JPH0415625B2 - - Google Patents

Info

Publication number
JPH0415625B2
JPH0415625B2 JP57217766A JP21776682A JPH0415625B2 JP H0415625 B2 JPH0415625 B2 JP H0415625B2 JP 57217766 A JP57217766 A JP 57217766A JP 21776682 A JP21776682 A JP 21776682A JP H0415625 B2 JPH0415625 B2 JP H0415625B2
Authority
JP
Japan
Prior art keywords
epoxy resin
molding
weight
parts
pps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57217766A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59108332A (ja
Inventor
Ryoichi Ishikawa
Toshinori Sugie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink and Chemicals Co Ltd filed Critical Dainippon Ink and Chemicals Co Ltd
Priority to JP21776682A priority Critical patent/JPS59108332A/ja
Publication of JPS59108332A publication Critical patent/JPS59108332A/ja
Publication of JPH0415625B2 publication Critical patent/JPH0415625B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
JP21776682A 1982-12-14 1982-12-14 電子部品の封止方法 Granted JPS59108332A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21776682A JPS59108332A (ja) 1982-12-14 1982-12-14 電子部品の封止方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21776682A JPS59108332A (ja) 1982-12-14 1982-12-14 電子部品の封止方法

Publications (2)

Publication Number Publication Date
JPS59108332A JPS59108332A (ja) 1984-06-22
JPH0415625B2 true JPH0415625B2 (enrdf_load_stackoverflow) 1992-03-18

Family

ID=16709393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21776682A Granted JPS59108332A (ja) 1982-12-14 1982-12-14 電子部品の封止方法

Country Status (1)

Country Link
JP (1) JPS59108332A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065977B2 (ja) * 1984-06-26 1994-01-19 カルソニック株式会社 扁平コイル型電機子の製造方法
JP2579142B2 (ja) * 1984-08-22 1997-02-05 三菱電機株式会社 樹脂封止型半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts

Also Published As

Publication number Publication date
JPS59108332A (ja) 1984-06-22

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