JPH04150097A - Enclosure of electronic equipment - Google Patents
Enclosure of electronic equipmentInfo
- Publication number
- JPH04150097A JPH04150097A JP27336890A JP27336890A JPH04150097A JP H04150097 A JPH04150097 A JP H04150097A JP 27336890 A JP27336890 A JP 27336890A JP 27336890 A JP27336890 A JP 27336890A JP H04150097 A JPH04150097 A JP H04150097A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- plated
- conductive layer
- casing
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 13
- 238000007747 plating Methods 0.000 claims abstract description 12
- 239000000523 sample Substances 0.000 abstract 1
- 238000010422 painting Methods 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Receivers (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明はメッキを施すことによりシールド等のための導
電層が形成される電子機器の筐体に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a casing of an electronic device in which a conductive layer for shielding or the like is formed by plating.
（従来の技術）
通信機器の筐体においては、機器外部への不要な電磁波
の輻射や外部から機器内部への妨害電磁波の侵入を防止
するためシールド性能をもたせる必要があるが、筐体全
体を金属材料で形成すると筐体の重量が大きくなるため
、従来はプラスチック製の筐体の表面にメッキや塗装に
よる導電層を設ける構成とすることにより筐体の軽量化
を図っている。(Prior art) The case of a communication device needs to have shielding performance to prevent the radiation of unnecessary electromagnetic waves to the outside of the device and the intrusion of interfering electromagnetic waves from the outside into the inside of the device. Since the weight of the casing increases when it is made of metal, conventionally, the weight of the casing has been reduced by providing a conductive layer on the surface of the plastic casing by plating or painting.
この従来の筐体によると、導電層を不用とする筐体表面
部分については、メッキや塗装を行うに際して筐体にマ
スキングを施していたが、このマスキング作業は非常に
手間がかかる作業となっていた。また、１体内の奥まっ
た部分をマスキングする作業は非常に困難であり、該当
する部分を正確にマスキングできない場合もあった。According to this conventional casing, the surface of the casing that does not require a conductive layer is masked when plating or painting, but this masking work is extremely time-consuming. Ta. Furthermore, it is extremely difficult to mask a deep part within a single body, and there are cases in which it is not possible to accurately mask the corresponding part.
（発明が解決しようとする課題）
上述の如〈従来の電子機器の筐体では、導電層を不用と
する筐体表面部分についてはメッキや塗装を行う際にマ
スキングを施していたので、このマスキング作業に多く
の時間を要していた。また、筐体の該当する部分に正確
にマスキングを行えない場合もあった。(Problem to be Solved by the Invention) As mentioned above, in the case of conventional electronic device cases, the surface part of the case where a conductive layer is not required is masked when plating or painting. It took a lot of time to work. Furthermore, there were cases in which it was not possible to accurately mask the corresponding portions of the casing.
本発明はこのような従来の欠点に鑑みてなされたもので
あり、筐体表面の必要な部分に容易かつ正確に導電層を
形成できる電子機器の筐体を提供することを目的とする
。The present invention has been made in view of these conventional drawbacks, and it is an object of the present invention to provide a casing for an electronic device in which a conductive layer can be easily and accurately formed on the necessary portions of the casing surface.
［発明の構成］
（課題を解決するための手段）
本発明の電子機器の筐体は、メッキ可能な材料でなる第
１の層とメッキネ能な材料でなる第２の層とで形成され
前記第１及び第２の層の少くとも一方の層は他方の層の
表面に至るまで部分的に突出させられた筐体本体と、外
部に露出する前記第１の層の面にメッキにより形成され
た導電層とを具備する構成となっている。[Structure of the Invention] (Means for Solving the Problems) The casing of an electronic device of the present invention is formed of a first layer made of a plateable material and a second layer made of a plateable material. At least one of the first and second layers is formed by plating on the casing body that partially protrudes to the surface of the other layer, and on the surface of the first layer that is exposed to the outside. The structure includes a conductive layer.
（作用）
本発明では、筐体本体の表面にメッキを施すと、メッキ
可能な第１の層側であってメッキネ能な第２の層の部分
が突出していない面及び第２の層側であって第１の層の
部分が突出している面にメッキによる導電層が形成され
る。(Function) In the present invention, when the surface of the casing body is plated, the part of the second layer which can be plated and which is the side of the first layer that can be plated does not protrude, and the second layer side that can be plated. A conductive layer is formed by plating on the surface from which the first layer portion protrudes.
（実施例）
以下、本発明の一実施例を第１図乃至第３図を参照して
詳述する。(Example) Hereinafter, an example of the present invention will be described in detail with reference to FIGS. 1 to 3.
第１図は電子機器（通信機器）の断面図、第２図は第１
図の内部Ａの拡大図、第３図は第１図のＢ−Ｂ線断面図
である。Figure 1 is a cross-sectional view of electronic equipment (communication equipment), and Figure 2 is a cross-sectional view of electronic equipment (communication equipment).
FIG. 3 is an enlarged view of interior A in the figure, and FIG. 3 is a cross-sectional view taken along the line B--B in FIG.
これらの図において、１は各種電子部品３が実装された
プリント配線板であり、５．７はプリント配線板１を収
納する上下のハウジング（筐体本体）である。In these figures, 1 is a printed wiring board on which various electronic components 3 are mounted, and 5.7 is an upper and lower housing (housing body) in which the printed wiring board 1 is housed.
上ハウジング５は、第１の層５ａと第２の層５ｂの２層
成形により形成されており、かつ、第１の層５ａは部分
的に第２の１５ｂ側に向けて突出させられており、この
突出部８の第２の層５ｂ側において露出する面９は第３
図に示す如き形状となっている。The upper housing 5 is formed by two-layer molding of a first layer 5a and a second layer 5b, and the first layer 5a partially protrudes toward the second layer 15b. , the surface 9 of this protrusion 8 exposed on the second layer 5b side is the third
It has a shape as shown in the figure.
また、第１の層５ａは、ＡＢＳ樹脂等のメッキ可能な材
料で形成され、第２の層５ｂはメッキネ能な材料（例え
ば、ガラス、エポキシ樹脂等）で形成されている。Further, the first layer 5a is formed of a material that can be plated, such as ABS resin, and the second layer 5b is formed of a material that can be plated (for example, glass, epoxy resin, etc.).
下ハウジング７も、上ハウジング５と同様、メッキ可能
な材料よりなる第１の層７ａとメッキネ能な材料よりな
る第２の層７ｂとで構成されている。Similarly to the upper housing 5, the lower housing 7 is composed of a first layer 7a made of a plateable material and a second layer 7b made of a plateable material.
また、第２の層７ｂは、その一部が第１の１７ａ側に向
けて突出させられており、この突出部１１の端面１３は
第１の層７ａ側において外部に露出させられている。尚
、第２の層７ｂの他の一部は筐体内側に向けて突出させ
られており、プリント配線板１を保持するためのボス１
５となっている。Further, a part of the second layer 7b is made to protrude toward the first layer 17a side, and the end surface 13 of this protrusion portion 11 is exposed to the outside on the first layer 7a side. The other part of the second layer 7b is made to protrude toward the inside of the casing, and has a boss 1 for holding the printed wiring board 1.
It is 5.
上下のハウジング５．７は上記の如き構成となっている
ので、上下のハウジング５．７に、夫々メッキ処理を施
すと、ハウジング５．７の外面となる第１の層５ａ、
７ａにはメッキによる導電層１１が形成され、筐体内部
の電子部品３はこの導電層１７でシールドされる。この
場合に、第１図の内部Ｃに示す如く、下ハウジング７の
外面のうち第２の層７ｂの突出部１１の端面１３が露出
する部分には、導電層が形成されないため、この端面１
３と対向する筐体内に照明用のＬＥＤを設け、或いは端
面１３の部分を内蔵アンテナのための電波の通り道とす
ることもできる。一方、上ハウジング５側においては、
第１の層５ａの突出部８の端面９が第２の層５ｂ側に露
出しているため、この端面９の部分にメッキによる導電
層１９が形成される。そして、この導電層１９にプリン
ト配線板１側の接触子２１が電気的に接続されることに
より、この導電層１９が機器の電気回路（本例では、分
布定数回路）を構成することになり、その分プリント配
線板１は小形化できる。Since the upper and lower housings 5.7 have the above-described configuration, when the upper and lower housings 5.7 are plated, the first layer 5a, which becomes the outer surface of the housing 5.7,
A conductive layer 11 is formed on 7a by plating, and the electronic component 3 inside the housing is shielded by this conductive layer 17. In this case, as shown in the interior C of FIG.
It is also possible to provide an LED for illumination in the housing facing 3, or to use the end surface 13 as a passage for radio waves for the built-in antenna. On the other hand, on the upper housing 5 side,
Since the end surface 9 of the protrusion 8 of the first layer 5a is exposed to the second layer 5b side, a conductive layer 19 is formed by plating on this end surface 9. When the contact 21 on the printed wiring board 1 side is electrically connected to this conductive layer 19, this conductive layer 19 constitutes an electric circuit of the device (in this example, a distributed constant circuit). , the printed wiring board 1 can be made smaller accordingly.
このように、本例においては、上下のハウジング５．７
にメッキ処理を施すことによりハウジング５．７の内面
及び外面の所望の部分に正確に導電層を形成できるため
、ハウジング５．７にシールド用の導電層を形成するの
みならず、複雑な電気回路も容易に形成できる。そして
、マスキングを施すことができないような奥行の深い筐
体においても、本発明を用いることにより、筐体内に複
雑な形状の導電層を正確かつ容易に形成できるものであ
る。In this way, in this example, the upper and lower housings 5.7
By applying plating to the housing 5.7, it is possible to form a conductive layer precisely on the desired portions of the inner and outer surfaces of the housing 5.7, so that it is not only possible to form a conductive layer on the housing 5.7 for shielding, but also to form complex electrical circuits. can also be easily formed. By using the present invention, it is possible to accurately and easily form a conductive layer with a complex shape in the case, even in a case with a deep depth that cannot be masked.
「発明の効果コ
以上説明したように本発明では、筐体本体にメッキ処理
を施すと、メッキ可能な第１の層側であってメッキネ能
な第２の層の部分が突出していない面及び第２の層側で
あって第１の層の部分が突出している面にメッキによる
導電層が形成されるので、筐体の内外の表面の所望の部
分に導電層を正確かつ容易に形成できる。``Effects of the Invention'' As explained above, in the present invention, when the casing body is plated, the surface of the first layer that can be plated and from which the second layer that can be plated does not protrude; Since a conductive layer is formed by plating on the second layer side where the first layer portion protrudes, the conductive layer can be accurately and easily formed on desired parts of the inner and outer surfaces of the casing. .
第１図乃至第３図は本発明の一実施例を説明する図であ
り、第１図は通信機器の断面図、第２図は第１図の内部
Ａの拡大図、第３図は第１図のＢ−Ｂ線断面図である。
シ・・上ハウジング（筐体本体〉
７・・・下ハウジング（筐体本体）
５ａ、 ７ａ・・・第１の層
５ｂ、 ７ｂ・・・第２の層
８・・値第１の層の）突出部
１１・・べ第２の層の）突出部
１７、１９・・・導電層
代理人 弁理士 本 １） 崇
丁1 to 3 are diagrams explaining one embodiment of the present invention, in which FIG. 1 is a cross-sectional view of a communication device, FIG. 2 is an enlarged view of the interior A of FIG. 1, and FIG. FIG. 2 is a cross-sectional view taken along line BB in FIG. 1; C... Upper housing (housing body) 7... Lower housing (housing body) 5a, 7a... First layer 5b, 7b... Second layer 8... Value of the first layer ) Projections 11...Protrusions 17, 19 (of the second layer) Conductive layer agent Patent attorney Book 1) Takacho
Claims (1)
料よりなる第２の層とで形成され前記第１及び第２の層
の少くとも一方の層は他方の層の表面に至るまで部分的
に突出させられた筐体本体と、外部に露出する前記第１
の層の面にメッキにより形成された導電層とを具備する
ことを特徴とする電子機器の筐体。A first layer made of a plateable material and a second layer made of a non-platable material, wherein at least one of the first and second layers partially extends to the surface of the other layer. a housing body protruding from the housing body; and the first housing body exposed to the outside.
A casing for an electronic device, comprising: a conductive layer formed by plating on the surface of the layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27336890A JP2892139B2 (en) | 1990-10-15 | 1990-10-15 | Electronic device housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27336890A JP2892139B2 (en) | 1990-10-15 | 1990-10-15 | Electronic device housing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04150097A true JPH04150097A (en) | 1992-05-22 |
| JP2892139B2 JP2892139B2 (en) | 1999-05-17 |
Family
ID=17526929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27336890A Expired - Fee Related JP2892139B2 (en) | 1990-10-15 | 1990-10-15 | Electronic device housing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2892139B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5557508A (en) * | 1992-06-10 | 1996-09-17 | Matsushita Electric Industrial Co., Ltd. | High-density circuit module and method of producing the same |
-
1990
- 1990-10-15 JP JP27336890A patent/JP2892139B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5557508A (en) * | 1992-06-10 | 1996-09-17 | Matsushita Electric Industrial Co., Ltd. | High-density circuit module and method of producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2892139B2 (en) | 1999-05-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |