JPH03237154A - Thermoplastic resin composition - Google Patents
Thermoplastic resin compositionInfo
- Publication number
- JPH03237154A JPH03237154A JP3335090A JP3335090A JPH03237154A JP H03237154 A JPH03237154 A JP H03237154A JP 3335090 A JP3335090 A JP 3335090A JP 3335090 A JP3335090 A JP 3335090A JP H03237154 A JPH03237154 A JP H03237154A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- aromatic polycarbonate
- acid
- polycarbonate resin
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 10
- 239000011342 resin composition Substances 0.000 title claims abstract description 6
- 125000003118 aryl group Chemical group 0.000 claims abstract description 32
- 229920005989 resin Polymers 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 28
- 229920005668 polycarbonate resin Polymers 0.000 claims abstract description 26
- 239000004431 polycarbonate resin Substances 0.000 claims abstract description 26
- 239000011256 inorganic filler Substances 0.000 claims abstract description 19
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000002893 slag Substances 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims abstract description 8
- 150000007524 organic acids Chemical class 0.000 claims abstract description 7
- 239000000835 fiber Substances 0.000 claims abstract description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 10
- 239000010959 steel Substances 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- -1 20C aliphatic carboxylic acid Chemical class 0.000 abstract description 16
- 239000000203 mixture Substances 0.000 abstract description 10
- 239000006087 Silane Coupling Agent Substances 0.000 abstract description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 abstract description 4
- 238000002156 mixing Methods 0.000 abstract description 3
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 abstract description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 abstract description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 4
- 229910052742 iron Inorganic materials 0.000 abstract 2
- 238000000034 method Methods 0.000 description 11
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 10
- 229920001577 copolymer Polymers 0.000 description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000008188 pellet Substances 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 229920006230 thermoplastic polyester resin Polymers 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 3
- 150000001993 dienes Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 150000002009 diols Chemical class 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 3
- 239000011976 maleic acid Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229920000412 polyarylene Polymers 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000005065 mining Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 229920013716 polyethylene resin Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- IUGOPULVANEDRX-UHFFFAOYSA-N 2-ethylhexane-1,1-diol Chemical compound CCCCC(CC)C(O)O IUGOPULVANEDRX-UHFFFAOYSA-N 0.000 description 1
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- HXDOZKJGKXYMEW-UHFFFAOYSA-N 4-ethylphenol Chemical compound CCC1=CC=C(O)C=C1 HXDOZKJGKXYMEW-UHFFFAOYSA-N 0.000 description 1
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 101000850450 Homo sapiens Enolase-phosphatase E1 Proteins 0.000 description 1
- 101001051490 Homo sapiens Neural cell adhesion molecule L1 Proteins 0.000 description 1
- 238000012696 Interfacial polycondensation Methods 0.000 description 1
- 102100024964 Neural cell adhesion molecule L1 Human genes 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 241000718541 Tetragastris balsamifera Species 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229920002877 acrylic styrene acrylonitrile Polymers 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- YDLSUFFXJYEVHW-UHFFFAOYSA-N azonan-2-one Chemical compound O=C1CCCCCCCN1 YDLSUFFXJYEVHW-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 239000006085 branching agent Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 150000005690 diesters Chemical group 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
く利用分野〉
本発明は、芳香族ポリカーボネート樹脂の優れた特性を
保持し、且つ寸法安定性に優れた芳香族ポリカーボネー
ト樹脂組成物、又は芳香族ポリカーボネート樹脂と他の
熱可塑性樹脂を主成分とする熱可塑性樹脂組成物に関す
る。Detailed Description of the Invention Fields of Application The present invention provides an aromatic polycarbonate resin composition that retains the excellent properties of aromatic polycarbonate resin and has excellent dimensional stability, or an aromatic polycarbonate resin composition that retains the excellent properties of aromatic polycarbonate resin and has excellent dimensional stability. The present invention relates to a thermoplastic resin composition containing a plastic resin as a main component.
〈従来技術〉
従来より、熱可塑性樹脂に無機充填剤を配合して寸法安
定性を改善することは知られている。<Prior Art> It has been known to improve dimensional stability by incorporating an inorganic filler into a thermoplastic resin.
しかしながら、芳香族ポリカーボネート樹脂にアルミナ
の如き無機充填剤を配合すると、分子鎖中のカーボネー
ト結合が切断されて分子量が大きく低下するという重大
な欠点がある。この欠点を解決する方法として、無機充
填剤を予めシランカップリング剤で処理する方法が知ら
れているが、この方法では充分に満足させることはでき
なかった。However, when an inorganic filler such as alumina is added to an aromatic polycarbonate resin, carbonate bonds in the molecular chain are broken, resulting in a significant decrease in molecular weight, which is a serious drawback. As a method for solving this drawback, a method is known in which the inorganic filler is treated with a silane coupling agent in advance, but this method has not been able to fully satisfy the problem.
〈発明の目的〉
本発明の目的は、芳香族ポリカーボネート樹脂にアルミ
ナ、鉄鋼スラグ、金属粉末、金属繊維等を配合しても、
分子量が僅かしか低下せず、芳香族ポリカーボネート樹
脂本来の優れた特性を保持し、且つ寸法安定性に優れた
芳香族ポリカーボネート樹脂組成物又は芳香族ポリカー
ボネート樹脂と他め熱可塑性樹脂を主成分とする樹脂組
成物を提供せんとするものである。<Object of the invention> The object of the invention is that even if alumina, steel slag, metal powder, metal fiber, etc. are blended with aromatic polycarbonate resin,
An aromatic polycarbonate resin composition or a thermoplastic resin other than aromatic polycarbonate resin that has only a slight decrease in molecular weight, retains the original excellent properties of aromatic polycarbonate resin, and has excellent dimensional stability. The present invention aims to provide a resin composition.
本発明者は上記目的を達成せんとして鋭意検肘を重ねた
結果、芳香族ポリカーボネート樹脂に前記無機充填剤を
配合するに当たって、マレイン酸を特定量併用すれば、
分子量低下を大幅に抑制し得ることを知った。本発明は
この知見に基づいて更に検討を重ねた結果、完成したも
のである。The inventors of the present invention have conducted extensive research to achieve the above object, and have found that if a specific amount of maleic acid is used in combination with the inorganic filler in aromatic polycarbonate resin,
We found that molecular weight reduction can be significantly suppressed. The present invention was completed as a result of further studies based on this knowledge.
〈発明の構成〉
本発明は、芳香族ポリカーボネート樹脂又は芳香族ポリ
カーボネート樹脂に他の熱可塑性樹脂を70重量%以下
加えたa4脂成分?OO重1部にアルミナ、鉄鋼スラグ
、金属粉末及び金属11AMよりなる群から選ばれた少
なくとも一種の無機充填剤1重量部以上及び該無機充填
剤に対して0.1〜10重量%になる量の有am′Mを
配合してなる熱可塑性樹脂組成物に係るものである。<Structure of the Invention> The present invention provides an aromatic polycarbonate resin or an A4 fat component in which 70% by weight or less of another thermoplastic resin is added to the aromatic polycarbonate resin. At least 1 part by weight of at least one inorganic filler selected from the group consisting of alumina, steel slag, metal powder, and metal 11AM per 1 part by weight of OO, and an amount of 0.1 to 10% by weight based on the inorganic filler. The present invention relates to a thermoplastic resin composition containing am'M.
本発明で使用する芳香族ポリカーボネート樹脂は、2価
フェノールより誘′Sされる粘度平均分子量が15,0
00〜so、ooo、好ましくは18,000〜30、
000の芳香族ポリカーボネート樹脂であり、通常2価
フェノールとカーボネート前駆体とから溶液法又は溶融
法で製造される。2価フェノールの代表例として2.2
−ビス(4−ヒドロキシフェニル)プロパン(通称ビス
フェノールA)、ビス(4−ヒドロキシフエニルンメタ
ン、1.1−ビス(4−ヒドロキシフェニル)エタン、
2.2−ビス(4−ヒドロキシ−3−メチルフェニル)
プロパン等があげられる。好ましい2価フェノールはビ
ス(4−ヒドロキシフェニル)アルカン系化合物、特に
ビスフェノールAである。2価フェノールは単独で又は
2種以上混合して使用することができる。また、カーボ
ネート前駆体としてはカルボニルハライド、カーボネー
ト、へロホルメート等があげられ、代表的な例としては
ホスゲン、ジフェニルカーボネート、2価フェノールの
ジハロホルメート及びこれらの混合物があげられる。ま
た、芳香族ポリカーボネート樹脂を製造するに際しては
、必要に応じて分子!I調節剤、分岐剤、触1s等を使
用することができる。The aromatic polycarbonate resin used in the present invention has a viscosity average molecular weight of 15.0 when induced by dihydric phenol.
00-so, ooo, preferably 18,000-30,
000 aromatic polycarbonate resin, and is usually produced from dihydric phenol and a carbonate precursor by a solution method or a melt method. 2.2 as a representative example of dihydric phenol
-bis(4-hydroxyphenyl)propane (commonly known as bisphenol A), bis(4-hydroxyphenylmethane, 1.1-bis(4-hydroxyphenyl)ethane,
2.2-bis(4-hydroxy-3-methylphenyl)
Examples include propane. Preferred dihydric phenols are bis(4-hydroxyphenyl)alkane compounds, particularly bisphenol A. Dihydric phenols can be used alone or in combination of two or more. Examples of carbonate precursors include carbonyl halides, carbonates, heroformates, and typical examples include phosgene, diphenyl carbonate, dihaloformates of dihydric phenols, and mixtures thereof. In addition, when manufacturing aromatic polycarbonate resin, we use molecular! I moderators, branching agents, catalysts, etc. can be used.
芳香族ポリカーボネート4M脂に混合する熱可塑性樹脂
は、芳香族ポリカーボネート樹脂に混合することのでき
るものであればよく、例えば熱可塑性ポリエステル系樹
脂、ポリアリーレンエステル系S脂、ポリスチレン系樹
脂、ポリエチレン系樹脂、ポリプロピレン系樹脂、ジエ
ン系樹脂、ポリアミド系樹脂、ポリエーテル系樹脂、ポ
リスルホン系樹脂、ポリフェニレンサルファイド系樹脂
等から選ばれた1種又は2種以上の混合物があげられる
。The thermoplastic resin to be mixed with the aromatic polycarbonate 4M resin may be any resin that can be mixed with the aromatic polycarbonate resin, such as thermoplastic polyester resin, polyarylene ester S resin, polystyrene resin, polyethylene resin. , polypropylene resin, diene resin, polyamide resin, polyether resin, polysulfone resin, polyphenylene sulfide resin, etc., or a mixture of two or more thereof.
熱可塑性ポリエステル系樹脂は、芳香族ジカルボン酸又
はそのエステル形成性誘導体とジオール又はそのエステ
ル形成性誘導体とを主原料として縮合反応させて得られ
る重合体又は共重合体である。ここで使用する芳香族ジ
カルボン酸としてはテレフタル酸、イソフタル酸、ナフ
タレンジカルボン酸等が好ましい。ジオールとしては炭
素数2〜10個のフルキレングリコール、炭素数6〜1
5個の脂環族ジオールが好ましく、具体的にはエチレン
グリコール、トリメチレングリコール、テトラメチレン
グリコール、ヘキサメチレングリコール、ネオペンチル
グリコール、3−メチルベンタンジオール(2,4)
、2−メチルベンタンジオール(1,4) 、2−エチ
ルヘキサンジオール(1,3) 、ジエチレングリコー
ル、シクロヘキサンジメタツール等をあげることができ
る。好ましい熱可塑性ポリエステル系樹脂はポリエチレ
ンテレフタレート、ポリブチレンテレフタレート、これ
らの酸成分及び/又はジオール成分の30モル%以下を
他の成分で置換えた共重合ポリエステルである。The thermoplastic polyester resin is a polymer or copolymer obtained by condensation reaction using an aromatic dicarboxylic acid or an ester-forming derivative thereof and a diol or an ester-forming derivative thereof as main raw materials. As the aromatic dicarboxylic acid used here, terephthalic acid, isophthalic acid, naphthalene dicarboxylic acid, etc. are preferable. Diols include fullylene glycol having 2 to 10 carbon atoms, and 6 to 1 carbon atoms.
Five alicyclic diols are preferred, specifically ethylene glycol, trimethylene glycol, tetramethylene glycol, hexamethylene glycol, neopentyl glycol, 3-methylbentanediol (2,4)
, 2-methylbentanediol (1,4), 2-ethylhexanediol (1,3), diethylene glycol, cyclohexane dimetatool, and the like. Preferred thermoplastic polyester resins are polyethylene terephthalate, polybutylene terephthalate, and copolymerized polyesters in which 30 mol% or less of their acid components and/or diol components are replaced with other components.
ポリアリーレンエステル系樹脂は、2価フェノール又は
その誘導体と芳香族ジカルボン酸又はその誘導体とを主
原料として縮合反応させて得られる重合体又は共重合体
である。ここで使用する2価フェノールとしては、前記
芳香族ポリカーボネート樹脂のところで説明したものが
好ましく使用され、2価フェノールの誘導体は、前記2
価フェノールと脂肪族又は芳香族カルボン酸とのジエス
テルである。芳香族ジカルボン酸としては、前記熱可塑
性ポリエステル系@脂のところで説明したものが好まし
く使用される。Polyarylene ester resin is a polymer or copolymer obtained by condensation reaction of dihydric phenol or its derivative and aromatic dicarboxylic acid or its derivative as main raw materials. As the dihydric phenol used here, those explained in the above-mentioned aromatic polycarbonate resin are preferably used, and the derivatives of dihydric phenol are the dihydric phenols described above.
It is a diester of a hydric phenol and an aliphatic or aromatic carboxylic acid. As the aromatic dicarboxylic acid, those explained in connection with the thermoplastic polyester resin are preferably used.
2価フェノール又はその誘導体と芳香族ジカルボン酸又
はその誘導体からポリアリーレンエステル系樹脂を製造
するには界面重縮合法、溶液重縮合法、溶融重縮合法等
任意の方法が採用される。Any method such as an interfacial polycondensation method, a solution polycondensation method, or a melt polycondensation method can be used to produce a polyarylene ester resin from a dihydric phenol or its derivative and an aromatic dicarboxylic acid or its derivative.
ポリスチレン系樹脂としては一般用ボリスチレン、耐1
1i11性ポリスチレン、As樹脂、ABS樹脂、AE
S樹脂、MBS樹脂、MASAs樹脂ASAs樹脂チレ
ン−ブタジェンブロック共重合体、スチレン−無水マレ
イン酸共重合体等をあげることができる。Polystyrene resin for general use is polystyrene, which has a resistance of 1
1i11 polystyrene, As resin, ABS resin, AE
Examples include S resin, MBS resin, MASAs resin, ASAs resin, tyrene-butadiene block copolymer, styrene-maleic anhydride copolymer, and the like.
ポリエチレン系樹脂としては高密度ポリエチレン樹脂、
低密度ポリエチレン樹脂、線状低密度ポリエチレン樹脂
、エチレン−酢酸ビニル共重合体、エチレン−プロピレ
ン共重合体、エチレン−アクリル酸エステル共重合体、
■チレンーグリシジル(メタ)アクリレート共重合体等
をあげることができる。As polyethylene resin, high density polyethylene resin,
Low density polyethylene resin, linear low density polyethylene resin, ethylene-vinyl acetate copolymer, ethylene-propylene copolymer, ethylene-acrylic ester copolymer,
■ Examples include tyrene-glycidyl (meth)acrylate copolymer.
ポリプロピレン系樹脂としてはポリプロピレン樹脂、プ
ロピレン−酢酸ビニル共重合体、プロピレン−塩化ビニ
ル共重合体等をあげることができる。Examples of the polypropylene resin include polypropylene resin, propylene-vinyl acetate copolymer, propylene-vinyl chloride copolymer, and the like.
ジエン系樹脂は1.2−ポリブタジェン樹脂、トランス
−14−ポリブタジェン樹脂等ジエン構造を有する単量
体単独又はこれらと共重合可能な単量体との共重合体及
びこれらの混合物である。The diene resin is a monomer having a diene structure such as 1,2-polybutadiene resin or trans-14-polybutadiene resin, or a copolymer thereof with a monomer copolymerizable with these monomers, or a mixture thereof.
ポリアミド系樹脂はアミノカルボン酸化合物単独又はジ
カルボン酸化合物とジアミン化合物からなる重合体、又
はα、ω−カプロラクタムを開環重合して得られる重合
体である。The polyamide resin is a polymer consisting of an aminocarboxylic acid compound alone or a dicarboxylic acid compound and a diamine compound, or a polymer obtained by ring-opening polymerization of α,ω-caprolactam.
ポリエーテル系樹脂としてはポリフェニレンエーテル(
共〉重合体を好ましいものとしてあげることができる。Polyphenylene ether (
Copolymers are preferred.
本発明で使用する無機充填剤はアルミナ、鉄鋼スラグ、
ステンレスや真鍮の如き金属の繊維又は粉末であり、な
かでも芳香族ポリカーボネート樹脂の分子量の低下が大
きいアルミナ、鉄鋼スラグは本発明による効果が著しく
、特に好ましいものである。これらは単独で使用しても
、2種以上混合使用してもよく、またこれらの無機充填
剤は使用するに当たって予め、例えばシランカップリン
グ剤の如き処理剤で表面処理してもよい。Inorganic fillers used in the present invention include alumina, steel slag,
Fibers or powders of metals such as stainless steel and brass, among which alumina and steel slag, in which the molecular weight of aromatic polycarbonate resin is greatly reduced, are particularly preferred because they are particularly effective in the present invention. These inorganic fillers may be used alone or in combination of two or more, and the surface of these inorganic fillers may be treated with a treatment agent such as a silane coupling agent before use.
上記無機充填剤の使用量は、特定する必要はないが、芳
香族ポリカーボネート樹脂の分子量の低下に影響する量
、即ち芳香族ポリカーボネート樹脂100重量部に対し
て1重量部以上使用するときに本発明は有効であり、特
に5重量部以上のときに顕著な効果が得られる。The amount of the inorganic filler used does not need to be specified, but the present invention applies when it is used in an amount that affects the reduction of the molecular weight of the aromatic polycarbonate resin, that is, 1 part by weight or more per 100 parts by weight of the aromatic polycarbonate resin. is effective, particularly when the amount is 5 parts by weight or more, remarkable effects can be obtained.
本発明で使用する有機酸はカルボン酸、スルホン酸等で
あり、特に炭素数15以下の芳香族カルボン酸、炭素数
20以下の脂肪族カルボン酸が好ましい。具体的には酢
酸、プロピオン酸、酪酸、マロン酸、コハク酸、グルタ
ル酸、ステアリン酸、マレイン酸、無水マレイン酸、フ
マル酸、シトラコン酸、無水シトラコン酸、イタコン酸
等の脂肪族カルボン酸、安息香酸、フタル酸、無水フタ
ル酸、イソフタル酸、テレフタル酸等の芳香族カルボン
酸等があげられる。The organic acids used in the present invention are carboxylic acids, sulfonic acids, etc., and aromatic carboxylic acids having 15 or less carbon atoms and aliphatic carboxylic acids having 20 or less carbon atoms are particularly preferred. Specifically, aliphatic carboxylic acids such as acetic acid, propionic acid, butyric acid, malonic acid, succinic acid, glutaric acid, stearic acid, maleic acid, maleic anhydride, fumaric acid, citraconic acid, citraconic anhydride, itaconic acid, and benzoic acid. Examples include aromatic carboxylic acids such as acids, phthalic acid, phthalic anhydride, isophthalic acid, and terephthalic acid.
かかる有機酸を使用することによって、前記無機充填剤
による芳香族ポリカーボネート樹脂の分子量低下を大幅
に抑制することができる。By using such an organic acid, it is possible to significantly suppress a decrease in the molecular weight of the aromatic polycarbonate resin caused by the inorganic filler.
有機酸の使用量は、あまりに少ないと充分な分子量低下
抑制効果が得られず、あまりに多くしてもその効果は飽
和するようになる。使用量は、通常使用する無機充填剤
に対して0,1〜10重量%の範囲から選択され、最適
使用量は、無機充填剤に対して1〜10重量%の範囲か
ら選択される。If the amount of organic acid used is too small, a sufficient effect of suppressing molecular weight reduction cannot be obtained, and if it is too large, the effect becomes saturated. The amount used is selected from the range of 0.1 to 10% by weight, based on the normally used inorganic filler, and the optimum amount used is selected from the range from 1 to 10% by weight, based on the inorganic filler.
本発明の組成物は、前記の各成分を任意の方法、例えば
タンブラ−・ブレンダー、ナウターミキサ−、バンバリ
ーミキサ−1混線ロール、押出機等により混合して製造
することができる。The composition of the present invention can be produced by mixing the above-mentioned components using any method such as a tumbler blender, a Nauta mixer, a Banbury mixer 1 mixed roll, or an extruder.
本発明の組成物には、その目的を逸脱しない範囲で必要
に応じて他の添加剤、例えばガラスHNの如き補強繊維
、酸化防止剤、難燃剤、帯電防止剤、離型剤、紫外線吸
収剤等を混合することができる。The composition of the present invention may contain other additives as necessary without departing from its purpose, such as reinforcing fibers such as glass HN, antioxidants, flame retardants, antistatic agents, mold release agents, and ultraviolet absorbers. etc. can be mixed.
〈発明の効果〉
本発明の組成物は、芳香族ポリカーボネート樹脂に充分
な量の前記無機充填剤を配合した場合においても、分子
量の低下が著しく抑制され、樹脂本来の優れた特性を保
持し、且つ寸法安定性に優れているため、任意の溶融成
形法例えば射出成形、押出成形、圧縮成形、回転成形等
に適用でき、特に従来使用できなかった用途、例えば大
型精密機械部品や大型自動車用部品等への使用を可能に
する等工業的に優れた効果を奏するものである。<Effects of the Invention> Even when a sufficient amount of the inorganic filler is blended into the aromatic polycarbonate resin, the composition of the present invention significantly suppresses a decrease in molecular weight, maintains the resin's original excellent properties, In addition, it has excellent dimensional stability, so it can be applied to any melt molding method such as injection molding, extrusion molding, compression molding, rotation molding, etc., and is especially suitable for applications that could not be used conventionally, such as large precision machine parts and large automobile parts. It has excellent industrial effects, such as making it possible to use it for other purposes.
〈実施例〉
以下実施例により本発明を詳述する。なお、実施例にお
ける部は重量部を意味し、粘度平均分子IMは塩化メチ
レンに20℃で0.7g/dlの濃度で溶解した溶液か
ら求めた比粘度η3.を下記式に挿入して求めた。<Examples> The present invention will be explained in detail below using examples. In the examples, parts mean parts by weight, and the viscosity average molecule IM is the specific viscosity η3. was calculated by inserting into the formula below.
η /C=[η] + 0.45 [η]20p
[η コ − 1.23X10 → M但し C=0
7
また、衝撃強さは厚さ 1/4″1/8″の試験片を用
い、アイゾツトノツチ付きで測定した値(K!i f−
α/α)で示した。η /C=[η] + 0.45 [η]20p [η co − 1.23X10 → MHowever, C=0
7 In addition, the impact strength is the value measured using a test piece with a thickness of 1/4" and 1/8" with an isotnotch (K!if-
α/α).
実施例1〜7及び比較例1〜3
粘度平均分子量24,900のビスフェノールAより得
られたポリカーボネート粉体(余人化成■製:バンライ
トL−1250) 100重量部に、第1表記載の無
機充填剤と有機酸を表記載の量(重量部)添加し、30
jIIIφベント式押出機(ナカタニ■製:vSに−3
0〉を用いてシリンダー温度280℃で押出してベレッ
トを得た。このベレットを熱風循環式乾燥機を用いて1
20℃で5時間乾燥した後、射出成形機(日本製鋼所■
製: J−120S^)によりシリンダー温度290℃
、金型温度80℃で物性試験片を作成した。ベレットと
成形品(物性試験片〉夫々の粘度平均分子量M、及び試
験片の物性を第1表に示した。Examples 1 to 7 and Comparative Examples 1 to 3 100 parts by weight of polycarbonate powder obtained from bisphenol A having a viscosity average molecular weight of 24,900 (manufactured by Yojin Kasei Corporation: Vanlite L-1250) was added with the inorganic material listed in Table 1. Add the filler and organic acid in the amounts listed in the table (parts by weight), and make 30
jIIIφ vented extruder (manufactured by Nakatani ■: vS-3
0> at a cylinder temperature of 280° C. to obtain a pellet. This pellet is dried using a hot air circulation dryer.
After drying at 20℃ for 5 hours, the injection molding machine (Japan Steel Works ■
Manufactured by: J-120S^) Cylinder temperature 290℃
A physical property test piece was prepared at a mold temperature of 80°C. Table 1 shows the viscosity average molecular weight M of the pellet and molded article (physical property test piece), and the physical properties of the test piece.
なお、第1表記載の無機充填剤は下記の通りである。The inorganic fillers listed in Table 1 are as follows.
鉄鋼スラグは鋼管鉱業■製: NKKフィネストステ
ンレス繊維は日本精線■製:ナスロンアルミナは住友化
学tII/J製: At−43実施例8〜9及び比較例
4,5
実施例1で使用した粘度平均分子量24.900のポリ
カーボネート粉体100重量部に、鉄鋼スラグ(鋼管鉱
業■製: ■にフィネスト)、チョツプドガラス繊H(
日東紡績■製: 3PE−4511、シランカップリン
グ剤(信越シリコン■製:に88573)及びマレイン
酸を表記載のm(重量部)添加し、実施例1と同様にし
てベレットを得、更に物性試験片を作成した。Steel slag is manufactured by Steel Pipe Mining ■: NKK Finest stainless fiber is manufactured by Nippon Seisen ■: Naslon alumina is manufactured by Sumitomo Chemical tII/J: At-43 Examples 8 to 9 and Comparative Examples 4 and 5 Used in Example 1 To 100 parts by weight of polycarbonate powder with a viscosity average molecular weight of 24.900, steel slag (manufactured by Steel Pipe Mining ■: Finest), chopped glass fiber H (
Nittobo Co., Ltd.: 3PE-4511, a silane coupling agent (Shin-Etsu Silicon Co., Ltd.: 88573) and maleic acid were added in m (parts by weight) as indicated in the table, and a pellet was obtained in the same manner as in Example 1. A test piece was prepared.
ベレットと成形品(物性試験片)夫々の粘度平均分子j
1M、及び試験片の物性を第2表に示した。Viscosity average molecular j of each pellet and molded product (physical property test piece)
1M and the physical properties of the test pieces are shown in Table 2.
