JPH0415825U - - Google Patents

Info

Publication number
JPH0415825U
JPH0415825U JP5695590U JP5695590U JPH0415825U JP H0415825 U JPH0415825 U JP H0415825U JP 5695590 U JP5695590 U JP 5695590U JP 5695590 U JP5695590 U JP 5695590U JP H0415825 U JPH0415825 U JP H0415825U
Authority
JP
Japan
Prior art keywords
chip
substrate
utility
shaped elements
sealing part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5695590U
Other languages
English (en)
Japanese (ja)
Other versions
JP2538631Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990056955U priority Critical patent/JP2538631Y2/ja
Publication of JPH0415825U publication Critical patent/JPH0415825U/ja
Application granted granted Critical
Publication of JP2538631Y2 publication Critical patent/JP2538631Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP1990056955U 1990-05-30 1990-05-30 チップ状素子ネットワークデバイス Expired - Fee Related JP2538631Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990056955U JP2538631Y2 (ja) 1990-05-30 1990-05-30 チップ状素子ネットワークデバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990056955U JP2538631Y2 (ja) 1990-05-30 1990-05-30 チップ状素子ネットワークデバイス

Publications (2)

Publication Number Publication Date
JPH0415825U true JPH0415825U (en:Method) 1992-02-07
JP2538631Y2 JP2538631Y2 (ja) 1997-06-18

Family

ID=31581241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990056955U Expired - Fee Related JP2538631Y2 (ja) 1990-05-30 1990-05-30 チップ状素子ネットワークデバイス

Country Status (1)

Country Link
JP (1) JP2538631Y2 (en:Method)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000306765A (ja) * 1999-04-20 2000-11-02 Murata Mfg Co Ltd 積層セラミック電子部品
WO2013111497A1 (ja) * 2012-01-27 2013-08-01 ローム株式会社 チップ部品

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61199009U (en:Method) * 1985-06-04 1986-12-12
JPS6280318U (en:Method) * 1985-11-09 1987-05-22

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61199009U (en:Method) * 1985-06-04 1986-12-12
JPS6280318U (en:Method) * 1985-11-09 1987-05-22

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000306765A (ja) * 1999-04-20 2000-11-02 Murata Mfg Co Ltd 積層セラミック電子部品
WO2013111497A1 (ja) * 2012-01-27 2013-08-01 ローム株式会社 チップ部品
JP2013232620A (ja) * 2012-01-27 2013-11-14 Rohm Co Ltd チップ部品
US9646747B2 (en) 2012-01-27 2017-05-09 Rohm Co., Ltd. Chip component
US10210971B2 (en) 2012-01-27 2019-02-19 Rohm Co., Ltd. Chip component
US10763016B2 (en) 2012-01-27 2020-09-01 Rohm Co., Ltd. Method of manufacturing a chip component

Also Published As

Publication number Publication date
JP2538631Y2 (ja) 1997-06-18

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees