JPH0415239U - - Google Patents
Info
- Publication number
- JPH0415239U JPH0415239U JP5614990U JP5614990U JPH0415239U JP H0415239 U JPH0415239 U JP H0415239U JP 5614990 U JP5614990 U JP 5614990U JP 5614990 U JP5614990 U JP 5614990U JP H0415239 U JPH0415239 U JP H0415239U
- Authority
- JP
- Japan
- Prior art keywords
- resin material
- coating resin
- semiconductor pellet
- semiconductor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000008188 pellet Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案に係る半導体装置の実施例を示
す平面図、第２図は第１図の要部拡大平面図であ
る。第３図は半導体装置の従来例を示す平面図、
第４図は第３図の断面図である。
１……半導体ペレツト、２……バンプ電極、３
……金属箔リード、４……コーテイング樹脂材、
５……突起、ｍ……四隅エツジ部位。
FIG. 1 is a plan view showing an embodiment of a semiconductor device according to the present invention, and FIG. 2 is an enlarged plan view of the main part of FIG. FIG. 3 is a plan view showing a conventional example of a semiconductor device;
FIG. 4 is a sectional view of FIG. 3. 1... Semiconductor pellet, 2... Bump electrode, 3
...Metal foil lead, 4...Coating resin material,
5... Protrusion, m... Four corner edge parts.
Claims (1)
ードとを熱圧着して電気的に接続し、上記半導体
ペレツトの表面をコーテイング樹脂材で被覆した
ものにおいて、 上記半導体ペレツトの表面の四隅エツジ部位に
、コーテイング樹脂材の展延を誘導する突起を設
けたことを特徴とする半導体装置。[Claims for Utility Model Registration] A bump electrode on the surface of a semiconductor pellet and a metal foil lead are electrically connected by thermocompression bonding, and the surface of the semiconductor pellet is coated with a coating resin material, 1. A semiconductor device characterized in that projections are provided at the four corner edges of the surface to guide the spreading of a coating resin material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5614990U JPH0415239U (en) | 1990-05-28 | 1990-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5614990U JPH0415239U (en) | 1990-05-28 | 1990-05-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415239U true JPH0415239U (en) | 1992-02-06 |
Family
ID=31579722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5614990U Pending JPH0415239U (en) | 1990-05-28 | 1990-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415239U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0698961A (en) * | 1992-09-22 | 1994-04-12 | K D Sports Kk | Structure of steel tower and net device system using this steel tower |
-
1990
- 1990-05-28 JP JP5614990U patent/JPH0415239U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0698961A (en) * | 1992-09-22 | 1994-04-12 | K D Sports Kk | Structure of steel tower and net device system using this steel tower |
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