a spinner head 2 which can collect a liquid and which is in a dip-tank shape; a spinner 4 which is provided with the spinner head 2 and which holds and turns a substrate 3; a waste-liquid port 7 which is connected to the spinner 4 and which is provided with a solenoid valve 8; an ultraviolet- ray irradiation device 5 which exposes an organic resist coated on the surface of the substrate 3; a nozzle 9 which discharges an alkaline developing solution to the surface of the substrate 3; a nozzle 10 which discharges pure water used to clean the substrate 3; and a nozzle 11 which discharges nitrogen used to dry the substrate 3. For example, a spinner head 2 is formed in such a way that the diameter at its outer circumferential edge is expanded in a taper shape toward the outside; an ultraviolet-ray irradiation device 5 radiates exposure rays used to expose an organic resist coated on a substrate 3 without changing the quality of its photosensitive radical.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resist stripping device for stripping an organic resist coated on the surface of a substrate, and particularly to a large-scale resist stripping device for stripping an organic resist coated on a substrate surface. Integrated circuit (LSI)
) The present invention relates to a resist stripping device for stripping off an organic resist used in forming conductors in a high-density multilayer wiring board for mounting.

[Prior Art] Conventionally, this type of resist stripping work involves immersing a substrate in a container containing an organic solvent such as methyl ethyl ketone that is soluble in the resist, and dissolving the organic resist coated on the substrate. After repeating this operation several times, the resist was immediately removed by drying the substrate with nitrogen blowing or the like.

[Problems to be Solved by the Invention] However, in the conventional resist stripping work described above, the resist may not be completely stripped off in areas where the organic solvent has poor circulation along the conductor, or when it dries, the resist may dissolve in the organic solvent. Disadvantages include the resist re-adhering to the substrate surface, and the substrate being rapidly cooled by the heat of vaporization generated when the organic solvent evaporates, resulting in moisture in the atmosphere condensing on the substrate surface and leaving stains there. There is.

SUMMARY OF THE INVENTION An object of the present invention is to provide a resist stripping device that prevents problems such as residual peeling, resist redeposition, and stains that occur when a dissolution reaction using an organic solvent is performed.

[Means for Solving the Problems] In order to achieve the above object, a resist stripping apparatus according to the present invention includes a spinner head in the shape of a dip tank in which a liquid can be stored, and a spinner head that holds a substrate. A rotating spinner, a waste liquid port connected to the spinner and having a solenoid valve, an ultraviolet irradiation device for exposing an organic resist applied to the surface of the substrate, and a nozzle for discharging an alkaline developer onto the surface of the substrate. , a nozzle that discharges pure water for cleaning the substrate;
and a nozzle for discharging nitrogen for drying the substrate.

Further, the spinner head has its outer peripheral edge tapered outward, and the ultraviolet irradiation device is capable of exposing to light without altering the photosensitive groups of the organic resist coated on the substrate. It has a lamp that irradiates an exposure light beam.

[Effect] The resist is removed based on the principle of exposure and development.

[Example] Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view showing one embodiment of the present invention.

In the figure, the resist stripping apparatus of the present invention includes a spinner rad 2 in the form of a dip tank in which liquid can be stored, a spinner 4 equipped with a spinner head 2 and rotating while holding a substrate 3, and a spinner 4 connected to the spinner 4. A waste liquid lower having a solenoid valve 8, an ultraviolet irradiation device 5 for exposing an organic resist coated on a substrate surface, a nozzle 9 for discharging an alkaline developer for developing the exposed organic resist, and a developed and dissolved organic resist. It has a nozzle 10 that discharges pure water for cleaning the substrate, and a nozzle 11 that discharges nitrogen for drying the substrate.

6 is a chamber, and 1 is a chamber lid.

Further, 4a is a motor, 4b is a gear, and the spinner 4
is driven to rotate by receiving power from a motor 4a via a gear 4b.

In the example, first, the chamber lid 1 is opened and the substrate 3 coated with an organic resist is set on the spinner head 2.

After setting the substrate 3, close the chamber lid 1,
While rotating the spinner 4 at a low speed of about 1Orpm, the ultraviolet irradiation device 5 attached to the chamber lid 1 is turned on to expose the organic resist coated on the substrate 3 evenly. At this time, it is preferable to use an ultra-high pressure mercury lamp as the lamp used in the ultraviolet irradiation device 5 in order to expose the photosensitive groups of the organic resist coated on the substrate 3 without deteriorating their quality. When installing the chamber 6 in a room using materials such as the above, it is necessary to pay sufficient attention to the material of the viewing window attached to the chamber 6 to prevent ultraviolet rays from leaking to the outside. In addition,
Although it depends on the thickness of the substrate 3, the properties of the organic resist used, and the properties of the spin coater when applying the organic resist, in some cases the organic resist may wrap around the sides of the substrate 3, so the spinner head 2 outer periphery 2a of
It is necessary to have a structure that tapers gently toward the chamber 6 side so that the side surface of the substrate 3 is sufficiently irradiated with ultraviolet rays.

Organic resist coated on substrate 3 at 2000 mJ/d
After sufficient exposure with the exposure amount of
A developer is stored inside and the exposed organic resist is developed. At this time, the amount of developer to be discharged is 11 on the surface of the substrate 3.
It is sufficient that the liquid accumulates around M1. Furthermore, since the resist on the side surface of the substrate 3 is also developed, the outer shape of the spinner head 2 needs to be larger than the substrate 3 by about 21TIITl.

In addition, the properties of the organic resist applied to the substrate 3,
Although it depends on the film thickness, in some cases it may not be possible to completely remove the coated resist with one development, so in that case, open the solenoid valve 8 while rotating the spinner 4 at about 1100 rpm and remove the old resist. After the liquid is completely drained, the electromagnetic valve 8 is closed again and the same development as described above is repeated.

When the development of the organic resist applied to the substrate 3 is completely completed, open the electromagnetic valve 8 to discharge the developer, and at the same time, while rotating the spinner 4 at a low speed of about 7 Or p m, pure water is supplied from the pure water nozzle 10. Discharge and rinse the substrate 3. At this time, it is necessary to pay attention to the size of the waste liquid lower in the spinner 4 so that the rinsing liquid is smoothly discharged without accumulating in the spinner head 2.

Once the substrate 3 has been sufficiently rinsed, turn the spinner 4 to 10
At the same time, nitrogen is discharged from the nitrogen nozzle 11 to dry the substrate 3.

At this time, it is possible that splashes from the outer periphery of the spinner head 2 may bounce onto the substrate, but this problem can be solved by creating a gentle taper toward the chamber 6 side.

Finally, when the drying of the substrate 3 is completed, the chamber lid 1 is opened and the substrate 3 is taken out.

[Advantageous Effects of the Invention 1] As explained above, in the present invention, the organic resist coated on the substrate is exposed, developed, rinsed, and dried in the same chamber and removed, making it possible to remove the resist in a small space. It can also be deployed as an automatic machine by attaching a loader and unloader.

In addition, by changing the shape of the spinner head,
Even with wafers and rectangular substrates, only the minimum amount of chemical solution is required.
In addition, processing can be performed with a sufficient amount of light.

Furthermore, by selecting a lamp to be used in the ultraviolet irradiation device, it is possible to expose the organic resist to light without altering the photosensitive groups applied to the substrate.

Furthermore, since resist stripping is based on the principle of exposure to development, it is effective in preventing defects such as residual peeling, resist re-adhesion, and staining that would otherwise occur in the case of a dissolution reaction using an organic solvent.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing one embodiment of the present invention. 1... Chamber lid 2... Spinner head 3... Substrate 4... Spinner head... Ultraviolet irradiation device 6... Chamber 7...
Waste liquid port 8...Solenoid valve 9...Alkaline developer nozzle 10...Pure water nozzle 11...Nitrogen nozzle Fig. 1

Claims (3)

[Claims] (1) A spinner head in the shape of a dip tank that can store a liquid, a spinner equipped with the spinner head and rotating while holding a substrate, a waste liquid port connected to the spinner and having a solenoid valve, and a drain port connected to the spinner and having a solenoid valve; an ultraviolet irradiation device for exposing the applied organic resist, a nozzle for discharging an alkaline developer onto the surface of the substrate, a nozzle for discharging pure water for cleaning the substrate, and a nozzle for drying the substrate. 1. A resist stripping device comprising: a nozzle for discharging nitrogen. (2) The resist stripping apparatus according to claim (1), wherein the spinner head has an outer peripheral edge tapered outward. (3) The ultraviolet irradiation device includes a lamp that irradiates an exposure light beam that sensitizes the photosensitive groups of the organic resist coated on the substrate without altering their properties. resist stripping equipment.