JPH04146957A - Thermoplastic resin composition - Google Patents
Thermoplastic resin compositionInfo
- Publication number
- JPH04146957A JPH04146957A JP26942690A JP26942690A JPH04146957A JP H04146957 A JPH04146957 A JP H04146957A JP 26942690 A JP26942690 A JP 26942690A JP 26942690 A JP26942690 A JP 26942690A JP H04146957 A JPH04146957 A JP H04146957A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- acid
- thermoplastic resin
- polycarbonate resin
- aluminum borate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 17
- 239000011342 resin composition Substances 0.000 title claims description 5
- 229920005668 polycarbonate resin Polymers 0.000 claims abstract description 24
- 239000004431 polycarbonate resin Substances 0.000 claims abstract description 24
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 claims abstract description 17
- 125000003118 aryl group Chemical group 0.000 claims description 28
- 150000007524 organic acids Chemical class 0.000 claims description 4
- 239000000203 mixture Substances 0.000 abstract description 13
- 239000002253 acid Substances 0.000 abstract description 5
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 abstract description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 abstract description 4
- 239000001530 fumaric acid Substances 0.000 abstract description 2
- 150000001735 carboxylic acids Chemical class 0.000 abstract 2
- 238000013329 compounding Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 28
- 239000011347 resin Substances 0.000 description 28
- -1 carbonyl halides Chemical class 0.000 description 11
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 10
- 229920001577 copolymer Polymers 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 5
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920006230 thermoplastic polyester resin Polymers 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 150000001993 dienes Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 150000002009 diols Chemical class 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920000412 polyarylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920013716 polyethylene resin Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- IUGOPULVANEDRX-UHFFFAOYSA-N 2-ethylhexane-1,1-diol Chemical compound CCCCC(CC)C(O)O IUGOPULVANEDRX-UHFFFAOYSA-N 0.000 description 1
- YMTYZTXUZLQUSF-UHFFFAOYSA-N 3,3'-Dimethylbisphenol A Chemical compound C1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=CC=2)=C1 YMTYZTXUZLQUSF-UHFFFAOYSA-N 0.000 description 1
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 229920001634 Copolyester Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 101001125858 Homo sapiens Peptidase inhibitor 15 Proteins 0.000 description 1
- 238000012696 Interfacial polycondensation Methods 0.000 description 1
- 239000004419 Panlite Substances 0.000 description 1
- 102100029323 Peptidase inhibitor 15 Human genes 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- YDLSUFFXJYEVHW-UHFFFAOYSA-N azonan-2-one Chemical compound O=C1CCCCCCCN1 YDLSUFFXJYEVHW-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 239000006085 branching agent Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920003194 trans-1,4-polybutadiene polymer Polymers 0.000 description 1
- WYXIGTJNYDDFFH-UHFFFAOYSA-Q triazanium;borate Chemical compound [NH4+].[NH4+].[NH4+].[O-]B([O-])[O-] WYXIGTJNYDDFFH-UHFFFAOYSA-Q 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
く利用分野〉
本発明は、寸法安定性に優れ且つ本来の特性を保持した
芳香族ポリカーボネート樹脂又は芳香族ポリカーボネー
ト樹脂と他の熱可I!!牲樹脂との混合物を主とする熱
可塑性樹脂組成物に関する。Detailed Description of the Invention Field of Application The present invention provides aromatic polycarbonate resins or aromatic polycarbonate resins and other thermoplastic resins having excellent dimensional stability and retaining their original properties. ! The present invention relates to a thermoplastic resin composition mainly consisting of a mixture with a synthetic resin.
〈従来技術〉
従来より、熱可塑性樹脂に無機充填剤を配合して寸法安
定性を改善することは知られている。<Prior Art> It has been known to improve dimensional stability by incorporating an inorganic filler into a thermoplastic resin.
しかしながら、芳香族ポリカーボネート樹脂にガラス繊
維を配合して、例えば射出成形すると、得られる成形品
は外観が悪化すると同時に弾性率も低下する欠点がある
。However, when glass fiber is blended with an aromatic polycarbonate resin and, for example, injection molded, the resulting molded product has the disadvantage that its appearance deteriorates and its modulus of elasticity also decreases.
かかる欠点を解消せんとして、多くの無機充填剤につい
て検問を加えたところ、ホウ酸アルミニウムウィスカー
を使用すれば、上記欠点が大巾に改善されることを知っ
た。しかしながら、芳香族ポリカーボネー1〜樹脂にホ
ウ酸アルミウムウイス力−を必要量配合すると、ホウ酸
アルミニウムウィスカーはそのPHが酸性(PI15.
5〜75)であるにも拘らず、芳香族ポリカーボネー1
−樹脂の分子ωが大きく低下し、機械的性質も低下して
到底実用に供することはできなかった。In an effort to eliminate these drawbacks, we investigated many inorganic fillers and found that the use of aluminum borate whiskers could greatly improve the above drawbacks. However, when the necessary amount of aluminum borate whisker is added to the aromatic polycarbonate resin, the aluminum borate whisker has an acidic pH (PI15.
5 to 75), aromatic polycarbonate 1
-The molecular ω of the resin was greatly reduced, and the mechanical properties were also deteriorated, making it impossible to put it to practical use.
このような欠点を解決する方法として、無機充填剤を予
めシランカップリング剤で処理する方法が知られている
が、この方法ではシランカップリング剤が高価なこと、
処理工程が煩雑であることからコストアップになり、且
つその効果も充分に満足できるものではなかった。A known method for solving these drawbacks is to pre-treat the inorganic filler with a silane coupling agent; however, this method requires that the silane coupling agent is expensive;
The complicated processing steps lead to increased costs, and the effects are not fully satisfactory.
〈発明の目的〉
本発明は、芳香族ポリカーボネート樹脂又は芳香族ポリ
カーボネート樹脂と他の熱可塑性樹脂との混合物にホウ
酸アルミニウムウィスカーを配合して寸法安定性を改善
しても、分子量の低下が僅かで、樹脂本来の優れた特性
を保持する樹脂組成物を提供することを目的とするもの
である。<Object of the Invention> The present invention provides a method for improving dimensional stability by adding aluminum borate whiskers to an aromatic polycarbonate resin or a mixture of an aromatic polycarbonate resin and another thermoplastic resin, but with a slight decrease in molecular weight. The object of the present invention is to provide a resin composition that retains the excellent properties inherent to the resin.
本発明者は上記目的を達成せんとして鋭意検討を重ねた
結果、芳香族ポリカーボネート樹脂にホウ酸アルミニウ
ムウィスカーを配合するに当たって、マレイン酸を特定
量併用すれば、分子量低下を大巾に抑制し得ることを知
った。本発明はこの知見に基いて更に検討を重ねた結果
、完成したものである。As a result of intensive studies aimed at achieving the above object, the inventors of the present invention have found that, when blending aluminum borate whiskers with aromatic polycarbonate resin, if a specific amount of maleic acid is used in combination, the reduction in molecular weight can be greatly suppressed. I learned. The present invention was completed as a result of further studies based on this knowledge.
〈発明の構成〉
本発明は、芳香族ポリカーボネート樹脂又は芳香族ポリ
カーボネート樹脂に他の熱可塑性樹脂を70重量%以下
加えた熱可塑性樹脂100重量部に、ホウ酸アルミニウ
ムウィスカー1重量部以上及び該ホウ酸アルミニウムウ
ィスカーに対して0.1〜10重量%になる量の有機酸
を配合してなる熱可塑性樹脂組成物に係るものである。<Structure of the Invention> The present invention provides 100 parts by weight of an aromatic polycarbonate resin or a thermoplastic resin obtained by adding 70% by weight or less of another thermoplastic resin to an aromatic polycarbonate resin, and 1 part by weight or more of aluminum borate whiskers and the borium. This invention relates to a thermoplastic resin composition containing an organic acid in an amount of 0.1 to 10% by weight based on the acid aluminum whiskers.
本発明で使用する芳香族ポリカーボネート樹脂は、二価
フェノールより誘導される粘度平均分子ωが13,00
0〜50.000.好ましくは15.000〜3500
0の芳香族ポリカーボネート樹脂であり、通常、二価フ
ェノールとカーボネート前駆体とから溶液法又は溶融法
で製造される。二価フェノールとしては22−ビス(4
−ヒドロキシフェニル)プロパン(通称ビスフェノール
A)を主たる対象とするが、その一部又は全部を他の二
価フェノールで置換えてもよい。他の二価フェノールと
しては、例えばビス(4−ヒドロキシフェニル)メタン
、1.1−ビス(4−ヒドロキシフェニル)エタン、2
,2−ビス(4−ヒドロキシ−3−メチルフェニル)プ
ロパン等があげられる。カーボネート前駆体としては、
例えばカルボニルハライド、カルボニルエステル、ハロ
ホルメート等があげられ、具体的な例としてホスゲン、
ジフェニルカーボネート、二価フェノールのジハロホル
メート等があげられる。また、芳香族ポリカーボネート
樹脂を製造するに際しては、必要に応じて分子量調節剤
、分岐剤、触媒等を使用することができる。The aromatic polycarbonate resin used in the present invention has a viscosity average molecular ω derived from dihydric phenol of 13,00
0~50.000. Preferably 15,000-3500
0 aromatic polycarbonate resin, and is usually produced from a dihydric phenol and a carbonate precursor by a solution method or a melt method. As a dihydric phenol, 22-bis(4
-hydroxyphenyl)propane (commonly known as bisphenol A), but part or all of it may be replaced with other dihydric phenols. Other dihydric phenols include, for example, bis(4-hydroxyphenyl)methane, 1,1-bis(4-hydroxyphenyl)ethane, 2
, 2-bis(4-hydroxy-3-methylphenyl)propane, and the like. As a carbonate precursor,
Examples include carbonyl halides, carbonyl esters, haloformates, etc. Specific examples include phosgene,
Examples include diphenyl carbonate and dihaloformates of dihydric phenols. Furthermore, when producing an aromatic polycarbonate resin, a molecular weight regulator, a branching agent, a catalyst, etc. can be used as necessary.
芳香族ポリカーボネート樹脂に混合する熱可塑性樹脂は
、芳香族ポリカーボネート!M脂に混合することのでき
るものであればよく、例えば熱可塑性ポリエステル系樹
脂、ポリアリーレンエステル系樹脂、ポリスチレン系樹
脂、ポリエチレン系樹脂、ポリプロピレン系樹脂、ジエ
ン系樹脂、ポリアミド系樹脂、ポリエーテル系樹脂、ポ
リスルホン系樹脂、ポリフェニレンサルファイド系樹脂
等から選ばれた一種又は二種以上の混合物があげられる
。The thermoplastic resin mixed with aromatic polycarbonate resin is aromatic polycarbonate! Any material that can be mixed with M resin may be used, such as thermoplastic polyester resins, polyarylene ester resins, polystyrene resins, polyethylene resins, polypropylene resins, diene resins, polyamide resins, and polyether resins. Examples include one or a mixture of two or more selected from resins, polysulfone resins, polyphenylene sulfide resins, and the like.
熱可塑性ポリエステル系樹脂は、芳香族ジカルボン酸又
はそのエステル形成性誘導体とジオール又はそのエステ
ル形成性誘導体とを主原料として縮合反応させて得られ
る重合体又は共重合体である。ここで使用する芳香族ジ
カルボン酸としてはテレフタル酸、イソフタル酸、ナフ
タレンジカルボンM等が好ましい。ジオールとしては炭
素数2〜10のアルキレングリコール、炭素数6〜15
の脂環族ジオールが好ましく、例えばエチレングリコー
ル、トリメチレングリコール、テトラメチレングリコー
ル、ヘキサメチレングリコール、ネオペンチルグリコー
ル、3−メチルベンタンジオール(2,4) 、2−メ
チルベンタンジオール(1,4) 、2−エチルヘキサ
ンジオール(1,3) 、ジエチレングリコール、シク
ロヘキサンジメタツール等があげられる。好ましい熱可
塑性ポリエステル系樹脂はポリエチレンテレフタレート
、ポリブチレンテレフタレート、これらの酸成分及び/
又はジオール成分の30モル%以下を他の成分で置換え
た共重合ポリエステルである。The thermoplastic polyester resin is a polymer or copolymer obtained by condensation reaction using an aromatic dicarboxylic acid or an ester-forming derivative thereof and a diol or an ester-forming derivative thereof as main raw materials. As the aromatic dicarboxylic acid used here, terephthalic acid, isophthalic acid, naphthalene dicarboxylic acid M, etc. are preferable. Diols include alkylene glycols having 2 to 10 carbon atoms, and 6 to 15 carbon atoms.
