JPH04159705A - Solid-state electrolytic condenser - Google Patents
Solid-state electrolytic condenserInfo
- Publication number
- JPH04159705A JPH04159705A JP2284842A JP28484290A JPH04159705A JP H04159705 A JPH04159705 A JP H04159705A JP 2284842 A JP2284842 A JP 2284842A JP 28484290 A JP28484290 A JP 28484290A JP H04159705 A JPH04159705 A JP H04159705A
- Authority
- JP
- Japan
- Prior art keywords
- anode lead
- tantalum
- metal
- titanium
- solid electrolytic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 24
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 16
- 239000010936 titanium Substances 0.000 claims abstract description 12
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 12
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000000843 powder Substances 0.000 claims abstract description 5
- 239000003990 capacitor Substances 0.000 claims description 30
- 239000007787 solid Substances 0.000 claims description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 229910052758 niobium Inorganic materials 0.000 claims description 3
- 239000010955 niobium Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- 238000005491 wire drawing Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 101150110330 CRAT gene Proteins 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- -1 Ti and Mo Chemical class 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、固体電解コンデンサに関し、特に固体電解コ
ンデンサ素子に植立した陽極リードの構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a solid electrolytic capacitor, and particularly to the structure of an anode lead installed in a solid electrolytic capacitor element.
従来、この種の固体電解コンデンサ素子は、第８図に示
すように、タンタル、ニオブ等の弁作用を有する金属粉
末を所定の形状に加圧成形してなる成形体１に、前記粉
末と同じタンタル、ニオブ等からなる陽極リード２ｅを
植立し、さらに前記陽極リード２ｅを植立した成形体１
を１０００〜２０００℃の高温真空中で焼結してコンデ
ンサ素子を構成していた。Conventionally, this type of solid electrolytic capacitor element has been manufactured, as shown in FIG. A molded body 1 on which an anode lead 2e made of tantalum, niobium, etc. is planted, and the anode lead 2e is also planted thereon.
was sintered in a vacuum at a high temperature of 1000 to 2000°C to form a capacitor element.
例えば、タンタル固体電解コンチン→ノーでは、一般に
タンタル金属粉末を金型の内に挿入しプレス装置て加圧
して所定の形状に成形し、さらに０．１〜０．５ｍｍφ
中のタンタルワイヤーを前記成形体１に植立して陽極リ
ード２ｅとしている。For example, in tantalum solid electrolytic contin → no, tantalum metal powder is generally inserted into a mold and pressurized with a press machine to form it into a predetermined shape, and then 0.1 to 0.5 mmφ.
The tantalum wire inside is planted in the molded body 1 to form an anode lead 2e.
上述した従来の固体電解コンデンサは、非常に高価なタ
ンタル等の陽極リード線２ｅを使用しているので、
り１）コンデンサ素子の材料費が高くなり、これにより
コンデンサ製品全体の価格か上昇して、市場ての価格競
争力が低下する。The conventional solid electrolytic capacitors mentioned above use anode lead wires 2e made of very expensive tantalum, etc., so 1) The material cost of the capacitor element increases, which increases the price of the entire capacitor product. , price competitiveness in the market will decline.
（２）又これらの材料費の上昇を防止するために陽極リ
ードを細くしたり、短くしたりすると後工程ての機械的
ストレス、あるいは熱的ス１ヘレスにより、コンデンサ
の漏れ電流が増大して、製品の信頼性か劣化する。(2) Also, if the anode lead is made thinner or shorter in order to prevent increases in material costs, the leakage current of the capacitor will increase due to mechanical stress or thermal stress in post-processing. , product reliability or deterioration.
という欠点がある。There is a drawback.
本発明の目的は、陽極リードの材料費の」−昇を防ぐた
め陽極リードを１細くしたり、短かくすることをするこ
となく、材料費の上昇することを防ぐことができ、かつ
後工程での機械的ストレス、あるいは熱的ストレスによ
るコンデンサの漏れ電流の増大を防ぐことができ、製品
の信頼性の劣化を防げる固体電解コンデンサを提供する
ことにある。An object of the present invention is to prevent an increase in material costs without making the anode lead thinner or shorter in order to prevent an increase in the material cost for the anode lead, and to An object of the present invention is to provide a solid electrolytic capacitor that can prevent an increase in leakage current of the capacitor due to mechanical stress or thermal stress, and can prevent deterioration of product reliability.
本発明の固体電解コンデンサ、陽極リードを植立した弁
作用金属粉末の成形体上に順次誘電体層、半導体層、グ
ラファイト層および銀ペースト層等の陰極層を被着した
コンデンサ素子において、前記陽極リードの外側を弁作
用金属、さらに内側を弁作用金属以外の金属で構成した
ことを特徴として構成される。The solid electrolytic capacitor of the present invention is a capacitor element in which a cathode layer such as a dielectric layer, a semiconductor layer, a graphite layer, and a silver paste layer is sequentially deposited on a molded body of valve metal powder having an anode lead planted thereon. The structure is characterized in that the outside of the reed is made of a valve metal, and the inside is made of a metal other than the valve metal.
次に、本発明について図面を参照して説明する。第１図
は本発明の一実施例の固体電解コンデンサ素子成形体の
斜視図である。第２図（ａ）。Next, the present invention will be explained with reference to the drawings. FIG. 1 is a perspective view of a solid electrolytic capacitor element molded body according to an embodiment of the present invention. Figure 2(a).
（ｌ〕）は本発明の一実施例に使用する陽極リードの斜
視図と断面図である。第３図は本発明の一実施例の固体
電解コンデンサの断面図である。(l) is a perspective view and a sectional view of an anode lead used in an embodiment of the present invention. FIG. 3 is a sectional view of a solid electrolytic capacitor according to an embodiment of the present invention.
弁作用を有するたとえばタンタルの金属粉末を本発明の
二元構造から成る陽極リード２ａの一部を埋設してプレ
ス成型し、第１図に示すような成形体１を製造する。A part of the anode lead 2a having a two-dimensional structure according to the present invention is embedded in metal powder, such as tantalum, which has a valve action, and is press-molded to produce a molded body 1 as shown in FIG.
本発明の陽極リード２ａは、第２図（ａ）。The anode lead 2a of the present invention is shown in FIG. 2(a).
〈１つ）に示すように全径がＯ、］〜０ 、５ ｍ ｍ
φで内側がチタン３から成り、その外側にタンタル４を
張り合わせた二元構造のクラット材から構成される。又
、チタンの直径は陽極り−１く２ａの約５０〜９０％と
する。製造方法としては、内側チタン、外側タンタルか
ら成るインボッＩ・を冷間圧接し、さらに、これを線引
きして所定の線径とする。このようにして得られた陽極
リード２ａは、高価なタンタル４が少なく安価なチタン
３が多いため、陽極リード２ａの材料費が約５０〜８０
％低減できる。As shown in (1), the total diameter is O, ] ~ 0, 5 mm
It is made of a two-dimensional crat material with the inner side made of titanium 3 and the outer side covered with tantalum 4. Further, the diameter of titanium is approximately 50 to 90% of the diameter of the anode. As a manufacturing method, an ingot made of titanium on the inside and tantalum on the outside is cold-pressed and then drawn into a wire to a predetermined wire diameter. The anode lead 2a obtained in this way contains less expensive tantalum 4 and more cheap titanium 3, so the material cost of the anode lead 2a is approximately 50 to 80 yen.
% can be reduced.
＝５−
次に、このようにして得られた成形体１を高温、真空焼
結し、さらにその上に誘電体層、二酸化マンガン層、カ
ーボン層、銀ペースト層を順次形成し、固体電解コンデ
ンサ素子を製造する。=5- Next, the molded body 1 thus obtained is sintered at high temperature in a vacuum, and a dielectric layer, a manganese dioxide layer, a carbon layer, and a silver paste layer are sequentially formed thereon to form a solid electrolytic capacitor. Manufacture the device.
最後に、第３図に示すように、コンデンサ素子から陽極
外部リード５．陰極外部リード６を導出し、エポキシ樹
脂等の外装樹脂７で絶縁外装して、固体電解コンデンサ
を形成する。Finally, as shown in FIG. 3, from the capacitor element to the anode external lead 5. The cathode external lead 6 is led out and insulated with an exterior resin 7 such as epoxy resin to form a solid electrolytic capacitor.
尚、第１図〜第３図に示した実施例では陽極リード２ａ
の断面が円形の場合について述べたが、第４図、第５図
は第２．第３の実施例用の陽極リード２ａ、２ｃで図示
のように四角状、だ円状の断面にしても良いことは勿論
である。さらに陽極リード内側の金属としてＭｏ、Ｎｂ
を用いても同様な効果が得られることは言うまでもない
。In addition, in the embodiment shown in FIGS. 1 to 3, the anode lead 2a
We have described the case where the cross section is circular, but FIGS. 4 and 5 show the case of 2. Of course, the anode leads 2a and 2c for the third embodiment may have a square or elliptical cross section as shown in the figure. Furthermore, Mo and Nb are used as metals inside the anode lead.
It goes without saying that similar effects can be obtained by using .
次に、第４の実施例について第６図、第７図（ａ）、（
ｂ）を参照して説明する。第６図は本発明の第４の実施
例のコンデンサ素子成形体の斜視図、第７図（ａ）、（
ｂ）は第４の実施例の陽極リードの斜視図と断面図であ
る。Next, regarding the fourth embodiment, FIGS. 6, 7(a), (
This will be explained with reference to b). FIG. 6 is a perspective view of a capacitor element molded body according to a fourth embodiment of the present invention, FIG.
b) is a perspective view and a sectional view of the anode lead of the fourth embodiment.
本実施例の陽極リード２ｄは、第７図（ａ）。The anode lead 2d of this embodiment is shown in FIG. 7(a).
（ｂ）に示すように、傘径が０．１〜０．５ｍｍφで、
内側かチタン３から成り、その外側にタンタル４を蒸着
、スパッタ又は、イオンブレーティング等により０．１
〜１０μ程度の厚みまで被着したコーティングワイヤー
から構成される。As shown in (b), the umbrella diameter is 0.1 to 0.5 mmφ,
The inner side is made of titanium 3, and the outer side is made of tantalum 4 by vapor deposition, sputtering, ion blasting, etc.
It consists of a coated wire coated to a thickness of ~10μ.
上記陽極リード２ｄは、第１〜第３の実施例のクラツド
材に比べ高価なタンタル４を非常に薄くできるため陽極
リードのコストダウンがさらに推進できる。In the anode lead 2d, the tantalum 4, which is more expensive than the clad material of the first to third embodiments, can be made much thinner, so that the cost of the anode lead can be further reduced.
以上説明したように本発明により以下の効果がある。 As explained above, the present invention has the following effects.
安価なＴｉ、Ｍｏ等の金属を中心にして外側のうすい部
分のみに、高価なタンタル等の弁作用金属を使用してい
るので、
（１〉陽極リートの資材費が５０％以上低減され、これ
によりコンデンサの価格が大１〕に下がり、コストダウ
ンが推進される。Since we use inexpensive metals such as Ti and Mo, and use expensive valve metals such as tantalum only in the thin outer part, (1) The material cost of the anode REIT is reduced by more than 50%, and this As a result, the price of capacitors has dropped by a large amount, promoting cost reduction.
（２）陽極リードを細くしたり、短かくしたりしてコス
トダウンを図る必要がないので、コンデンサにス１−レ
スが加っな場合の信頼性が向上する。(2) Since there is no need to reduce costs by making the anode lead thinner or shorter, reliability is improved when no stress is added to the capacitor.
第１図は本発明の一実施例用のコンデンサ素子成形体の
斜視図、第２図（ａ）、（ｂ）は第１図に示す本発明の
一実施例用の陽極リードの斜視図、断面図、第３図は本
発明の一実施例の固体電解コンデンサの側断面図、第４
図、第５図は、本発明の第２．第３の実施例用の陽極リ
ードの斜視図、第６図は本発明の第４の実施例用のコン
デンサ素子成形体の斜視図、第７図（ａ）、（ｂ）は本
発明の第４の実施例用の陽極リードの斜視図および断面
図である。第８図は従来のコンデンサ素子成形体の斜視
図である。
１・・・成形体、２ａ、２ｂ、２ｃ、２ｄ−・・（本発
明用の）陽極リード、２ｅ・・・（従来例の〉陽極リー
ド、３・・・チタン、４・・・タンタル、５・・・陽極
外部リード、６・・・陰極外部リード、７・・・外装樹
脂。FIG. 1 is a perspective view of a capacitor element molded body for one embodiment of the present invention, FIGS. 2(a) and (b) are perspective views of an anode lead for one embodiment of the present invention shown in FIG. A cross-sectional view, FIG. 3 is a side cross-sectional view of a solid electrolytic capacitor according to an embodiment of the present invention, and FIG.
FIG. 5 shows the second embodiment of the present invention. FIG. 6 is a perspective view of the capacitor element molded body for the fourth embodiment of the present invention, and FIGS. 7(a) and (b) are the perspective views of the anode lead for the third embodiment. FIG. 4 is a perspective view and a cross-sectional view of an anode lead for Example 4. FIG. FIG. 8 is a perspective view of a conventional capacitor element molded body. 1... Molded body, 2a, 2b, 2c, 2d-... Anode lead (for the present invention), 2e... (Conventional example) anode lead, 3... Titanium, 4... Tantalum, 5... Anode external lead, 6... Cathode external lead, 7... Exterior resin.
Claims (5)
順次誘電体層，半導体層，グラファイト層および銀ペー
スト層等の陰極層を被着したコンデンサ素子において、
前記陽極リードの外側を弁作用金属，さらに内側を弁作
用金属以外の金属で構成したことを特徴とする固体電解
コンデンサ。1. In a capacitor element in which a cathode layer such as a dielectric layer, a semiconductor layer, a graphite layer, and a silver paste layer are sequentially deposited on a molded body of valve metal powder on which an anode lead is planted,
A solid electrolytic capacitor characterized in that the outside of the anode lead is made of a valve metal, and the inside of the anode lead is made of a metal other than the valve metal.
より構成されていることを特徴とする請求項１記載の固
体電解コンデンサ。2. 2. The solid electrolytic capacitor according to claim 1, wherein the inner metal and the outer metal of the anode lead are pressure-welded.
作用金属がコーティングにより形成されていることを特
徴とする請求項１記載の固体電解コンデンサ。3. 2. The solid electrolytic capacitor according to claim 1, wherein the anode lead is formed by coating a surface of a metal other than the valve metal with a valve metal.
固体電解コンデンサ。4. The solid electrolytic capacitor according to claim 1, wherein the metal inside the anode lead has a melting point of 1000° C. or higher.
金属がチタン又はモリブデン又はニオブであることを特
徴とする請求項１記載の固体電解コンデンサ。5. 2. The solid electrolytic capacitor according to claim 1, wherein the valve metal is tantalum, and the metal other than the valve metal is titanium, molybdenum, or niobium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2284842A JPH04159705A (en) | 1990-10-23 | 1990-10-23 | Solid-state electrolytic condenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2284842A JPH04159705A (en) | 1990-10-23 | 1990-10-23 | Solid-state electrolytic condenser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04159705A true JPH04159705A (en) | 1992-06-02 |
Family
ID=17683731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2284842A Pending JPH04159705A (en) | 1990-10-23 | 1990-10-23 | Solid-state electrolytic condenser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04159705A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7177141B1 (en) * | 2005-07-28 | 2007-02-13 | Sanyo Electric Co., Ltd. | Solid electrolytic capacitor element, manufacturing method therefor, and solid electrolytic capacitor |
| WO2022091854A1 (en) * | 2020-10-28 | 2022-05-05 | パナソニックＩｐマネジメント株式会社 | Electrolytic capacitor |
-
1990
- 1990-10-23 JP JP2284842A patent/JPH04159705A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7177141B1 (en) * | 2005-07-28 | 2007-02-13 | Sanyo Electric Co., Ltd. | Solid electrolytic capacitor element, manufacturing method therefor, and solid electrolytic capacitor |
| WO2022091854A1 (en) * | 2020-10-28 | 2022-05-05 | パナソニックＩｐマネジメント株式会社 | Electrolytic capacitor |
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