JPH0415625B2 - - Google Patents
Info
- Publication number
- JPH0415625B2 JPH0415625B2 JP57217766A JP21776682A JPH0415625B2 JP H0415625 B2 JPH0415625 B2 JP H0415625B2 JP 57217766 A JP57217766 A JP 57217766A JP 21776682 A JP21776682 A JP 21776682A JP H0415625 B2 JPH0415625 B2 JP H0415625B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- molding
- weight
- parts
- pps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21776682A JPS59108332A (ja) | 1982-12-14 | 1982-12-14 | 電子部品の封止方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21776682A JPS59108332A (ja) | 1982-12-14 | 1982-12-14 | 電子部品の封止方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59108332A JPS59108332A (ja) | 1984-06-22 |
| JPH0415625B2 true JPH0415625B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-03-18 |
Family
ID=16709393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21776682A Granted JPS59108332A (ja) | 1982-12-14 | 1982-12-14 | 電子部品の封止方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59108332A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH065977B2 (ja) * | 1984-06-26 | 1994-01-19 | カルソニック株式会社 | 扁平コイル型電機子の製造方法 |
| JP2579142B2 (ja) * | 1984-08-22 | 1997-02-05 | 三菱電機株式会社 | 樹脂封止型半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5717153A (en) * | 1980-07-04 | 1982-01-28 | Asahi Glass Co Ltd | Sealing method of electronic parts |
-
1982
- 1982-12-14 JP JP21776682A patent/JPS59108332A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59108332A (ja) | 1984-06-22 |