JP2892139B2 - Electronic device housing - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial application field) The present invention relates to a housing of an electronic device in which a conductive layer for a shield or the like is formed by plating.

(Prior art) In the housing of a communication device, it is necessary to provide shielding performance to prevent unnecessary electromagnetic wave radiation to the outside of the device and intrusion of interfering electromagnetic waves from the outside to the inside of the device. Since the weight of the housing is increased when the housing is formed of a metal material, the housing is conventionally made lighter by providing a conductive layer by plating or painting on the surface of the plastic housing.

According to this conventional casing, the casing is masked when plating or painting is performed on the casing surface portion where the conductive layer is unnecessary, but this masking operation is a very laborious operation. Was. Further, it is very difficult to mask a recessed portion in the housing, and there is a case where the corresponding portion cannot be masked accurately.

(Problems to be Solved by the Invention) As described above, in the case of the conventional electronic device, the surface of the case where the conductive layer is unnecessary is masked when plating or painting is performed. It took a lot of time. In addition, there are cases where masking cannot be performed accurately on a corresponding portion of the housing.

The present invention has been made in view of such conventional drawbacks, and an object of the present invention is to provide a housing of an electronic device that can easily and accurately form a conductive layer on a required portion of the housing surface.

[Constitution of the Invention] (Means for Solving the Problems) The housing of the electronic device of the present invention is formed by a first layer made of a plateable material and a second layer made of a non-plateable material. At least one layer of the first and second layers is partially protruded to the surface of the other layer;
A conductive layer formed by plating on a surface of the first layer exposed to the outside.

(Function) In the present invention, when plating is performed on the surface of the housing main body, the surface of the first layer that can be plated and the portion of the second layer that cannot be plated does not protrude and the second layer side Then, a conductive layer is formed by plating on the surface where the first layer portion protrudes.

(Embodiment) Hereinafter, an embodiment of the present invention will be described in detail with reference to FIG. 1 to FIG.

1 is a cross-sectional view of an electronic device (communication device), FIG. 2 is an enlarged view of a circle A in FIG. 1, and FIG. 3 is a cross-sectional view taken along line BB of FIG.

In these figures, reference numeral 1 denotes a printed wiring board on which various electronic components 3 are mounted, and reference numerals 5 and 7 denote upper and lower housings (housing main bodies) that house the printed wiring board 1.

The upper housing 5 is formed by two-layer molding of a first layer 5a and a second layer 5b, and the first layer 5a is partially protruded toward the second layer 5b. The surface 9 of the protrusion 8 exposed on the side of the second layer 5b has a shape as shown in FIG. The first layer 5a is formed of a plateable material such as an ABS resin, and the second layer 5b is formed of a non-plateable material (eg, glass, epoxy resin, or the like).

Similarly to the upper housing 5, the lower housing 7 includes a first layer 7a made of a material that can be plated and a second layer 7b made of a material that cannot be plated. In addition, the second layer 7b
Is partially protruded toward the first layer 7a, and an end face 13 of the protruding portion 11 is exposed to the outside on the first layer 7a side. The other part of the second layer 7b is projected toward the inside of the housing, and the printed wiring board 1
The boss 15 is for holding.

Since the upper and lower housings 5, 7 are configured as described above, when plating is performed on the upper and lower housings 5, 7, respectively, the first layers 5a, 7a serving as the outer surfaces of the housings 5, 7 become The conductive layer 17 is formed by plating, and the electronic component 3 inside the housing is formed.
Are shielded by the conductive layer 17. In this case, as shown by a circle C in FIG.
Since a conductive layer is not formed in a portion where the end face 13 of the protruding portion 11 of the layer 7b is exposed, an LED for illumination is provided in a housing facing the end face 13 or a part of the end face 13 is used for a built-in antenna. It can also be a path for radio waves. On the other hand, on the upper housing 5 side, since the end face 9 of the projection 8 of the first layer 5a is exposed on the second layer 5b side, a conductive layer 19 by plating is formed on this end face 9 portion. . When the contact 21 on the printed wiring board 1 side is electrically connected to the conductive layer 19, the conductive layer 19 forms an electric circuit (a distributed constant circuit in this example) of the device. The printed wiring board 1 can be downsized accordingly.

Thus, in this example, the upper and lower housings 5, 7
By performing a plating process on the inner and outer surfaces of the housings 5 and 7, a conductive layer can be accurately formed on desired portions.
In addition to forming a conductive layer for shielding on the housings 5, 7, a complicated electric circuit can be easily formed. By using the present invention, a conductive layer having a complicated shape can be accurately and easily formed in a housing having a depth that cannot be masked.

[Effects of the Invention] As described above, according to the present invention, when the casing body is subjected to the plating process, the surface of the first layer that can be plated and the portion of the second layer that cannot be plated does not protrude; Since the conductive layer is formed by plating on the second layer side and the surface where the first layer portion protrudes, the conductive layer can be accurately and easily formed on a desired portion of the inner and outer surfaces of the housing. .

[Brief description of the drawings]

1 to 3 are diagrams for explaining an embodiment of the present invention. FIG. 1 is a sectional view of a communication device, FIG. 2 is an enlarged view of a circle A in FIG. 1, and FIG. FIG. 2 is a sectional view taken along line BB of FIG. 1. 5 Upper housing (housing main body) 7 Lower housing (housing main body) 5a, 7a First layer 5b, 7b Second layer 8 Projecting portion (of first layer) 11 Projection (of second layer) 17,19 Conductive layer

Claims (1)

(57) [Claims] A first layer made of a plateable material and a second layer made of a non-plateable material, wherein at least one of the first and second layers is a surface of the other layer; And a conductive body formed by plating on a surface of the first layer exposed to the outside.