Preferred are alicyclic diols such as ethylene glycol, trimethylene glycol, tetramethylene glycol, hexamethylene glycol, neopentyl glycol, 3-methylbentanediol (2,4), 2-methylbentanediol (1,4), Examples include 2-ethylhexanediol (1,3), diethylene glycol, and cyclohexane dimetatool. Preferred thermoplastic polyester resins include polyethylene terephthalate, polybutylene terephthalate, their acid components and/or
Alternatively, it is a copolyester in which 30 mol% or less of the diol component is replaced with another component.
ポリアリーレンエステル系樹脂は、二価フェノール又は
そのエステル形成性誘導体と芳香族ジカルボン酸又はそ
のエステル形成性誘導体とを主原料として縮合反応させ
て得られる重合体又は共重合体である。ここで使用する
二価フェノールとしては、前記芳香族ポリカルボネート
樹脂のところで説明したものが好ましく使用され、その
エステル形成性誘導体としては、例えば脂肪族又は芳香
族カルボン酸とのジエステル等である。芳香族ジカルボ
ン酸としては、前記熱可塑性ポリエステル系樹脂のとこ
ろで説明したものが好ましく使用される。二価フェノー
ル又はそのエステル形成性誘導体と芳香族ジカルボン酸
又はそのエステル形成性誘導体からポリアリーレンエス
テル系樹脂を製造するには界面重縮合法、溶液重縮合法
、溶融重縮合法等任意の方法が採用される。The polyarylene ester resin is a polymer or copolymer obtained by condensation reaction of dihydric phenol or its ester-forming derivative and aromatic dicarboxylic acid or its ester-forming derivative as main raw materials. As the dihydric phenol used here, those explained in the above-mentioned aromatic polycarbonate resin are preferably used, and its ester-forming derivatives include, for example, diesters with aliphatic or aromatic carboxylic acids. As the aromatic dicarboxylic acid, those explained in connection with the thermoplastic polyester resin are preferably used. Any method such as interfacial polycondensation, solution polycondensation, melt polycondensation, etc. can be used to produce polyarylene ester resin from dihydric phenol or its ester-forming derivative and aromatic dicarboxylic acid or its ester-forming derivative. Adopted.
ポリスチレン系樹脂としては、例えば一般用ポリスチレ
ン、耐衝撃性ポリスチレン、AS樹脂、ABS樹脂、A
ES樹脂、MBS樹脂、MAS樹脂、AAS樹脂、スチ
レン−ブタジェンブロック共重合体、スチレン−無水マ
レイン酸共重合体等があげられる。Examples of polystyrene resins include general purpose polystyrene, impact-resistant polystyrene, AS resin, ABS resin, and A
Examples include ES resin, MBS resin, MAS resin, AAS resin, styrene-butadiene block copolymer, styrene-maleic anhydride copolymer, and the like.
ポリエチレン系樹脂としては、例えば高密度ポリエチレ
ン樹脂、低密度ポリエチレン樹脂、線状低密度ポリエチ
レン樹脂、エチレン−酢酸ビニル共重合体、エチレン−
プロピレン共重合体、エチレン−アクリル酸エステル共
重合体、エチレン−グリシジル(メタ)アクリレート共
重合体等があげられる。Examples of polyethylene resins include high-density polyethylene resin, low-density polyethylene resin, linear low-density polyethylene resin, ethylene-vinyl acetate copolymer, and ethylene-vinyl acetate copolymer.