(以下余白)(Margin below)
Claims (1)
ト樹脂に他の熱可塑性樹脂を70重量%以下加えた樹脂
成分100重量部にアルミナ、鉄鋼スラグ、金属粉末及
び金属繊維よりなる群から選ばれた少なくとも一種の無
機充填剤1重量部以上及び該無機充填剤に対して0.1
〜10重量%になる量の有機酸を配合してなる熱可塑性
樹脂組成物。At least one kind of inorganic filler selected from the group consisting of alumina, steel slag, metal powder, and metal fiber is added to 100 parts by weight of the resin component, which is an aromatic polycarbonate resin or an aromatic polycarbonate resin with 70% by weight or less of other thermoplastic resin added. 0.1 to 1 part by weight or more of the agent and the inorganic filler
A thermoplastic resin composition containing an organic acid in an amount of ~10% by weight.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2033350A JP2774172B2 (en) | 1990-02-14 | 1990-02-14 | Thermoplastic resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2033350A JP2774172B2 (en) | 1990-02-14 | 1990-02-14 | Thermoplastic resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03237154A true JPH03237154A (en) | 1991-10-23 |
JP2774172B2 JP2774172B2 (en) | 1998-07-09 |
Family
ID=12384129
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2033350A Expired - Fee Related JP2774172B2 (en) | 1990-02-14 | 1990-02-14 | Thermoplastic resin composition |
Country Status (1)
Country | Link |
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JP (1) | JP2774172B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0639232A4 (en) * | 1992-05-04 | 1998-06-10 | Hoeganaes Corp | Iron-based powder compositions containing novel binder/lubricants. |
SG95682A1 (en) * | 2000-10-27 | 2003-04-23 | Sony Corp | Additive for resin, additive-containing resin, and method for producing the same |
WO2007001330A1 (en) * | 2005-06-16 | 2007-01-04 | General Electric Company (A New York Corporation) | Thermoplastic polycarbonate compositions with improved mechanical properties, articles made therefrom and method of manufacture |
JP2007077183A (en) * | 2005-09-12 | 2007-03-29 | Daicel Polymer Ltd | Cleaning agent resin composition for molding machine |
WO2007114990A1 (en) * | 2006-03-30 | 2007-10-11 | Sabic Innovative Plastics Ip B.V. | Thermoplastic polycarbonate compositions with improved mechanical properties, articles made therefrom and method of manufacture |
JP2021063239A (en) * | 2021-01-28 | 2021-04-22 | 大塚化学株式会社 | Polycarbonate resin composition and molding |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59157146A (en) * | 1983-02-26 | 1984-09-06 | Toyobo Co Ltd | Thermoplastic resin composition |
-
1990
- 1990-02-14 JP JP2033350A patent/JP2774172B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59157146A (en) * | 1983-02-26 | 1984-09-06 | Toyobo Co Ltd | Thermoplastic resin composition |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0639232A4 (en) * | 1992-05-04 | 1998-06-10 | Hoeganaes Corp | Iron-based powder compositions containing novel binder/lubricants. |
SG95682A1 (en) * | 2000-10-27 | 2003-04-23 | Sony Corp | Additive for resin, additive-containing resin, and method for producing the same |
US6720365B2 (en) | 2000-10-27 | 2004-04-13 | Sony Corporation | Additive for resin, additive-containing resin, and method for producing the same |
WO2007001330A1 (en) * | 2005-06-16 | 2007-01-04 | General Electric Company (A New York Corporation) | Thermoplastic polycarbonate compositions with improved mechanical properties, articles made therefrom and method of manufacture |
CN100379822C (en) * | 2005-06-16 | 2008-04-09 | 通用电气公司 | Thermoplastic polycarbonate compositions, articles made therefrom and method of manufacture |
JP2007077183A (en) * | 2005-09-12 | 2007-03-29 | Daicel Polymer Ltd | Cleaning agent resin composition for molding machine |
WO2007114990A1 (en) * | 2006-03-30 | 2007-10-11 | Sabic Innovative Plastics Ip B.V. | Thermoplastic polycarbonate compositions with improved mechanical properties, articles made therefrom and method of manufacture |
JP2021063239A (en) * | 2021-01-28 | 2021-04-22 | 大塚化学株式会社 | Polycarbonate resin composition and molding |
Also Published As
Publication number | Publication date |
---|---|
JP2774172B2 (en) | 1998-07-09 |
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