Examples include propylene copolymers, ethylene-acrylic acid ester copolymers, ethylene-glycidyl (meth)acrylate copolymers, and the like.
ポリプロピレン系樹脂としては、例えばポリプロピレン
樹脂、プロピレン−酢酸ビニル共重合体、プロピレン−
塩化ビニル共重合体等があげられる。Examples of the polypropylene resin include polypropylene resin, propylene-vinyl acetate copolymer, and propylene-vinyl acetate copolymer.
Examples include vinyl chloride copolymers.
ジエン系樹脂としては、例えば1.2−ポリブタジェン
樹脂、トランス−1,4−ポリブタジェン樹脂等ジエン
41!i造を有する中量体単独又はこれらと共重合可能
な単量体との共重合体及びこれらの混合物である。Examples of diene resins include 1,2-polybutadiene resin, trans-1,4-polybutadiene resin, etc. Diene 41! These are intermediate monomers having an i-structure alone, copolymers with monomers copolymerizable with them, and mixtures thereof.
ボJノアミド系樹脂としては、例えばアミノカルボンM
単独又はジカルボン酸とジアミンとからなる重合体、又
はα、ω−カプロラクタムを開環重合して得られる重合
体等があげられる。For example, aminocarbon M
Examples thereof include a polymer alone or composed of a dicarboxylic acid and a diamine, and a polymer obtained by ring-opening polymerization of α,ω-caprolactam.
ポリエーテル系樹脂としては、例えばポリフェニレンエ
ーテル重合体又は共重合体を好ましいものとしてあげら
れる。Preferred examples of the polyether resin include polyphenylene ether polymers or copolymers.
本発明で使用するホウ酸アルミニウムウィスカーは、化
学組成が9/V2O3・28203で表される白色針状
単結晶繊維であり、平均直径05〜1μ、平均長さ10
〜30μのものが好ましい。The aluminum borate whiskers used in the present invention are white acicular single crystal fibers with a chemical composition of 9/V2O3.28203, an average diameter of 05 to 1μ, and an average length of 10
~30μ is preferred.
ホウ酸アルミニウムウィスカーの使用量は、得られる組
成物の使用目的によって広い範囲をとることができ、特
に制限する必要はないが、芳香族ポリカーボネート樹脂
の分子量の低下に影響する量、即ち芳香族ポリカーボネ
ート樹脂100重量部に対して1重1部以上のときに本
発明は有効であり、特に5重量部以上のときに顕著な効
果が得られる。The amount of aluminum borate whiskers to be used can vary widely depending on the purpose of use of the resulting composition and is not particularly limited, but the amount that affects the reduction of the molecular weight of the aromatic polycarbonate resin, that is, the aromatic polycarbonate The present invention is effective when the amount is 1 part or more per weight per 100 parts by weight of the resin, and particularly remarkable effects are obtained when the amount is 5 parts by weight or more.
本発明で使用する有6[はカルボン酸、スルホン酸等で
あり、特に炭素数15以下の芳香族カルボン酸、炭素数
20以下の脂肪族カルボン酸が好ましい。具体的には酢
酸、プロピオン酸、酪酸、マロン酸、コハク酸、グルタ
ル酸、ステアノン酸、マレイン酸、無水マレイン酸、フ
マル酸、シトラコン酸、無水シトラコン酸、イタコン酸
等の脂肪族カルボン酸、安息香酸、フタル酸、無水フタ
ル酸、イソフタル酸、テレフタル酸等の芳香族カルボン
酸があげられる。The compound used in the present invention is a carboxylic acid, a sulfonic acid, etc., and aromatic carboxylic acids having 15 or less carbon atoms and aliphatic carboxylic acids having 20 or less carbon atoms are particularly preferred. Specifically, aliphatic carboxylic acids such as acetic acid, propionic acid, butyric acid, malonic acid, succinic acid, glutaric acid, stearonic acid, maleic acid, maleic anhydride, fumaric acid, citraconic acid, citraconic anhydride, itaconic acid, and benzoic acid. Examples include aromatic carboxylic acids such as phthalic acid, phthalic anhydride, isophthalic acid, and terephthalic acid.
かかる有機酸を使用することによって、ホウ酸アルミニ
ウムウィスカーによる芳香族ポリカーボネート樹脂の分
子量低下を大巾に抑制することができる。By using such an organic acid, it is possible to greatly suppress a decrease in the molecular weight of the aromatic polycarbonate resin due to aluminum borate whiskers.
有機酸の使用量は、あまりに少ないと充分な分子量低下
抑制効果が得られず、あまり多くしてもその効果は飽和
するようになる。使用量は、通常ホウ酸アルミニウムウ
ィスカーの使用量に対して01〜10重量%の範囲から
選択され、最適使用量は、ホウ酸アルミニウムウィスカ
ーに対して0.5〜5重量%の範囲から選択される。If the amount of organic acid used is too small, a sufficient effect of suppressing molecular weight reduction cannot be obtained, and if the amount is too large, the effect becomes saturated. The amount used is usually selected from the range of 0.1 to 10% by weight based on the amount of aluminum borate whiskers used, and the optimum amount used is selected from the range of 0.5 to 5% by weight based on the amount of aluminum borate whiskers. Ru.
本発明の組成物は、前記の各成分を任意の方法、例えば
タンブラ−、ブレンダー、ナウターミキサ−、バンバリ
ーミキサ−1混練ロール、押出機等により混合して製造
することができる本発明の組成物には、その目的を逸脱
しない範囲で必要に応じて他の添加剤、例えば酸化防止
剤、81M剤、帯電防止剤、離型剤、紫外線吸収剤等を
配合することができる。The composition of the present invention can be produced by mixing the above-mentioned components using any method such as a tumbler, blender, Nauta mixer, Banbury mixer 1 kneading roll, extruder, etc. may contain other additives, such as antioxidants, 81M agents, antistatic agents, mold release agents, ultraviolet absorbers, etc., as necessary within the scope of the purpose.
〈発明の効果〉
本発明の組成物は、芳香族ポリカーボネート樹脂又は芳
香族ポリカーボネート樹脂と他の熱可塑性樹脂との混合
物に、寸法安定性を改善するに必要な量のホウ酸アルミ
ニウムウィスカーを配合した場合においても、分子量の
低下が著しく抑制され、樹脂本来の優れた特性を保持し
ているため、任意の溶融成形法例えば射出成形、押出成
形、圧縮成形等に適用でき、特に従来使用できなかった
用途、例えば大型精密機械部品や大型自動車部品等への
使用を可能にする等工業的に優れた効果を奏するもので
ある。<Effects of the Invention> The composition of the present invention contains an aromatic polycarbonate resin or a mixture of an aromatic polycarbonate resin and another thermoplastic resin mixed with aluminum borate whiskers in an amount necessary to improve dimensional stability. Even in some cases, the decrease in molecular weight is significantly suppressed and the resin retains its original excellent properties, so it can be applied to any melt molding method such as injection molding, extrusion molding, compression molding, etc., especially when it could not be used conventionally. It has excellent industrial effects, such as being able to be used in large precision machinery parts, large automobile parts, etc.
〈実施例〉
以下実施例により本発明を詳述する。なお、実施例にお
ける部は重量部を意味し、粘度平均分子量Mは、塩化メ
チレンに20℃で0.7g/djの濃度で溶解した溶液
から求めた比粘度ηspを下記式に挿入して求めた。<Examples> The present invention will be explained in detail below using examples. In addition, parts in the examples mean parts by weight, and the viscosity average molecular weight M is determined by inserting the specific viscosity ηsp obtained from a solution dissolved in methylene chloride at 20 ° C. at a concentration of 0.7 g / dj into the following formula. Ta.
η、p/C=[η コ + 0.45 [η ]2
C[ηコ = 1.23 X10−’M但し C=
0.7
また、衝撃強さは厚さ1/4” 1/8″の試験片
を用い、アイゾツトノツチ付きで測定すた値<Kgf、
cm/an>で示し、熱変形温度(HDT)はASTH
D−648(18,6に’j f/ci)で測定したI
(’C)で示した。η, p/C=[η ko + 0.45 [η ]2
C[ηko = 1.23 X10-'M However, C=
0.7 In addition, the impact strength was measured using a test piece with a thickness of 1/4" and 1/8" with an isotnotch.The value <Kgf,
cm/an>, and the heat distortion temperature (HDT) is ASTH
I measured at D-648 (18,6'j f/ci)
Indicated by ('C).
実施例1〜4及び比較例7.2
粘度平均分子量22,500のごスフエノールAより得
られたポリカーボネート粉体(余人化成■製パンライト
L1225) 100重量部に、第1表記載のホウ酸
アンモニウムウィスカーと有amを表記量のω(重量部
)添加し、30awφのベント式押出機(ナカタニ■製
VSK−30)を用いてシリンダー温度290℃で押出
してペレットを得た。Examples 1 to 4 and Comparative Example 7.2 Ammonium borate listed in Table 1 was added to 100 parts by weight of polycarbonate powder obtained from Suphenol A having a viscosity average molecular weight of 22,500 (Panlite L1225 manufactured by Yojin Kasei Corporation). The indicated amounts of whiskers and ammonium omega (parts by weight) were added, and the mixture was extruded using a 30 aw φ vented extruder (VSK-30 manufactured by Nakatani Corporation) at a cylinder temperature of 290° C. to obtain pellets.
このペレットを熱風循環式乾燥機により 120℃で5
時間乾燥した後、射出成形機(日本製鋼所■製J−12
0S^)によりシリンダー温度300℃、金型温度80
℃で物性試験片を作成した。ペレットと成形品(物性試
験片)夫々の粘度平均分子@M、及び試験片の物性を第
1表に示した。The pellets were dried at 120°C for 5 minutes using a hot air circulation dryer.
After drying for a while, use an injection molding machine (J-12 manufactured by Japan Steel Works, Ltd.).
0S^) cylinder temperature 300℃, mold temperature 80℃
Physical property test pieces were prepared at ℃. Table 1 shows the viscosity average molecules @M of the pellets and molded products (physical property test pieces), and the physical properties of the test pieces.
なお、ここで使用したホウ酸アルミニウムウィスカーは
化学組成9AI20s・282o3、平均直径05〜1
μ、平均長さ10〜30μ、白色針状単結晶繊M(四国
化成■製アルボレックスG)である。The aluminum borate whiskers used here had a chemical composition of 9AI20s/282o3 and an average diameter of 05 to 1.
μ, average length 10 to 30 μ, white acicular single crystal fiber M (Alborex G manufactured by Shikoku Kasei ■).
(以下余白)(Margin below)
Claims (1)
ト樹脂に他の熱可塑性樹脂を70重量%以下加えた熱可
塑性樹脂100重量部に、ホウ酸アルミニウムウィスカ
ー1重量部以上及び該ホウ酸アルミニウムウィスカーに
対して0.1〜10重量%になる量の有機酸を配合して
なる熱可塑性樹脂組成物。To 100 parts by weight of an aromatic polycarbonate resin or a thermoplastic resin in which 70% by weight or less of another thermoplastic resin is added to an aromatic polycarbonate resin, 1 part by weight or more of aluminum borate whiskers and 0.1 part by weight with respect to the aluminum borate whiskers. A thermoplastic resin composition containing an organic acid in an amount of ~10% by weight.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26942690A JPH086016B2 (en) | 1990-10-09 | 1990-10-09 | Thermoplastic resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26942690A JPH086016B2 (en) | 1990-10-09 | 1990-10-09 | Thermoplastic resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04146957A true JPH04146957A (en) | 1992-05-20 |
JPH086016B2 JPH086016B2 (en) | 1996-01-24 |
Family
ID=17472261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26942690A Expired - Fee Related JPH086016B2 (en) | 1990-10-09 | 1990-10-09 | Thermoplastic resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH086016B2 (en) |
-
1990
- 1990-10-09 JP JP26942690A patent/JPH086016B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH086016B2 (en) | 1996-01-24 |
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